页 258 - TE Connectivity Passive Product 产品 - 芯片电阻 - 表面安装

零件编号	制造商	描述	封装	库存	Tolerance	Power (Watts)	Composition	Features	Temperature Coefficient	Operating Temperature	Package / Case	Supplier Device Package	Size / Dimension	Height - Seated (Max)	Number of Terminations	Failure Rate
SMA0207JTEU8202	TE Connectivity Passive Product	RES SMD 82K OHM 5% 1/2W 0207 Resistance: 82 kOhms Tolerance: ±5% Power (Watts): 0.5W, 1/2W Composition: Thin Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: MELF, 0207 Supplier Device Package: 0207 Size / Dimension: 0.087" Dia x 0.232" L (2.20mm x 5.90mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: MELF, 0207	库存6,390	±5%	0.5W, 1/2W	Thin Film	-	±100ppm/°C	-55°C ~ 155°C	MELF, 0207	0207	0.087" Dia x 0.232" L (2.20mm x 5.90mm)	-	2	-
RLP73M1ER062JTD	TE Connectivity Passive Product	RES SMD 0.062 OHM 5% 1/8W 0402 Resistance: 62 mOhms Tolerance: ±5% Power (Watts): 0.125W, 1/8W Composition: Thick Film Features: Current Sense Temperature Coefficient: ±400ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 0402 (1005 Metric) Supplier Device Package: 0402 Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm) Height - Seated (Max): 0.017" (0.43mm) Number of Terminations: 2 Failure Rate: -	封装: 0402 (1005 Metric)	库存6,552	±5%	0.125W, 1/8W	Thick Film	Current Sense	±400ppm/°C	-55°C ~ 155°C	0402 (1005 Metric)	0402	0.039" L x 0.020" W (1.00mm x 0.50mm)	0.017" (0.43mm)	2	-
CRGH2010J10M	TE Connectivity Passive Product	RES SMD 10M OHM 5% 1W 2010 Resistance: 10 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,634	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J9M1	TE Connectivity Passive Product	RES SMD 9.1M OHM 5% 1W 2010 Resistance: 9.1 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,634	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J8M2	TE Connectivity Passive Product	RES SMD 8.2M OHM 5% 1W 2010 Resistance: 8.2 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存3,456	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J7M5	TE Connectivity Passive Product	RES SMD 7.5M OHM 5% 1W 2010 Resistance: 7.5 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,544	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J6M8	TE Connectivity Passive Product	RES SMD 6.8M OHM 5% 1W 2010 Resistance: 6.8 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,570	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J6M2	TE Connectivity Passive Product	RES SMD 6.2M OHM 5% 1W 2010 Resistance: 6.2 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存3,598	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J5M6	TE Connectivity Passive Product	RES SMD 5.6M OHM 5% 1W 2010 Resistance: 5.6 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存8,910	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J5M1	TE Connectivity Passive Product	RES SMD 5.1M OHM 5% 1W 2010 Resistance: 5.1 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存8,838	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J4M7	TE Connectivity Passive Product	RES SMD 4.7M OHM 5% 1W 2010 Resistance: 4.7 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,886	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J4M3	TE Connectivity Passive Product	RES SMD 4.3M OHM 5% 1W 2010 Resistance: 4.3 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存7,470	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J3M9	TE Connectivity Passive Product	RES SMD 3.9M OHM 5% 1W 2010 Resistance: 3.9 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存3,472	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J3M6	TE Connectivity Passive Product	RES SMD 3.6M OHM 5% 1W 2010 Resistance: 3.6 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存8,658	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J3M3	TE Connectivity Passive Product	RES SMD 3.3M OHM 5% 1W 2010 Resistance: 3.3 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,462	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J3M0	TE Connectivity Passive Product	RES SMD 3M OHM 5% 1W 2010 Resistance: 3 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存3,906	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J2M7	TE Connectivity Passive Product	RES SMD 2.7M OHM 5% 1W 2010 Resistance: 2.7 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,516	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J2M4	TE Connectivity Passive Product	RES SMD 2.4M OHM 5% 1W 2010 Resistance: 2.4 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存8,118	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J2M2	TE Connectivity Passive Product	RES SMD 2.2M OHM 5% 1W 2010 Resistance: 2.2 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,310	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J2M0	TE Connectivity Passive Product	RES SMD 2M OHM 5% 1W 2010 Resistance: 2 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,246	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J1M8	TE Connectivity Passive Product	RES SMD 1.8M OHM 5% 1W 2010 Resistance: 1.8 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存4,302	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J1M6	TE Connectivity Passive Product	RES SMD 1.6M OHM 5% 1W 2010 Resistance: 1.6 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,228	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J1M5	TE Connectivity Passive Product	RES SMD 1.5M OHM 5% 1W 2010 Resistance: 1.5 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存3,096	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J1M3	TE Connectivity Passive Product	RES SMD 1.3M OHM 5% 1W 2010 Resistance: 1.3 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存4,986	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J1M2	TE Connectivity Passive Product	RES SMD 1.2M OHM 5% 1W 2010 Resistance: 1.2 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存7,236	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J1M1	TE Connectivity Passive Product	RES SMD 1.1M OHM 5% 1W 2010 Resistance: 1.1 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,930	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J1M0	TE Connectivity Passive Product	RES SMD 1M OHM 5% 1W 2010 Resistance: 1 MOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存6,714	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J910K	TE Connectivity Passive Product	RES SMD 910K OHM 5% 1W 2010 Resistance: 910 kOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,904	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J820K	TE Connectivity Passive Product	RES SMD 820K OHM 5% 1W 2010 Resistance: 820 kOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存5,004	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-
CRGH2010J750K	TE Connectivity Passive Product	RES SMD 750K OHM 5% 1W 2010 Resistance: 750 kOhms Tolerance: ±5% Power (Watts): 1W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 2010 (5025 Metric) Supplier Device Package: 2010 Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Height - Seated (Max): - Number of Terminations: 2 Failure Rate: -	封装: 2010 (5025 Metric)	库存7,938	±5%	1W	Thick Film	-	±100ppm/°C	-55°C ~ 155°C	2010 (5025 Metric)	2010	0.197" L x 0.098" W (5.00mm x 2.50mm)	-	2	-

SMA0207JTEU8202

TE Connectivity Passive Product

RES SMD 82K OHM 5% 1/2W 0207

Resistance: 82 kOhms
Tolerance: ±5%
Power (Watts): 0.5W, 1/2W
Composition: Thin Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: MELF, 0207
Supplier Device Package: 0207
Size / Dimension: 0.087" Dia x 0.232" L (2.20mm x 5.90mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: MELF, 0207

库存6,390

±5%

0.5W, 1/2W

Thin Film

-

±100ppm/°C

-55°C ~ 155°C

MELF, 0207

0207

0.087" Dia x 0.232" L (2.20mm x 5.90mm)

-

2

-

RLP73M1ER062JTD

TE Connectivity Passive Product

RES SMD 0.062 OHM 5% 1/8W 0402

Resistance: 62 mOhms
Tolerance: ±5%
Power (Watts): 0.125W, 1/8W
Composition: Thick Film
Features: Current Sense
Temperature Coefficient: ±400ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 0402 (1005 Metric)
Supplier Device Package: 0402
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Height - Seated (Max): 0.017" (0.43mm)
Number of Terminations: 2
Failure Rate: -

封装: 0402 (1005 Metric)

库存6,552

±5%

0.125W, 1/8W

Thick Film

Current Sense

±400ppm/°C

-55°C ~ 155°C

0402 (1005 Metric)

0402

0.039" L x 0.020" W (1.00mm x 0.50mm)

0.017" (0.43mm)

2

-

CRGH2010J10M

TE Connectivity Passive Product

RES SMD 10M OHM 5% 1W 2010

Resistance: 10 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,634

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J9M1

TE Connectivity Passive Product

RES SMD 9.1M OHM 5% 1W 2010

Resistance: 9.1 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,634

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J8M2

TE Connectivity Passive Product

RES SMD 8.2M OHM 5% 1W 2010

Resistance: 8.2 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存3,456

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J7M5

TE Connectivity Passive Product

RES SMD 7.5M OHM 5% 1W 2010

Resistance: 7.5 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,544

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J6M8

TE Connectivity Passive Product

RES SMD 6.8M OHM 5% 1W 2010

Resistance: 6.8 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,570

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J6M2

TE Connectivity Passive Product

RES SMD 6.2M OHM 5% 1W 2010

Resistance: 6.2 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存3,598

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J5M6

TE Connectivity Passive Product

RES SMD 5.6M OHM 5% 1W 2010

Resistance: 5.6 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存8,910

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J5M1

TE Connectivity Passive Product

RES SMD 5.1M OHM 5% 1W 2010

Resistance: 5.1 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存8,838

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J4M7

TE Connectivity Passive Product

RES SMD 4.7M OHM 5% 1W 2010

Resistance: 4.7 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,886

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J4M3

TE Connectivity Passive Product

RES SMD 4.3M OHM 5% 1W 2010

Resistance: 4.3 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存7,470

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J3M9

TE Connectivity Passive Product

RES SMD 3.9M OHM 5% 1W 2010

Resistance: 3.9 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存3,472

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J3M6

TE Connectivity Passive Product

RES SMD 3.6M OHM 5% 1W 2010

Resistance: 3.6 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存8,658

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J3M3

TE Connectivity Passive Product

RES SMD 3.3M OHM 5% 1W 2010

Resistance: 3.3 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,462

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J3M0

TE Connectivity Passive Product

RES SMD 3M OHM 5% 1W 2010

Resistance: 3 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存3,906

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J2M7

TE Connectivity Passive Product

RES SMD 2.7M OHM 5% 1W 2010

Resistance: 2.7 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,516

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J2M4

TE Connectivity Passive Product

RES SMD 2.4M OHM 5% 1W 2010

Resistance: 2.4 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存8,118

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J2M2

TE Connectivity Passive Product

RES SMD 2.2M OHM 5% 1W 2010

Resistance: 2.2 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,310

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J2M0

TE Connectivity Passive Product

RES SMD 2M OHM 5% 1W 2010

Resistance: 2 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,246

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J1M8

TE Connectivity Passive Product

RES SMD 1.8M OHM 5% 1W 2010

Resistance: 1.8 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存4,302

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J1M6

TE Connectivity Passive Product

RES SMD 1.6M OHM 5% 1W 2010

Resistance: 1.6 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,228

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J1M5

TE Connectivity Passive Product

RES SMD 1.5M OHM 5% 1W 2010

Resistance: 1.5 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存3,096

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J1M3

TE Connectivity Passive Product

RES SMD 1.3M OHM 5% 1W 2010

Resistance: 1.3 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存4,986

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J1M2

TE Connectivity Passive Product

RES SMD 1.2M OHM 5% 1W 2010

Resistance: 1.2 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存7,236

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J1M1

TE Connectivity Passive Product

RES SMD 1.1M OHM 5% 1W 2010

Resistance: 1.1 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,930

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J1M0

TE Connectivity Passive Product

RES SMD 1M OHM 5% 1W 2010

Resistance: 1 MOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存6,714

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J910K

TE Connectivity Passive Product

RES SMD 910K OHM 5% 1W 2010

Resistance: 910 kOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,904

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J820K

TE Connectivity Passive Product

RES SMD 820K OHM 5% 1W 2010

Resistance: 820 kOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存5,004

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-

CRGH2010J750K

TE Connectivity Passive Product

RES SMD 750K OHM 5% 1W 2010

Resistance: 750 kOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 2010 (5025 Metric)
Supplier Device Package: 2010
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Height - Seated (Max): -
Number of Terminations: 2
Failure Rate: -

封装: 2010 (5025 Metric)

库存7,938

±5%

1W

Thick Film

-

±100ppm/°C

-55°C ~ 155°C

2010 (5025 Metric)

2010

0.197" L x 0.098" W (5.00mm x 2.50mm)

-

2

-