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AGID019R18A1I2VB

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IC

Specifications

Brand
Intel
Package
1805-BBGA Exposed Pad
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how AGID019R18A1I2VB from Intel fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerIntel
SeriesAgilex I
ArchitectureMPU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed1.4GHz
Primary AttributesFPGA - 1.9M Logic Elements
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1805-BBGA Exposed Pad
Supplier Device Package1805-BGA (42.5x42.5)

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