Heisener Electronics
BOM

1825375-2

Solder
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN IC DIP SOCKET 28POS GOLD

Specifications

Brand
TE Connectivity AMP Connectors
Package
—
Packaging
—
Weight
—

Total Inventory

8,892pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how 1825375-2 from TE Connectivity AMP Connectors fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerThrough Hole
SeriesPhosphor Bronze
Type-55°C ~ 125°C
Number of Positions or Pins (Grid)Solder
Pitch - MatingGold
Contact Finish - MatingTE Connectivity AMP Connectors
Contact Finish Thickness - MatingDIP, 0.6" (15.24mm) Row Spacing
Contact Material - Mating0.100" (2.54mm)
Mounting TypeClosed Frame
Features15µin (0.38µm)
TerminationThermoplastic, Glass Filled
Pitch - Post15µin (0.38µm)
Contact Finish - PostDiplomate DL
Contact Finish Thickness - Post28 (2 x 14)
Contact Material - PostGold
Housing MaterialPhosphor Bronze
Operating Temperature0.100" (2.54mm)

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