Heisener Electronics
BOM

BCM55524SD02

OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

BCM55524 CHIPSET

Specifications

Brand
Broadcom
Package
-
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how BCM55524SD02 from Broadcom fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerBroadcom
Series-
Architecture-
Core Processor-
Flash Size-
RAM Size-
Peripherals-
Connectivity-
Speed-
Primary Attributes-
Operating Temperature-
Package / Case-
Supplier Device Package-

Recommended Products

RWR71S1212FRS70

RWR71S1212FRS70

RES 12.1K OHM 2W 1% WW AXIAL

RCP1206B1K20GED

RCP1206B1K20GED

RES SMD 1.2K OHM 2% 2.4W 1206

SH330M200ST

SH330M200ST

CAP ALUM 33UF 20% 200V RADIAL

R1D12-3-315-R

R1D12-3-315-R

DC DC CONVERTER +/-15V 1W

MC100LVEL01DR2

MC100LVEL01DR2

IC GATE OR/NOR ECL 4INPUT 8-SOIC

TPS65100PWP

TPS65100PWP

IC REG CTRLR TFT 4OUT 24HTSSOP

DW-35-15-F-D-300

DW-35-15-F-D-300

.025" BOARD SPACERS

FW-20-03-LM-D-255-140-P-TR

FW-20-03-LM-D-255-140-P-TR

.050'' BOARD SPACERS

D38999-24MG41BC_64

D38999-24MG41BC_64

CONN RCPT HSG FMALE 41POS PNL MT

BLL1BSK18039XN

BLL1BSK18039XN

CONN BACKSHELL BAND SZ 18 SLVR