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CONN IC DIP SOCKET ZIF 32POS TIN
Specifications
- Brand
- Aries Electronics
- Package
- —
- Packaging
- —
- Weight
- —
Total Inventory
7,092pcs
Ship within 8 hours
MOQ: 1 pcs
Certifications & Authorizations
Product Video
Discover how 32-6575-18 from Aries Electronics fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.
- Authentic sourcing with full traceability
- Rigorous incoming quality inspection
- Competitive pricing & global fast delivery
- Dedicated application engineering support
Technical Specifications
| Manufacturer | Through Hole | |
| Series | Beryllium Copper | |
| Type | - | |
| Number of Positions or Pins (Grid) | Solder | |
| Pitch - Mating | Tin | |
| Contact Finish - Mating | Aries Electronics | |
| Contact Finish Thickness - Mating | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | |
| Contact Material - Mating | 0.100" (2.54mm) | |
| Mounting Type | Closed Frame | |
| Features | 200µin (5.08µm) | |
| Termination | Polyphenylene Sulfide (PPS), Glass Filled | |
| Pitch - Post | 200µin (5.08µm) | |
| Contact Finish - Post | 57 | |
| Contact Finish Thickness - Post | 32 (2 x 16) | |
| Contact Material - Post | Tin | |
| Housing Material | Beryllium Copper | |
| Operating Temperature | 0.100" (2.54mm) |
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