Heisener Electronics
BOM

BU180Z-178-HT

Solder
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN IC DIP SOCKET 18POS GOLD

Specifications

Brand
On Shore Technology Inc.
Package
—
Packaging
—
Weight
—

Total Inventory

6,138pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how BU180Z-178-HT from On Shore Technology Inc. fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerSurface Mount
SeriesBrass
Type-55°C ~ 125°C
Number of Positions or Pins (Grid)Solder
Pitch - MatingCopper
Contact Finish - MatingOn Shore Technology Inc.
Contact Finish Thickness - MatingDIP, 0.3" (7.62mm) Row Spacing
Contact Material - Mating0.100" (2.54mm)
Mounting TypeOpen Frame
Features78.7µin (2.00µm)
TerminationPolybutylene Terephthalate (PBT), Glass Filled
Pitch - PostFlash
Contact Finish - PostBU-178HT
Contact Finish Thickness - Post18 (2 x 9)
Contact Material - PostGold
Housing MaterialBeryllium Copper
Operating Temperature0.100" (2.54mm)

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