Heisener Electronics
BOM

APA600-FGG676

2.3V ~ 2.7V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC FPGA 454 I/O 676FBGA

Specifications

Brand
Microsemi
Package
676-BGA
Packaging
—
Weight
—

Total Inventory

292pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how APA600-FGG676 from Microsemi fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerMicrosemi Corporation
SeriesProASICPLUS
Number of LABs/CLBs-
Number of Logic Elements/Cells-
Total RAM Bits129024
Number of I/O454
Number of Gates600000
Voltage - Supply2.3V ~ 2.7V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 70°C (TA)
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)

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