页 789 - NXP 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
MRF8S21120HR3	NXP	FET RF 65V 2.17GHZ NI780H Transistor Type: LDMOS Frequency: 2.17GHz Gain: 17.6dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 850mA Power - Output: 28W Voltage - Rated: 65V Package / Case: NI-780 Supplier Device Package: NI-780	封装: NI-780	库存3,248
BZX284-C39,115	NXP	DIODE ZENER 39V 400MW SOD2 Voltage - Zener (Nom) (Vz): 39V Tolerance: ±5% Power - Max: 400mW Impedance (Max) (Zzt): 75 Ohms Current - Reverse Leakage @ Vr: 50nA @ 27.3V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	封装: SOD-110	库存6,656
MC33910BAC	NXP	IC SYSTEM BASIS CHIP 32LQFP Applications: System Basis Chip Current - Supply: 4.5mA Voltage - Supply: 5.5 V ~ 27 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封装: 32-LQFP	库存4,976
N74F258AD,623	NXP	IC DATA SELECTOR/MUX 16-SOIC Type: Multiplexer Circuit: 4 x 2:1 Independent Circuits: 1 Current - Output High, Low: 3mA, 24mA Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封装: 16-SOIC (0.154", 3.90mm Width)	库存2,736
74HC147D,653	NXP	IC 10:4 LINE PRIORITY ENC 16SOIC Type: Priority Encoder Circuit: 1 x 10:4 Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封装: 16-SOIC (0.154", 3.90mm Width)	库存3,712
SC26C92A1B,557	NXP	IC UART DUAL W/FIFO 44QFP Features: Configurable GPIO, Internal Oscillator, Timer/Counter Number of Channels: 2, DUART FIFO's: 8 Byte Protocol: - Data Rate (Max): 1Mbps Voltage - Supply: 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 44-QFP Supplier Device Package: 44-PQFP (10x10)	封装: 44-QFP	库存5,504
MC33889DWR2	NXP	IC SYSTEM BASE W/CAN 28-SOIC Applications: Automotive Interface: CAN Voltage - Supply: 5.5 V ~ 18 V Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC Mounting Type: Surface Mount	封装: 28-SOIC (0.295", 7.50mm Width)	库存6,160
MC33662BLEF	NXP	IC TXRX LIN 2.1 10KBPS 8SOIC Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: - Data Rate: 20kbps Voltage - Supply: 7 V ~ 18 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	封装: 8-SOIC (0.154", 3.90mm Width)	库存7,488
MC8640DTVU1000NC	NXP	IC MPU MPC86XX 1.0GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	封装: 994-BCBGA, FCCBGA	库存4,048
P1014NXN5DFB	NXP	IC MPU Q OR IQ 800MHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	封装: 425-FBGA	库存6,096
S9S12P64J0MFT	NXP	IC MCU 16BIT 64KB FLASH 48QFN Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	封装: 48-VFQFN Exposed Pad	库存15,600
MC9RS08KA8CPJ	NXP	IC MCU 8BIT 8KB FLASH 20DIP Core Processor: RS08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C Peripherals: LVD, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 254 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	封装: 20-DIP (0.300", 7.62mm)	库存6,432
LPC43S67JET256E	NXP	IC MCU 32BIT 1MB FLASH 256LBGA Core Processor: ARM? Cortex?-M4/M0 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 164 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 154K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 16x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-LBGA (17x17)	封装: 256-LBGA	库存5,888
MC9S08FL8CBM	NXP	IC MCU 8BIT 8KB FLASH 32SDIP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: SCI Peripherals: LVD, PWM, WDT Number of I/O: 30 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 12x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-SDIP (0.400", 10.16mm) Supplier Device Package: 32-SDIP	封装: 32-SDIP (0.400", 10.16mm)	库存13,536
MKL25Z128VLK4	NXP	IC MCU 32BIT 128KB FLASH 80LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 14x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	封装: 80-LQFP	库存12,084
TDA8444T/N4,518	NXP	IC OCTUPLE DAC 6BIT 12V 16-SOIC Number of Bits: 6 Number of D/A Converters: 6 Settling Time: - Output Type: Voltage - Buffered Differential Output: No Data Interface: I2C Reference Type: External Voltage - Supply, Analog: 4.5 V ~ 13.2 V Voltage - Supply, Digital: 4.5 V ~ 13.2 V INL/DNL (LSB): ±0.5 (Max), ±0.5 (Max) Architecture: - Operating Temperature: -20°C ~ 70°C Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO Mounting Type: -	封装: 16-SOIC (0.295", 7.50mm Width)	库存6,304
FSA95601VAHR2	NXP	IC AMP 6CH CLASS D DGTL Function: - Applications: - Number of Channels: - Interface: - Voltage - Supply: - Operating Temperature: - Specifications: - Package / Case: - Supplier Device Package: -	封装: -	库存2,448
SL3S1213FUD/BG,003	NXP	IC U-CODE G2IL+ DIE WAFER Type: RFID Transponder Frequency: 840MHz ~ 960MHz Standards: EPC Interface: - Voltage - Supply: 1.8V Operating Temperature: -40°C ~ 85°C Package / Case: Die Supplier Device Package: Wafer	封装: Die	库存7,308
MWE6IC9100NR1	NXP	IC PWR AMP RF LDMOS TO270-14 Frequency: 960MHz P1dB: - Gain: 33.5dB Noise Figure: - RF Type: GSM, EDGE Voltage - Supply: 28V Current - Supply: - Test Frequency: - Package / Case: TO-270-14 Variant, Flat Leads Supplier Device Package: TO-270 WB-14	封装: TO-270-14 Variant, Flat Leads	库存5,238
MC33FS6512LAE	NXP	SYSTEM BASIS CHIP DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP Exposed Pad	库存5,920
LPC54606J256BD100E	NXP	32-BIT ARM CORTEX-M4 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封装: 100-LQFP	库存6,360
S9S12G48F0WLFR	NXP	16-BIT MCU S12 CORE 48KB FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP	库存5,568
S9S08RNA8W2VTGR	NXP	8-BIT MCU S08 CORE 8KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封装: 16-TSSOP (0.173", 4.40mm Width)	库存6,080
TDF8590TH-N1T-S23J	NXP	IC AMPLIFIER CLASS D Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 160W x 1 @ 8Ohm; 80W x 2 @ 4Ohm Voltage - Supply: ±14V ~ 29V Features: - Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 24-HSOP Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad	封装: -	Request a Quote
TJA1128BTK-1Z	NXP	LIN MINI SYSTEM BASIS CHIP WITH Applications: System Basis Chip Interface: SPI Voltage - Supply: 3V ~ 28V Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5) Mounting Type: Surface Mount	封装: -	库存18,000
FC32K146HFT0VLLT	NXP	S32K144 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
MPF5200AMBA0ESR2	NXP	POWER MANAGEMENT IC, PRE-PROG, 2 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-PowerWFQFN Supplier Device Package: 32-HWQFN (5x5)	封装: -	Request a Quote
MIMXRT106SDVL6B	NXP	IC MCU 32BIT EXT MEM 196MAPBGA Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 600MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Number of I/O: 127 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 20x12b Oscillator Type: External, Internal Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-MAPBGA (10x10)	封装: -	库存618
MFS2300BMBA0EP	NXP	IC Applications: System Basis Chip Current - Supply: 40µA Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	封装: -	库存780
MFS2632AMDA0AD	NXP	AUTO SBC Applications: - Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	封装: -	Request a Quote

MRF8S21120HR3

NXP

FET RF 65V 2.17GHZ NI780H

Transistor Type: LDMOS
Frequency: 2.17GHz
Gain: 17.6dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 850mA
Power - Output: 28W
Voltage - Rated: 65V
Package / Case: NI-780
Supplier Device Package: NI-780

封装: NI-780

库存3,248

BZX284-C39,115

NXP

DIODE ZENER 39V 400MW SOD2

Voltage - Zener (Nom) (Vz): 39V
Tolerance: ±5%
Power - Max: 400mW
Impedance (Max) (Zzt): 75 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 27.3V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

封装: SOD-110

库存6,656

MC33910BAC

NXP

IC SYSTEM BASIS CHIP 32LQFP

Applications: System Basis Chip
Current - Supply: 4.5mA
Voltage - Supply: 5.5 V ~ 27 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

库存4,976

N74F258AD,623

NXP

IC DATA SELECTOR/MUX 16-SOIC

Type: Multiplexer
Circuit: 4 x 2:1
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封装: 16-SOIC (0.154", 3.90mm Width)

库存2,736

74HC147D,653

NXP

IC 10:4 LINE PRIORITY ENC 16SOIC

Type: Priority Encoder
Circuit: 1 x 10:4
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封装: 16-SOIC (0.154", 3.90mm Width)

库存3,712

SC26C92A1B,557

NXP

IC UART DUAL W/FIFO 44QFP

Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Number of Channels: 2, DUART
FIFO's: 8 Byte
Protocol: -
Data Rate (Max): 1Mbps
Voltage - Supply: 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 44-QFP
Supplier Device Package: 44-PQFP (10x10)

封装: 44-QFP

库存5,504

MC33889DWR2

NXP

IC SYSTEM BASE W/CAN 28-SOIC

Applications: Automotive
Interface: CAN
Voltage - Supply: 5.5 V ~ 18 V
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC
Mounting Type: Surface Mount

封装: 28-SOIC (0.295", 7.50mm Width)

库存6,160

MC33662BLEF

NXP

IC TXRX LIN 2.1 10KBPS 8SOIC

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: -
Data Rate: 20kbps
Voltage - Supply: 7 V ~ 18 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

库存7,488

MC8640DTVU1000NC

NXP

IC MPU MPC86XX 1.0GHZ 994FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

封装: 994-BCBGA, FCCBGA

库存4,048

P1014NXN5DFB

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA I (19x19)

封装: 425-FBGA

库存6,096

S9S12P64J0MFT

NXP

IC MCU 16BIT 64KB FLASH 48QFN

Core Processor: HCS12
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CAN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

封装: 48-VFQFN Exposed Pad

库存15,600

MC9RS08KA8CPJ

NXP

IC MCU 8BIT 8KB FLASH 20DIP

Core Processor: RS08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 254 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

封装: 20-DIP (0.300", 7.62mm)

库存6,432

LPC43S67JET256E

NXP

IC MCU 32BIT 1MB FLASH 256LBGA

Core Processor: ARM? Cortex?-M4/M0
Core Size: 32-Bit Dual-Core
Speed: 204MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 164
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 154K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 16x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-LBGA (17x17)

封装: 256-LBGA

库存5,888

MC9S08FL8CBM

NXP

IC MCU 8BIT 8KB FLASH 32SDIP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: SCI
Peripherals: LVD, PWM, WDT
Number of I/O: 30
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 12x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-SDIP (0.400", 10.16mm)
Supplier Device Package: 32-SDIP

封装: 32-SDIP (0.400", 10.16mm)

库存13,536

MKL25Z128VLK4

NXP

IC MCU 32BIT 128KB FLASH 80LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 66
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 14x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

封装: 80-LQFP

库存12,084

TDA8444T/N4,518

NXP

IC OCTUPLE DAC 6BIT 12V 16-SOIC

Number of Bits: 6
Number of D/A Converters: 6
Settling Time: -
Output Type: Voltage - Buffered
Differential Output: No
Data Interface: I2C
Reference Type: External
Voltage - Supply, Analog: 4.5 V ~ 13.2 V
Voltage - Supply, Digital: 4.5 V ~ 13.2 V
INL/DNL (LSB): ±0.5 (Max), ±0.5 (Max)
Architecture: -
Operating Temperature: -20°C ~ 70°C
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SO
Mounting Type: -

封装: 16-SOIC (0.295", 7.50mm Width)

库存6,304

FSA95601VAHR2

NXP

IC AMP 6CH CLASS D DGTL

Function: -
Applications: -
Number of Channels: -
Interface: -
Voltage - Supply: -
Operating Temperature: -
Specifications: -
Package / Case: -
Supplier Device Package: -

封装: -

库存2,448

SL3S1213FUD/BG,003

NXP

IC U-CODE G2IL+ DIE WAFER

Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Standards: EPC
Interface: -
Voltage - Supply: 1.8V
Operating Temperature: -40°C ~ 85°C
Package / Case: Die
Supplier Device Package: Wafer

封装: Die

库存7,308

MWE6IC9100NR1

NXP

IC PWR AMP RF LDMOS TO270-14

Frequency: 960MHz
P1dB: -
Gain: 33.5dB
Noise Figure: -
RF Type: GSM, EDGE
Voltage - Supply: 28V
Current - Supply: -
Test Frequency: -
Package / Case: TO-270-14 Variant, Flat Leads
Supplier Device Package: TO-270 WB-14

封装: TO-270-14 Variant, Flat Leads

库存5,238

MC33FS6512LAE

NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP Exposed Pad

库存5,920

LPC54606J256BD100E

NXP

32-BIT ARM CORTEX-M4

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 136K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封装: 100-LQFP

库存6,360

S9S12G48F0WLFR

NXP

16-BIT MCU S12 CORE 48KB FLASH

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

库存5,568

S9S08RNA8W2VTGR

NXP

8-BIT MCU S08 CORE 8KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封装: 16-TSSOP (0.173", 4.40mm Width)

库存6,080

TDF8590TH-N1T-S23J

NXP

IC AMPLIFIER CLASS D

Type: Class D
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power x Channels @ Load: 160W x 1 @ 8Ohm; 80W x 2 @ 4Ohm
Voltage - Supply: ±14V ~ 29V
Features: -
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-HSOP
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

封装: -

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TJA1128BTK-1Z

NXP

LIN MINI SYSTEM BASIS CHIP WITH

Applications: System Basis Chip
Interface: SPI
Voltage - Supply: 3V ~ 28V
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)
Mounting Type: Surface Mount

封装: -

库存18,000

FC32K146HFT0VLLT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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MPF5200AMBA0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 2

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-PowerWFQFN
Supplier Device Package: 32-HWQFN (5x5)

封装: -

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MIMXRT106SDVL6B

NXP

IC MCU 32BIT EXT MEM 196MAPBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 600MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O: 127
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 20x12b
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Supplier Device Package: 196-MAPBGA (10x10)

封装: -

库存618

MFS2300BMBA0EP

NXP

IC

Applications: System Basis Chip
Current - Supply: 40µA
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封装: -

库存780

MFS2632AMDA0AD

NXP

AUTO SBC

Applications: -
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

封装: -

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