Heisener Electronics
BOM

APA300-FGG256M

2.3V ~ 2.7V
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC FPGA 186 I/O 256FBGA

Specifications

Brand
Microsemi
Package
256-LBGA
Packaging
—
Weight
—

Total Inventory

320pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how APA300-FGG256M from Microsemi fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerMicrosemi Corporation
SeriesProASICPLUS
Number of LABs/CLBs-
Number of Logic Elements/Cells-
Total RAM Bits73728
Number of I/O186
Number of Gates300000
Voltage - Supply2.3V ~ 2.7V
Mounting TypeSurface Mount
Operating Temperature-55°C ~ 125°C (TC)
Package / Case256-LBGA
Supplier Device Package256-FPBGA (17x17)

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