Heisener Electronics
BOM

AGID023R18A2I2VB

OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC FPGA AGILEX-I 1805BGA

Specifications

Brand
Intel
Package
1805-BBGA Exposed Pad
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how AGID023R18A2I2VB from Intel fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerIntel
SeriesAgilex I
ArchitectureMPU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed1.4GHz
Primary AttributesFPGA - 2.3M Logic Elements
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1805-BBGA Exposed Pad
Supplier Device Package1805-BGA (42.5x42.5)

Recommended Products

SIT8208AI-8F-33E-32-110000T

SIT8208AI-8F-33E-32-110000T

MEMS OSC XO 32.1100MHZ LVCMOS LV

1206J0630822KAR

1206J0630822KAR

CAP CER 8200PF 63V C0G/NP0 1206

GA0603Y823MBJAR31G

GA0603Y823MBJAR31G

CAP CER 0.082UF 16V X7R 0603

JCK1512S05

JCK1512S05

DC DC CONVERTER 5V 15W

MIC5203-5-0BM5-TR

MIC5203-5-0BM5-TR

IC REG LINEAR 5V 80MA SOT23-5

T38231-08-0

T38231-08-0

CONN BARRIER STRIP 8CIRC 0.375"

382444-2

382444-2

CONN SOCKET SIP 8POS TIN-LEAD

BCS-149-L-D-PE-011

BCS-149-L-D-PE-011

BOX CONNECTOR SOCKET STRIP

ESQ-112-37-S-D-LL

ESQ-112-37-S-D-LL

ELEVATED SOCKET STRIPS

682-025-113R531

682-025-113R531

CONN D-SUB PLUG 25POS R/A SOLDER