Rohm Semiconductor 产品

SP8M5TB

Rohm Semiconductor

MOSFET N/P-CH 30V 6A/7A 8SOIC

• FET Type: N and P-Channel
• FET Feature: Logic Level Gate
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 6A, 7A
• Rds On (Max) @ Id, Vgs: 30 mOhm @ 6A, 10V
• Vgs(th) (Max) @ Id: 2.5V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 7.2nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 520pF @ 10V
• Power - Max: 2W
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOP

封装: 8-SOIC (0.154", 3.90mm Width)

2SB1308T100Q

Rohm Semiconductor

TRANS PNP 20V 3A SOT-89

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 3A
• Voltage - Collector Emitter Breakdown (Max): 20V
• Vce Saturation (Max) @ Ib, Ic: 450mV @ 150mA, 1.5A
• Current - Collector Cutoff (Max): 500nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 500mA, 2V
• Power - Max: 2W
• Frequency - Transition: 120MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-243AA
• Supplier Device Package: MPT3

封装: TO-243AA

BD9887FS-E2

Rohm Semiconductor

IC INVERTER CTRL DC-AC 32-SSOP

• Applications: Inverter Controller
• Current - Supply: 13µA
• Voltage - Supply: 6.5 V ~ 30 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-SOP (0.213", 5.40mm Width)
• Supplier Device Package: 32-SSOPA

封装: 32-SOP (0.213", 5.40mm Width)

BD14000EFV-CE2

Rohm Semiconductor

IC LSI CELL BALANCE 30HTSSOP

• Applications: Capacitor Bank Balancer
• Current - Supply: 40µA
• Voltage - Supply: 8 V ~ 24 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 30-VSSOP (0.220", 5.60mm Width) Exposed Pad
• Supplier Device Package: 30-HTSSOP-B

封装: 30-VSSOP (0.220", 5.60mm Width) Exposed Pad

BA5954FM-E2

Rohm Semiconductor

IC BRIDGE DRIVER PAR 28HSOP

• Output Configuration: Half Bridge (8)
• Applications: DC Motors, General Purpose
• Interface: Logic
• Load Type: Inductive
• Technology: Bipolar
• Rds On (Typ): -
• Current - Output / Channel: -
• Current - Peak Output: -
• Voltage - Supply: 4.3 V ~ 13.2 V
• Voltage - Load: 9V
• Operating Temperature: -35°C ~ 85°C (TA)
• Features: -
• Fault Protection: Over Temperature
• Mounting Type: Surface Mount
• Package / Case: 28-SOP (0.295", 7.50mm Width) + 2 Heat Tabs
• Supplier Device Package: 28-HSOP-M

封装: 28-SOP (0.295", 7.50mm Width) + 2 Heat Tabs

BA2901FV-E2

Rohm Semiconductor

IC COMPARATOR QUAD 0.8MA SSOP14

• Type: General Purpose
• Number of Elements: 4
• Output Type: Open Collector
• Voltage - Supply, Single/Dual (±): 2 V ~ 36 V, ±1 V ~ 18 V
• Voltage - Input Offset (Max): 7mV @ 5V
• Current - Input Bias (Max): 0.25µA @ 5V
• Current - Output (Typ): 16mA @ 5V
• Current - Quiescent (Max): 2mA
• CMRR, PSRR (Typ): -
• Propagation Delay (Max): -
• Hysteresis: -
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 14-LSSOP (0.173", 4.40mm Width)
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SSOP

封装: 14-LSSOP (0.173", 4.40mm Width)

RSB16X3NTR

Rohm Semiconductor

TVS DIODE 12VWM UMD6

• Type: Zener
• Unidirectional Channels: -
• Bidirectional Channels: 3
• Voltage - Reverse Standoff (Typ): 12V
• Voltage - Breakdown (Min): 14.4V
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: -
• Power Line Protection: No
• Applications: General Purpose
• Capacitance @ Frequency: 30pF @ 1MHz
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: UMD6

封装: 6-TSSOP, SC-88, SOT-363

RSB12JS2T2R

Rohm Semiconductor

TVS DIODE 9VWM EMD6

• Type: Zener
• Unidirectional Channels: -
• Bidirectional Channels: 2
• Voltage - Reverse Standoff (Typ): 9V
• Voltage - Breakdown (Min): 9.6V
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: -
• Power Line Protection: No
• Applications: General Purpose
• Capacitance @ Frequency: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: SOT-563, SOT-666
• Supplier Device Package: EMD6

封装: SOT-563, SOT-666

MNR14ERAPJ911

Rohm Semiconductor

RES ARRAY 4 RES 910 OHM 1206

• Circuit Type: Isolated
• Resistance (Ohms): 910
• Tolerance: ±5%
• Number of Resistors: 4
• Number of Pins: 8
• Power Per Element: 62.5mW
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 1206 (3216 Metric), Convex, Long Side Terminals
• Supplier Device Package: -
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Height - Seated (Max): 0.024" (0.60mm)

封装: 1206 (3216 Metric), Convex, Long Side Terminals

MCR18EZPF2263

Rohm Semiconductor

RES SMD 226K OHM 1% 1/4W 1206

• Resistance: 226 kOhms
• Tolerance: ±1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thick Film
• Features: Automotive AEC-Q200
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

MCR10EZHFL4R32

Rohm Semiconductor

RES SMD 4.32 OHM 1% 1/4W 0805

• Resistance: 4.32 Ohms
• Tolerance: ±1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thick Film
• Features: Automotive AEC-Q200
• Temperature Coefficient: ±250ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

MCR006YZPJ914

Rohm Semiconductor

RES SMD 910K OHM 5% 1/20W 0201

• Resistance: 910 kOhms
• Tolerance: ±5%
• Power (Watts): 0.05W, 1/20W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±250ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0201 (0603 Metric)
• Supplier Device Package: 0201
• Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
• Height - Seated (Max): 0.010" (0.26mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0201 (0603 Metric)

MCR03EZPJ365

Rohm Semiconductor

RES SMD 3.6M OHM 5% 1/10W 0603

• Resistance: 3.6 MOhms
• Tolerance: ±5%
• Power (Watts): 0.1W, 1/10W
• Composition: Thick Film
• Features: Automotive AEC-Q200
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

TRR10EZPJ150

Rohm Semiconductor

RES SMD 15 OHM 5% 1/8W 0805

• Resistance: 15 Ohms
• Tolerance: ±5%
• Power (Watts): 0.125W, 1/8W
• Composition: Thick Film
• Features: Anti-Sulfur
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

ESR10EZPF78R7

Rohm Semiconductor

RES SMD 78.7 OHM 1% 0.4W 0805

• Resistance: 78.7 Ohms
• Tolerance: ±1%
• Power (Watts): 0.4W
• Composition: Thick Film
• Features: Automotive AEC-Q200, Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

ESR10EZPF6492

Rohm Semiconductor

RES SMD 64.9K OHM 1% 0.4W 0805

• Resistance: 64.9 kOhms
• Tolerance: ±1%
• Power (Watts): 0.4W
• Composition: Thick Film
• Features: Automotive AEC-Q200, Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

ESR18EZPF1243

Rohm Semiconductor

RES SMD 124K OHM 1% 1/3W 1206

• Resistance: 124 kOhms
• Tolerance: ±1%
• Power (Watts): 0.333W, 1/3W
• Composition: Thick Film
• Features: Automotive AEC-Q200, Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

MCR18ERTJ1R1

Rohm Semiconductor

RES SMD 1.1 OHM 5% 1/4W 1206

• Resistance: 1.1 Ohms
• Tolerance: ±5%
• Power (Watts): 0.25W, 1/4W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±400ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 1206 (3216 Metric)

MCR10ERTF6490

Rohm Semiconductor

RES SMD 649 OHM 1% 1/8W 0805

• Resistance: 649 Ohms
• Tolerance: ±1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

UCR03EWPFSR022

Rohm Semiconductor

RES SMD 0.022 OHM 1% 1/4W 0603

• Resistance: 22 mOhms
• Tolerance: ±1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: 0/ +250ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.034" W (1.60mm x 0.87mm)
• Height - Seated (Max): 0.024" (0.60mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

TRR10EZPF1002

Rohm Semiconductor

RES SMD 10K OHM 1% 1/8W 0805

• Resistance: 10 kOhms
• Tolerance: ±1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thick Film
• Features: Anti-Sulfur
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

MCR50JZHF71R5

Rohm Semiconductor

RES SMD 71.5 OHM 1% 1/2W 2010

• Resistance: 71.5 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: Automotive AEC-Q200
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 2010 (5025 Metric)

ESR10EZPJ111

Rohm Semiconductor

RES SMD 110 OHM 5% 0.4W 0805

• Resistance: 110 Ohms
• Tolerance: ±5%
• Power (Watts): 0.4W
• Composition: Thick Film
• Features: Automotive AEC-Q200, Pulse Withstanding
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0805 (2012 Metric)

TRR03EZPF6811

Rohm Semiconductor

RES SMD 6.81K OHM 1% 1/10W 0603

• Resistance: 6.81 kOhms
• Tolerance: ±1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thick Film
• Features: Anti-Sulfur
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封装: 0603 (1608 Metric)

BR93H86RFVT-2CE2

Rohm Semiconductor

AUTOMOTIVE MICROWIRE BUS 16KBIT(

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 16Kb (1K x 16)
• Memory Interface: SPI
• Clock Frequency: 2MHz
• Write Cycle Time - Word, Page: 4ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP-B

封装: 8-TSSOP (0.173", 4.40mm Width)

RB160SS-30T2R

Rohm Semiconductor

DIODE SCHOTTKY 30V 1A KMD2

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 30 V
• Current - Average Rectified (Io): 1A
• Voltage - Forward (Vf) (Max) @ If: 520 mV @ 1 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 35 µA @ 30 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: KMD2
• Operating Temperature - Junction: 150°C

封装: -

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BSM600D12P3G001

Rohm Semiconductor

SIC 2N-CH 1200V 600A MODULE

• FET Type: Silicon Carbide (SiC)
• FET Feature: -
• Drain to Source Voltage (Vdss): 1200V (1.2kV)
• Current - Continuous Drain (Id) @ 25°C: 600A (Tc)
• Rds On (Max) @ Id, Vgs: -
• Vgs(th) (Max) @ Id: 5.6V @ 182mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 31000pF @ 10V
• Power - Max: 2450W (Tc)
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Chassis Mount
• Package / Case: Module
• Supplier Device Package: Module

封装: -

RFN20NS3STL

Rohm Semiconductor

DIODE GEN PURP 350V 20A LPDS

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 350 V
• Current - Average Rectified (Io): 20A
• Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 20 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 35 ns
• Current - Reverse Leakage @ Vr: 10 µA @ 350 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
• Supplier Device Package: LPDS
• Operating Temperature - Junction: 150°C

封装: -

ML62Q1323-NNNMBZ0ATL

Rohm Semiconductor

IC MCU 16BIT 16KB FLASH 16SSOP

• Core Processor: nX-U16/100
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: I2C, SSP, UART/USART
• Peripherals: POR, LED, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.6V ~ 5.5V
• Data Converters: A/D 6x10b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-SSOP

封装: -

RS3E130ATTB1

Rohm Semiconductor

PCH -30V -13A POWER MOSFET : RS3

• FET Type: P-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30 V
• Current - Continuous Drain (Id) @ 25°C: 13A (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2.5V @ 2mA
• Gate Charge (Qg) (Max) @ Vgs: 83 nC @ 10 V
• Input Capacitance (Ciss) (Max) @ Vds: 3730 pF @ 15 V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 1.4W (Ta)
• Rds On (Max) @ Id, Vgs: 8.5mOhm @ 13A, 10V
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: 8-SOP
• Package / Case: 8-SOIC (0.154", 3.90mm Width)

封装: -