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Solder
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CONN SOCKET LGA 1366POS GOLD
Specifications
- Brand
- Molex
- Package
- —
- Packaging
- —
- Weight
- —
Total Inventory
7,038pcs
Ship within 8 hours
MOQ: 1 pcs
Certifications & Authorizations
Product Video
Discover how 0475940002 from Molex fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.
- Authentic sourcing with full traceability
- Rigorous incoming quality inspection
- Competitive pricing & global fast delivery
- Dedicated application engineering support
Technical Specifications
| Manufacturer | Surface Mount | |
| Series | - | |
| Type | - | |
| Number of Positions or Pins (Grid) | Solder | |
| Pitch - Mating | - | |
| Contact Finish - Mating | Molex | |
| Contact Finish Thickness - Mating | LGA | |
| Contact Material - Mating | 0.040" (1.01mm) | |
| Mounting Type | Open Frame | |
| Features | 30µin (0.76µm) | |
| Termination | Liquid Crystal Polymer (LCP) | |
| Pitch - Post | - | |
| Contact Finish - Post | 47594 | |
| Contact Finish Thickness - Post | 1366 (32 x 41) | |
| Contact Material - Post | Gold | |
| Housing Material | Copper Alloy | |
| Operating Temperature | 0.040" (1.01mm) |
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