Heisener Electronics
BOM

D0818-01

Wire Wrap
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN IC DIP SOCKET 18POS GOLD

Specifications

Brand
Harwin Inc.
Package
—
Packaging
—
Weight
—

Total Inventory

4,662pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how D0818-01 from Harwin Inc. fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerThrough Hole
SeriesBrass
Type-55°C ~ 125°C
Number of Positions or Pins (Grid)Wire Wrap
Pitch - MatingTin
Contact Finish - MatingHarwin Inc.
Contact Finish Thickness - MatingDIP, 0.3" (7.62mm) Row Spacing
Contact Material - Mating0.100" (2.54mm)
Mounting TypeOpen Frame
Features10µin (0.25µm)
TerminationPolycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
Pitch - Post196.8µin (5.00µm)
Contact Finish - PostD0
Contact Finish Thickness - Post18 (2 x 9)
Contact Material - PostGold
Housing MaterialBeryllium Copper
Operating Temperature0.100" (2.54mm)

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