NXP 产品

MRFE6VP8600HSR6

NXP

FET RF 2CH 130V 860MHZ NI1230S

• Transistor Type: LDMOS (Dual)
• Frequency: 860MHz
• Gain: 19.3dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 125W
• Voltage - Rated: 130V
• Package / Case: NI-1230S
• Supplier Device Package: NI-1230S

封装: NI-1230S

BF908,215

NXP

MOSFET N-CH 12V 40MA SOT143B

• Transistor Type: N-Channel Dual Gate
• Frequency: 200MHz
• Gain: -
• Voltage - Test: 8V
• Current Rating: 40mA
• Noise Figure: 0.6dB
• Current - Test: 15mA
• Power - Output: -
• Voltage - Rated: 12V
• Package / Case: TO-253-4, TO-253AA
• Supplier Device Package: SOT-143B

封装: TO-253-4, TO-253AA

MC33880PEG

NXP

IC SRL SWITCH OCT W/SPI 28SOIC

• Switch Type: General Purpose
• Number of Outputs: 8
• Ratio - Input:Output: 1:8
• Output Configuration: High Side or Low Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 5.5 V ~ 24.5 V
• Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
• Current - Output (Max): 800mA
• Rds On (Typ): 550 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

封装: 28-SOIC (0.295", 7.50mm Width)

PCA9553DP/01,118

NXP

IC LED DRVR LIN DIM 25MA 8TSSOP

• Type: Linear
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 4
• Voltage - Supply (Min): 2.3V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: -
• Current - Output / Channel: 25mA
• Frequency: 400kHz
• Dimming: I2C
• Applications: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

封装: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

74ABT646ADB,112

NXP

IC TRANSCVR 8BIT N-INV 24SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

封装: 24-SSOP (0.209", 5.30mm Width)

TDA20152/1,557

NXP

IC HDMI INTERFACE 28-HVQFN

• Type: Interface
• Applications: Video
• Mounting Type: Surface Mount
• Package / Case: 28-VFQFN Exposed Pad
• Supplier Device Package: 28-HVQFN (5x5)

封装: 28-VFQFN Exposed Pad

TDA8024TT/C1/S1J

NXP

IC SMART CARD STD 28TSSOP

• Applications: -
• Interface: Analog
• Voltage - Supply: 2.7 V ~ 6.5 V
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 28-TSSOP
• Mounting Type: Surface Mount

封装: 28-TSSOP (0.173", 4.40mm Width)

TDA8007BHL/C3,118

NXP

IC INTERFACE CARD MP 48-LQFP

• Applications: -
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 6 V
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)
• Mounting Type: Surface Mount

封装: 48-LQFP

TJA1057GT/3J

NXP

IC TRANSCEIVER CAN HS 8SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 300mV
• Data Rate: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

封装: 8-SOIC (0.154", 3.90mm Width)

NX3L2267GU-Q100X

NXP

IC SWITCH ANLG SPDT 10XQFN

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 2
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 90 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 40ns, 20ns
• -3db Bandwidth: 60MHz
• Charge Injection: 37pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 10-XFQFN
• Supplier Device Package: 10-XQFN (1.4x1.8)

封装: 10-XFQFN

MC68VZ328CVPR2

NXP

IC MPU M683XX 33MHZ 144MAPBGA

• Core Processor: FLX68000
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: -
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD, Touch Panel
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

封装: 144-LBGA

MPC8555ECPXALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Communications; CPM, Security; SEC
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

封装: 783-BBGA, FCBGA

MCF52256VN80J

NXP

IC MCU 32BIT 256KB FLASH 144BGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 96
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

封装: 144-LBGA

MC9S08SE4VWL

NXP

IC MCU 8BIT 4KB FLASH 28SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LIN, SCI
• Peripherals: LVD, POR, PWM
• Number of I/O: 24
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

封装: 28-SOIC (0.295", 7.50mm Width)

MC9S08DN32MLF

NXP

IC MCU 8BIT 32KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

SPC5534MVM80

NXP

IC MCU 32BIT 1MB FLASH 208MAPBGA

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 192
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 34x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 208-BGA
• Supplier Device Package: 208-MAPBGA (17x17)

封装: 208-BGA

MC9S12HZ128VAL

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

封装: 112-LQFP

SPC5746BSK1VKU2

NXP

32 BIT SINGLE CORE 3M FLASH 384

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

S9S12DG25F0VPVE

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

封装: 112-LQFP

MC9S12XHZ512CAL

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, LIN, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x8/10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

封装: 112-LQFP

MCHSC705C8ACFBE

NXP

IC MCU 8BIT 8KB OTP 44QFP

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 24
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 304 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: 44-QFP (10x10)

封装: 44-QFP

MC9S08JE128CLK

NXP

IC MCU 8BIT 128KB FLASH 80LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SCI, SPI, USB
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 46
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

封装: 80-LQFP

S9S12P128J0CLH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 49
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

LPC1112JHI33/203E

NXP

IC MCU 32BIT 16KB FLASH 33HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 28
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 33-HVQFN (5x5)

封装: 32-VFQFN Exposed Pad

MPX53D

NXP

SENSOR DIFF PRESS 7.25PSI MAX

• Pressure Type: Differential
• Operating Pressure: 7.25 PSI (50 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 60 mV (3V)
• Accuracy: -0.6% ~ 0.4%
• Voltage - Supply: 3 V ~ 6 V
• Port Size: -
• Port Style: No Port
• Features: -
• Termination Style: PCB
• Maximum Pressure: 25.38 PSI (175 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 6-SIP Module
• Supplier Device Package: -

封装: 6-SIP Module

MC44BC380EFR2

NXP

IC BOOSTER/SPLITTER ANT 8-SOIC

• Insertion Loss: -
• Frequency: 40MHz ~ 880MHz
• Specifications: -
• Size / Dimension: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)

封装: 8-SOIC (0.154", 3.90mm Width)

LPC832M101FDH20FP

NXP

32-BIT ARM CORTEX-M0+ MICROCONTR

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 30MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

封装: 20-TSSOP (0.173", 4.40mm Width)

MKV42F256VLL16R

NXP

IC

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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LPC5516JBD64E

NXP

IC MCU 32BIT 256KB FLASH 64HTQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 36
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

封装: -

MFS2622AMDA0AD

NXP

AUTO SBC

• Applications: -
• Current - Supply: 30µA
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

封装: -

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