页 289 - TE Connectivity Passive Product 产品 - 芯片电阻 - 表面安装

零件编号	制造商	描述	封装	库存	Tolerance	Power (Watts)	Composition	Features	Temperature Coefficient	Operating Temperature	Package / Case	Supplier Device Package	Size / Dimension	Height - Seated (Max)	Number of Terminations	Failure Rate
CRGV2010F178K	TE Connectivity Passive Product	RES SMD 178K OHM 1% 1/2W 2010 Resistance: 178 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存8,208	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F174K	TE Connectivity Passive Product	RES SMD 174K OHM 1% 1/2W 2010 Resistance: 174 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,094	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F169K	TE Connectivity Passive Product	RES SMD 169K OHM 1% 1/2W 2010 Resistance: 169 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存7,164	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F165K	TE Connectivity Passive Product	RES SMD 165K OHM 1% 1/2W 2010 Resistance: 165 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存7,236	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F162K	TE Connectivity Passive Product	RES SMD 162K OHM 1% 1/2W 2010 Resistance: 162 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,750	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F158K	TE Connectivity Passive Product	RES SMD 158K OHM 1% 1/2W 2010 Resistance: 158 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存3,978	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F154K	TE Connectivity Passive Product	RES SMD 154K OHM 1% 1/2W 2010 Resistance: 154 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,526	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F150K	TE Connectivity Passive Product	RES SMD 150K OHM 1% 1/2W 2010 Resistance: 150 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存7,092	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F147K	TE Connectivity Passive Product	RES SMD 147K OHM 1% 1/2W 2010 Resistance: 147 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存2,610	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F143K	TE Connectivity Passive Product	RES SMD 143K OHM 1% 1/2W 2010 Resistance: 143 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存3,348	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F140K	TE Connectivity Passive Product	RES SMD 140K OHM 1% 1/2W 2010 Resistance: 140 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,642	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F137K	TE Connectivity Passive Product	RES SMD 137K OHM 1% 1/2W 2010 Resistance: 137 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存3,834	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F133K	TE Connectivity Passive Product	RES SMD 133K OHM 1% 1/2W 2010 Resistance: 133 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存3,060	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F130K	TE Connectivity Passive Product	RES SMD 130K OHM 1% 1/2W 2010 Resistance: 130 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存2,232	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F127K	TE Connectivity Passive Product	RES SMD 127K OHM 1% 1/2W 2010 Resistance: 127 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,166	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F124K	TE Connectivity Passive Product	RES SMD 124K OHM 1% 1/2W 2010 Resistance: 124 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,570	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F121K	TE Connectivity Passive Product	RES SMD 121K OHM 1% 1/2W 2010 Resistance: 121 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,130	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F118K	TE Connectivity Passive Product	RES SMD 118K OHM 1% 1/2W 2010 Resistance: 118 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存2,088	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F115K	TE Connectivity Passive Product	RES SMD 115K OHM 1% 1/2W 2010 Resistance: 115 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,418	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F113K	TE Connectivity Passive Product	RES SMD 113K OHM 1% 1/2W 2010 Resistance: 113 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存8,856	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F110K	TE Connectivity Passive Product	RES SMD 110K OHM 1% 1/2W 2010 Resistance: 110 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存3,006	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F107K	TE Connectivity Passive Product	RES SMD 107K OHM 1% 1/2W 2010 Resistance: 107 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存8,244	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F105K	TE Connectivity Passive Product	RES SMD 105K OHM 1% 1/2W 2010 Resistance: 105 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,408	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F102K	TE Connectivity Passive Product	RES SMD 102K OHM 1% 1/2W 2010 Resistance: 102 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存2,916	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F100K	TE Connectivity Passive Product	RES SMD 100K OHM 1% 1/2W 2010 Resistance: 100 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存4,734	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F97K6	TE Connectivity Passive Product	RES SMD 97.6K OHM 1% 1/2W 2010 Resistance: 97.6 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存3,924	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F95K3	TE Connectivity Passive Product	RES SMD 95.3K OHM 1% 1/2W 2010 Resistance: 95.3 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存7,398	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F93K1	TE Connectivity Passive Product	RES SMD 93.1K OHM 1% 1/2W 2010 Resistance: 93.1 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存4,896	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F90K9	TE Connectivity Passive Product	RES SMD 90.9K OHM 1% 1/2W 2010 Resistance: 90.9 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,786	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGV2010F88K7	TE Connectivity Passive Product	RES SMD 88.7K OHM 1% 1/2W 2010 Resistance: 88.7 kOhms Tolerance: ±1% Power (Watts): 0.5W, 1/2W Composition: Thick Film Features: - Temperature Coefficient: ±200ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,238	±1%	0.5W, 1/2W	Thick Film	-	±200ppm/°C	-55°C ~ 125°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-

CRGV2010F178K

TE Connectivity Passive Product

RES SMD 178K OHM 1% 1/2W 2010

Resistance: 178 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存8,208

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F174K

TE Connectivity Passive Product

RES SMD 174K OHM 1% 1/2W 2010

Resistance: 174 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,094

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F169K

TE Connectivity Passive Product

RES SMD 169K OHM 1% 1/2W 2010

Resistance: 169 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存7,164

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F165K

TE Connectivity Passive Product

RES SMD 165K OHM 1% 1/2W 2010

Resistance: 165 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存7,236

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F162K

TE Connectivity Passive Product

RES SMD 162K OHM 1% 1/2W 2010

Resistance: 162 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,750

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F158K

TE Connectivity Passive Product

RES SMD 158K OHM 1% 1/2W 2010

Resistance: 158 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存3,978

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F154K

TE Connectivity Passive Product

RES SMD 154K OHM 1% 1/2W 2010

Resistance: 154 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,526

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F150K

TE Connectivity Passive Product

RES SMD 150K OHM 1% 1/2W 2010

Resistance: 150 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存7,092

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F147K

TE Connectivity Passive Product

RES SMD 147K OHM 1% 1/2W 2010

Resistance: 147 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存2,610

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F143K

TE Connectivity Passive Product

RES SMD 143K OHM 1% 1/2W 2010

Resistance: 143 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存3,348

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F140K

TE Connectivity Passive Product

RES SMD 140K OHM 1% 1/2W 2010

Resistance: 140 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,642

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F137K

TE Connectivity Passive Product

RES SMD 137K OHM 1% 1/2W 2010

Resistance: 137 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存3,834

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F133K

TE Connectivity Passive Product

RES SMD 133K OHM 1% 1/2W 2010

Resistance: 133 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存3,060

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F130K

TE Connectivity Passive Product

RES SMD 130K OHM 1% 1/2W 2010

Resistance: 130 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存2,232

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F127K

TE Connectivity Passive Product

RES SMD 127K OHM 1% 1/2W 2010

Resistance: 127 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,166

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F124K

TE Connectivity Passive Product

RES SMD 124K OHM 1% 1/2W 2010

Resistance: 124 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,570

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F121K

TE Connectivity Passive Product

RES SMD 121K OHM 1% 1/2W 2010

Resistance: 121 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,130

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F118K

TE Connectivity Passive Product

RES SMD 118K OHM 1% 1/2W 2010

Resistance: 118 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存2,088

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F115K

TE Connectivity Passive Product

RES SMD 115K OHM 1% 1/2W 2010

Resistance: 115 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,418

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F113K

TE Connectivity Passive Product

RES SMD 113K OHM 1% 1/2W 2010

Resistance: 113 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存8,856

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F110K

TE Connectivity Passive Product

RES SMD 110K OHM 1% 1/2W 2010

Resistance: 110 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存3,006

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F107K

TE Connectivity Passive Product

RES SMD 107K OHM 1% 1/2W 2010

Resistance: 107 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存8,244

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F105K

TE Connectivity Passive Product

RES SMD 105K OHM 1% 1/2W 2010

Resistance: 105 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,408

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F102K

TE Connectivity Passive Product

RES SMD 102K OHM 1% 1/2W 2010

Resistance: 102 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存2,916

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F100K

TE Connectivity Passive Product

RES SMD 100K OHM 1% 1/2W 2010

Resistance: 100 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存4,734

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F97K6

TE Connectivity Passive Product

RES SMD 97.6K OHM 1% 1/2W 2010

Resistance: 97.6 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存3,924

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F95K3

TE Connectivity Passive Product

RES SMD 95.3K OHM 1% 1/2W 2010

Resistance: 95.3 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存7,398

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F93K1

TE Connectivity Passive Product

RES SMD 93.1K OHM 1% 1/2W 2010

Resistance: 93.1 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存4,896

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F90K9

TE Connectivity Passive Product

RES SMD 90.9K OHM 1% 1/2W 2010

Resistance: 90.9 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,786

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGV2010F88K7

TE Connectivity Passive Product

RES SMD 88.7K OHM 1% 1/2W 2010

Resistance: 88.7 kOhms
Tolerance: ±1%
Power (Watts): 0.5W, 1/2W
Composition: Thick Film
Features: -
Temperature Coefficient: ±200ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,238

±1%

0.5W, 1/2W

Thick Film

-

±200ppm/°C

-55°C ~ 125°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-