NXP 产品

PHX20N06T,127

NXP

MOSFET N-CH 55V 12.9A SOT186A

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 12.9A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 9.8nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 320pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 23W (Tc)
• Rds On (Max) @ Id, Vgs: 75 mOhm @ 10A, 10V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220-3
• Package / Case: TO-220-3 Full Pack, Isolated Tab

封装: TO-220-3 Full Pack, Isolated Tab

PZM3.0NB2,115

NXP

DIODE ZENER 3V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 3V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 95 Ohms
• Current - Reverse Leakage @ Vr: 10µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

封装: TO-236-3, SC-59, SOT-23-3

BAP63-03,115

NXP

DIODE PIN 50V 100MA SOD-323

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 50V
• Current - Max: 100mA
• Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
• Resistance @ If, F: 1.5 Ohm @ 100mA, 100MHz
• Power Dissipation (Max): 500mW
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: SC-76, SOD-323
• Supplier Device Package: SOD-323

封装: SC-76, SOD-323

MCZ33730EK

NXP

IC REG BUCK PROG 3.5A 32SOIC

• Topology: Step-Down (Buck) Synchronous (1), Linear (LDO) (3)
• Function: Any Function
• Number of Outputs: 4
• Frequency - Switching: 100kHz ~ 500kHz
• Voltage/Current - Output 1: 5V, 3.5A
• Voltage/Current - Output 2: Programmable
• Voltage/Current - Output 3: Programmable
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: No
• Voltage - Supply: 4.5 V ~ 26.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

封装: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

MC34VR5100A2EP

NXP

IC REG 9OUT BUCK/LDO 48QFN

• Topology: Step-Down (Buck) (3), Linear (LDO) (6)
• Function: Communications Processors
• Number of Outputs: 9
• Frequency - Switching: -
• Voltage/Current - Output 1: 1.8V/3.3V/0.7 V ~ 1.425 V, 3.8A
• Voltage/Current - Output 2: 1.5 V ~ 1.85 V/2.5 V ~ 3.3 V, 1.25A
• Voltage/Current - Output 3: 0.9 V ~ 1.65 V, 1.5A
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: No
• Voltage - Supply: 2.8 V ~ 4.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

封装: 48-VFQFN Exposed Pad

TDA3608Q/N3C,112

NXP

IC MULT VOLT REG W/SWITCH 13-SIL

• Applications: Processor
• Current - Supply: 500µA
• Voltage - Supply: 9.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 13-SIP Formed Leads
• Supplier Device Package: 13-PDBS

封装: 13-SIP Formed Leads

MC33385DHR2

NXP

IC SWITCH QUAD L-SIDE 20-HSOP

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: Low Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 4.5 V ~ 5.5 V
• Voltage - Supply (Vcc/Vdd): -
• Current - Output (Max): 2A
• Rds On (Typ): 250 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 20-HSOP

封装: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

74HCT597N,652

NXP

IC 8BIT SHIFT REGISTER 16DIP

• Logic Type: Shift Register
• Output Type: Push-Pull
• Number of Elements: 1
• Number of Bits per Element: 8
• Function: Parallel or Serial to Serial
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

封装: 16-DIP (0.300", 7.62mm)

N74F374D,623

NXP

IC D-TYPE POS TRG SNGL 20SOIC

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 165MHz
• Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 3mA, 24mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 86mA
• Input Capacitance: -
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)

封装: 20-SOIC (0.295", 7.50mm Width)

TDA5051AT/C1,518

NXP

IC HOME AUTOMATION MODEM 16SOIC

• Data Format: ASK over Home Power Lines
• Baud Rates: 1.2k
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SO

封装: 16-SOIC (0.295", 7.50mm Width)

P1014NSE5FFB

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Security; SEC 4.4
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

封装: 425-FBGA

MPC8309VMAHFCA

NXP

IC MPU MPC83XX 417MHZ 489BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 417MHz
• Co-Processors/DSP: Communications; QUICC Engine
• RAM Controllers: DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 489-LFBGA
• Supplier Device Package: 489-PBGA (19x19)

封装: 489-LFBGA

MC9S12DP512VPVE

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

封装: 112-LQFP

S9S12ZVL16F0CLCR

NXP

IC MCU 16BIT 32KB FLASH 32LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 19
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

S9KEAZN16ACLC

NXP

IC MCU 32BIT 16KB FLASH 32LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

MKL26Z256VMP4

NXP

IC MCU 32BIT 256KB FLASH 64BGA

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 50
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D - 16bit, D/A - 12bit
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LFBGA
• Supplier Device Package: 64-MAPBGA (5x5)

封装: 64-LFBGA

MM912KS812AMAFR2

NXP

IC MCU 16BIT HCS12 100LQFP

• Applications: Engine Control
• Core Processor: S12XS
• Program Memory Type: FLASH (256 kB)
• Controller Series: HCS12
• RAM Size: 12K x 8
• Interface: CAN, SCI, SPI
• Number of I/O: 6
• Voltage - Supply: 4.7 V ~ 36 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP Exposed Pad
• Supplier Device Package: 100-LQFP-EP (14x14)

封装: 100-LQFP Exposed Pad

MM908E621ACPEKR2

NXP

IC QUAD HALF BRDG TRPL SW 54SOIC

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• RAM Size: 512 x 8
• Interface: SCI, SPI
• Number of I/O: 12
• Voltage - Supply: 9 V ~ 16 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOIC W EP

封装: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

ASC8852AETE

NXP

IC VIDEO PROCESSOR ADV 484TFBGA

• Applications: Embedded Multimedia Communication, Security and Entertainment
• Core Processor: ARM9?
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
• Number of I/O: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 484-TFBGA
• Supplier Device Package: 484-TFBGA (15x15)

封装: 484-TFBGA

M5475AFE

NXP

MODULE FIRE ENGINE

• Module/Board Type: MPU Core
• Core Processor: ColdFire V4e, MCF5475
• Co-Processor: -
• Speed: 266MHz
• Flash Size: 2MB (Boot)
• RAM Size: 64MB
• Connector Type: -
• Size / Dimension: 3.7" x 4.5" (93.4mm x 114.3mm)
• Operating Temperature: 0°C ~ 70°C

封装: -

TDA8763AM/5/C4,112

NXP

IC ADC 10BIT HS 28-SSOP

• Number of Bits: 10
• Sampling Rate (Per Second): 50M
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: Parallel
• Configuration: ADC
• Ratio - S/H:ADC: -
• Number of A/D Converters: 1
• Architecture: Sigma-Delta
• Reference Type: External
• Voltage - Supply, Analog: 5V
• Voltage - Supply, Digital: 5V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP
• Mounting Type: -

封装: 28-SSOP (0.209", 5.30mm Width)

BGW200EG/01,515

NXP

IC RF TXRX+MCU WIFI 68-LFLGA

• Type: TxRx + MCU
• RF Family/Standard: WiFi
• Protocol: 802.11b
• Modulation: CCK, DSSS, QPSK
• Frequency: 2.4GHz
• Data Rate (Max): 11Mbps
• Power - Output: 17.6dBm
• Sensitivity: -91dBm
• Memory Size: 256kb ROM, 1280kb SRAM
• Serial Interfaces: JTAG, SDIO, SPI, UART
• GPIO: 11
• Voltage - Supply: 2.7 V ~ 3 V
• Current - Receiving: 93.7mA ~ 111.5mA
• Current - Transmitting: 16mA ~ 94.2mA
• Operating Temperature: -30°C ~ 85°C
• Package / Case: 68-LFLGA Exposed Pad

封装: 68-LFLGA Exposed Pad

T1023NXN7MQA

NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MPC8313VRAGDC

NXP

IC MPU POWERQUICC II PRO 516PBGA

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

封装: 516-BBGA Exposed Pad

LX2120XN72232B

NXP

IC MPU QORLQ 2.2GHZ 1517FCPBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 12 Core, 64-Bit
• Speed: 2.2GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: 100Gbps (2)
• SATA: SATA 3.0 (4)
• USB: USB 3.0 (2) + PHY (2)
• Voltage - I/O: 1.2V, 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: Secure Boot, TrustZone®
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCPBGA (40x40)

封装: -

Request a Quote

TDF8531HH-N2Y

NXP

CLASS D AMPLIFIER

• Type: -
• Output Type: -
• Max Output Power x Channels @ Load: -
• Voltage - Supply: -
• Features: -
• Mounting Type: -
• Operating Temperature: -
• Supplier Device Package: -
• Package / Case: -

封装: -

Request a Quote

NOCATSTYPE

NXP

MOSFET PMV77EN TO-236AB REELLP

• FET Type: -
• Technology: -
• Drain to Source Voltage (Vdss): -
• Current - Continuous Drain (Id) @ 25°C: -
• Drive Voltage (Max Rds On, Min Rds On): -
• Vgs(th) (Max) @ Id: -
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: -
• Vgs (Max): -
• FET Feature: -
• Power Dissipation (Max): -
• Rds On (Max) @ Id, Vgs: -
• Operating Temperature: -
• Mounting Type: -
• Supplier Device Package: -
• Package / Case: -

封装: -

Request a Quote

MC10XS4200BDFKR2

NXP

HIGH-SIDE SWITCH, 24V, DUAL 10MO

• Switch Type: General Purpose
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 8V ~ 36V
• Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
• Current - Output (Max): 6A
• Rds On (Typ): 10mOhm (Max)
• Input Type: CMOS
• Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 23-PowerQFN
• Supplier Device Package: 23-PQFN (12x12)

封装: -

Request a Quote

LTA702NT-N1-518

NXP

IC

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

Request a Quote

SPC5747CFK0ACKU6

NXP

IC MCU 32BIT 4MB FLASH 176LQFP

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz, 160MHz
• Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 129
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
• Data Converters: A/D 48x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

封装: -

Request a Quote