Heisener Electronics
BOM

48-6575-18

Solder
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN IC DIP SOCKET ZIF 48POS GLD

Specifications

Brand
Aries Electronics
Package
—
Packaging
—
Weight
—

Total Inventory

5,076pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how 48-6575-18 from Aries Electronics fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerThrough Hole
SeriesBeryllium Copper
Type-
Number of Positions or Pins (Grid)Solder
Pitch - MatingGold
Contact Finish - MatingAries Electronics
Contact Finish Thickness - MatingDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Contact Material - Mating0.100" (2.54mm)
Mounting TypeClosed Frame
Features10µin (0.25µm)
TerminationPolyphenylene Sulfide (PPS), Glass Filled
Pitch - Post10µin (0.25µm)
Contact Finish - Post57
Contact Finish Thickness - Post48 (2 x 24)
Contact Material - PostGold
Housing MaterialBeryllium Copper
Operating Temperature0.100" (2.54mm)

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