Heisener Electronics
BOM

400-028-050

-
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN IC DIP SOCKET 28POS GOLD

Specifications

Brand
3M
Package
—
Packaging
—
Weight
—

Total Inventory

4,518pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how 400-028-050 from 3M fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerThrough Hole
Series-
Type-
Number of Positions or Pins (Grid)-
Pitch - MatingGold
Contact Finish - Mating3M
Contact Finish Thickness - MatingDIP, 0.6" (15.24mm) Row Spacing
Contact Material - Mating0.100" (2.54mm)
Mounting TypeOpen Frame
Features8µin (0.20µm)
Termination-
Pitch - Post8µin (0.20µm)
Contact Finish - Post400
Contact Finish Thickness - Post28 (2 x 14)
Contact Material - PostGold
Housing Material-
Operating Temperature0.100" (2.54mm)

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