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AGFC023R31C2E2VB

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IC FPGA AGILEX-F 3184BGA

Specifications

Brand
Intel
Package
3184-BFBGA Exposed Pad
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how AGFC023R31C2E2VB from Intel fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
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Technical Specifications

ManufacturerIntel
SeriesAgilex F
ArchitectureMPU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed1.4GHz
Primary AttributesFPGA - 2.3M Logic Elements
Operating Temperature0°C ~ 100°C (TJ)
Package / Case3184-BFBGA Exposed Pad
Supplier Device Package3184-BGA (56x45)

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