2-641605-2
Solder
原装正品全球货源快速交付品质认证技术支持批量优惠
CONN IC DIP SOCKET 28POS GOLD
规格参数
- 品牌
- TE Connectivity AMP Connectors
- 封装
- —
- 包装方式
- —
库存总量
5,940个
12小时发货
起订量：1 个
认证与授权
产品视频
了解 TE Connectivity AMP Connectors 的 2-641605-2 如何融入您的设计。我们的元件专家将介绍关键规格、品质认证及典型应用场景。
- 原厂采购，全程可追溯
- 严格的进料品质检验
- 具竞争力的价格 & 全球快速交货
- 专属应用工程技术支持
技术规格
| Manufacturer | Through Hole | |
| Series | Beryllium Copper | |
| Type | -55°C ~ 125°C | |
| Number of Positions or Pins (Grid) | Solder | |
| Pitch - Mating | Gold | |
| Contact Finish - Mating | TE Connectivity AMP Connectors | |
| Contact Finish Thickness - Mating | DIP, 0.6" (15.24mm) Row Spacing | |
| Contact Material - Mating | 0.100" (2.54mm) | |
| Mounting Type | Open Frame | |
| Features | 30µin (0.76µm) | |
| Termination | Thermoplastic, Glass Filled | |
| Pitch - Post | 30µin (0.76µm) | |
| Contact Finish - Post | Diplomate DL | |
| Contact Finish Thickness - Post | 28 (2 x 14) | |
| Contact Material - Post | Gold | |
| Housing Material | Beryllium Copper | |
| Operating Temperature | 0.100" (2.54mm) |
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