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Solder
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CONN IC DIP SOCKET 40POS GOLD
Specifications
- Brand
- TE Connectivity AMP Connectors
- Package
- —
- Packaging
- —
- Weight
- —
Total Inventory
3,366pcs
Ship within 8 hours
MOQ: 1 pcs
Certifications & Authorizations
Product Video
Discover how 2-641606-2 from TE Connectivity AMP Connectors fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.
- Authentic sourcing with full traceability
- Rigorous incoming quality inspection
- Competitive pricing & global fast delivery
- Dedicated application engineering support
Technical Specifications
| Manufacturer | Through Hole | |
| Series | Beryllium Copper | |
| Type | -55°C ~ 125°C | |
| Number of Positions or Pins (Grid) | Solder | |
| Pitch - Mating | Gold | |
| Contact Finish - Mating | TE Connectivity AMP Connectors | |
| Contact Finish Thickness - Mating | DIP, 0.6" (15.24mm) Row Spacing | |
| Contact Material - Mating | 0.100" (2.54mm) | |
| Mounting Type | Open Frame | |
| Features | 30µin (0.76µm) | |
| Termination | Thermoplastic, Glass Filled | |
| Pitch - Post | 30µin (0.76µm) | |
| Contact Finish - Post | Diplomate DL | |
| Contact Finish Thickness - Post | 40 (2 x 20) | |
| Contact Material - Post | Gold | |
| Housing Material | Beryllium Copper | |
| Operating Temperature | 0.100" (2.54mm) |
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