Heisener Electronics
BOM

08-823-90C

Solder
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN IC DIP SOCKET 8POS GOLD

Specifications

Brand
Aries Electronics
Package
—
Packaging
—
Weight
—

Total Inventory

6,786pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how 08-823-90C from Aries Electronics fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerThrough Hole, Right Angle, Horizontal
SeriesBrass
Type-55°C ~ 105°C
Number of Positions or Pins (Grid)Solder
Pitch - MatingTin
Contact Finish - MatingAries Electronics
Contact Finish Thickness - MatingDIP, 0.3" (7.62mm) Row Spacing
Contact Material - Mating0.100" (2.54mm)
Mounting TypeClosed Frame
Features30µin (0.76µm)
TerminationPolyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Post200µin (5.08µm)
Contact Finish - PostVertisockets? 800
Contact Finish Thickness - Post8 (2 x 4)
Contact Material - PostGold
Housing MaterialBeryllium Copper
Operating Temperature0.100" (2.54mm)

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