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Solder
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CONN IC DIP SOCKET 20POS TIN
Specifications
- Brand
- Amphenol FCI
- Package
- —
- Packaging
- —
- Weight
- —
Total Inventory
56,160pcs
Ship within 8 hours
MOQ: 1 pcs
Certifications & Authorizations
Product Video
Discover how DILB20P-223TLF from Amphenol FCI fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.
- Authentic sourcing with full traceability
- Rigorous incoming quality inspection
- Competitive pricing & global fast delivery
- Dedicated application engineering support
Technical Specifications
| Manufacturer | Through Hole | |
| Series | Copper Alloy | |
| Type | -55°C ~ 105°C | |
| Number of Positions or Pins (Grid) | Solder | |
| Pitch - Mating | Tin | |
| Contact Finish - Mating | Amphenol FCI | |
| Contact Finish Thickness - Mating | DIP, 0.3" (7.62mm) Row Spacing | |
| Contact Material - Mating | 0.100" (2.54mm) | |
| Mounting Type | Open Frame | |
| Features | 100µin (2.54µm) | |
| Termination | Polyamide (PA), Nylon | |
| Pitch - Post | 100µin (2.54µm) | |
| Contact Finish - Post | - | |
| Contact Finish Thickness - Post | 20 (2 x 10) | |
| Contact Material - Post | Tin | |
| Housing Material | Copper Alloy | |
| Operating Temperature | 0.100" (2.54mm) |
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