Heisener Electronics
BOM

BCM55045B1IFSBG

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10G XPON DPU CHIP

Specifications

Brand
Broadcom
Package
-
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how BCM55045B1IFSBG from Broadcom fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerBroadcom
Series-
Architecture-
Core Processor-
Flash Size-
RAM Size-
Peripherals-
Connectivity-
Speed-
Primary Attributes-
Operating Temperature-
Package / Case-
Supplier Device Package-

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