Heisener Electronics
BOM

100-032-050

Solder
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN IC DIP SOCKET 32POS GOLD

Specifications

Brand
3M
Package
—
Packaging
—
Weight
—

Total Inventory

2,214pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how 100-032-050 from 3M fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerThrough Hole
SeriesBrass
Type-65°C ~ 125°C
Number of Positions or Pins (Grid)Solder
Pitch - MatingGold
Contact Finish - Mating3M
Contact Finish Thickness - MatingDIP, 0.6" (15.24mm) Row Spacing
Contact Material - Mating0.100" (2.54mm)
Mounting TypeOpen Frame
Features8µin (0.20µm)
TerminationPolyphenylene Sulfide (PPS), Glass Filled
Pitch - PostFlash
Contact Finish - Post100
Contact Finish Thickness - Post32 (2 x 16)
Contact Material - PostGold
Housing MaterialBeryllium Copper
Operating Temperature0.100" (2.54mm)

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