ON Semiconductor - Advanced audio-processing SoC delivers superior performance | Heisener Electronics
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ON Semiconductor - Advanced audio-processing SoC delivers superior performance

Technology Cover
Post Date: 2016-01-05, ON Semiconductor
ON Semiconductor has released its latest high-resolution audio processing system-on-chip (SoC) with 1656KB of SRAM and power-saving hardware acceleration that saves more space and extends battery life for devices such as smartphones, wearable accessories and recorders . Powering the LC823450 is an efficient ARM Cortex-M3 core and ON Semiconductor's 32-bit / 192kHz audio processing engine with hardware-based MP3 encoding / decoding and wireless audio support, which improves performance and energy efficiency. In addition, there are a large number of royalty-free and license-free DSP code examples to choose from, which helps speed up software design and minimize development costs. These features include advanced features such as noise cancellers and S-Live (low-frequency intelligent virtual excitation) for enhanced low-frequency playback. With its large amount of on-chip SRAM, the new LC823450 has enough memory for audio processing and application tasks without the need for a matching memory chip. Designers can also take advantage of a wealth of integrated audio peripherals such as analog / digital converters, phase-locked loops and Class D amplifiers. In addition, industry-standard interfaces (such as SPI, I2C, SDCard, and UART) enable product designers to establish universal connectivity. "High-resolution audio takes listening pleasure to the next level, and our new LC823450 provides a superior experience on mobile devices with best-in-class integration and energy efficiency," said Atsushi Bando, general manager of System Solutions Group ON Semiconductor . "The rich integration capabilities, hardware acceleration, and simple software terminology also make product developers' jobs easier by helping to manage development costs and minimizing time to market." Packaging and Pricing The lead-free LC823450 is packaged in a compact 5.52mm x 5.33mm WLP-154, which can reduce the footprint by up to 85% compared to competing solutions. The company also said that the device can also be used in the TQFP-128L.