Heisener Electronics
BOM

0475960233

Solder
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN SOCKET LGA 1155POS GOLD

Specifications

Brand
Molex
Package
—
Packaging
—
Weight
—

Total Inventory

7,452pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how 0475960233 from Molex fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerSurface Mount
Series-
Type-
Number of Positions or Pins (Grid)Solder
Pitch - Mating-
Contact Finish - MatingMolex
Contact Finish Thickness - MatingLGA
Contact Material - Mating0.036" (0.91mm)
Mounting TypeOpen Frame
Features30µin (0.76µm)
TerminationThermoplastic
Pitch - Post-
Contact Finish - Post47596
Contact Finish Thickness - Post1155 (40 x 40)
Contact Material - PostGold
Housing MaterialCopper Alloy
Operating Temperature0.036" (0.91mm)

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