Heisener Electronics
BOM

DIP624-011BLF

Solder
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN IC DIP SOCKET 24POS GOLD

Specifications

Brand
Amphenol FCI
Package
—
Packaging
—
Weight
—

Total Inventory

5,472pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how DIP624-011BLF from Amphenol FCI fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerThrough Hole
SeriesBrass
Type-
Number of Positions or Pins (Grid)Solder
Pitch - MatingTin
Contact Finish - MatingAmphenol FCI
Contact Finish Thickness - MatingDIP, 0.6" (15.24mm) Row Spacing
Contact Material - Mating0.100" (2.54mm)
Mounting TypeOpen Frame
Features10µin (0.25µm)
TerminationPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Post200µin (5.08µm)
Contact Finish - Post-
Contact Finish Thickness - Post24 (2 x 12)
Contact Material - PostGold
Housing MaterialBeryllium Copper
Operating Temperature0.100" (2.54mm)

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