NXP 产品

BC337-40,116

NXP

TRANS NPN 45V 0.5A TO-92

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 500mA
• Voltage - Collector Emitter Breakdown (Max): 45V
• Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 250 @ 100mA, 1V
• Power - Max: 625mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

封装: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

PCA9849PWJ

NXP

IC MULTIPLEXER 4CH 16TSSOP

• Type: Multiplexer
• Circuit: 2 x 4:1
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Dual Supply
• Voltage - Supply: 0.8 V ~ 3.6 V, 1.65 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

封装: 16-TSSOP (0.173", 4.40mm Width)

N74F191N,602

NXP

IC BINARY COUNTER UP/DOWN 16DIP

• Logic Type: Binary Counter
• Direction: Up, Down
• Number of Elements: 1
• Number of Bits per Element: 4
• Reset: -
• Timing: Asynchronous
• Count Rate: 125MHz
• Trigger Type: Positive Edge
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

封装: 16-DIP (0.300", 7.62mm)

74LV241PW,112

NXP

IC BUFF/DVR TRI-ST DUAL 20TSSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 1 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

封装: 20-TSSOP (0.173", 4.40mm Width)

TDA8566TH/N2,512

NXP

IC AMP AUDIO PWR 55W STER 20HSOP

• Type: Class B
• Output Type: 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 20-HSOP
• Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

封装: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

PCA9515ADP/DG,118

NXP

IC REDRIVER I2C 1CH 8TSSOP

• Type: Buffer, ReDriver
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 1
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 6pF
• Voltage - Supply: 2.3 V ~ 3.6 V
• Current - Supply: 800µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

封装: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

74LV4051N,112

NXP

IC MUX/DEMUX 8X1 16DIP

• Switch Circuit: -
• Multiplexer/Demultiplexer Circuit: 8:1
• Number of Circuits: 1
• On-State Resistance (Max): 85 Ohm
• Channel-to-Channel Matching (ΔRon): 2 Ohm
• Voltage - Supply, Single (V+): 1 V ~ 6 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 34ns, 29ns
• -3db Bandwidth: 200MHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): 3.5pF
• Current - Leakage (IS(off)) (Max): 2µA
• Crosstalk: -60dB @ 1MHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

封装: 16-DIP (0.300", 7.62mm)

MCIMX508CZK8B

NXP

IC MPU I.MX50 800MHZ 416POBGA

• Core Processor: ARM? Cortex?-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR, LPDDR2, DDR2
• Graphics Acceleration: Yes
• Display & Interface Controllers: EPDC, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: Boot Security, Cryptography, Secure JTAG
• Package / Case: 416-VFBGA
• Supplier Device Package: -

封装: 416-VFBGA

MPC8545EVTAQGB

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

封装: 783-BBGA, FCBGA

P89LPC9151FDH,129

NXP

IC MCU 8BIT 2KB FLASH 14TSSOP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 18MHz
• Connectivity: I2C, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 2KB (2K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 4x8b; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

封装: 14-TSSOP (0.173", 4.40mm Width)

MCF5473VR200

NXP

IC MCU 32BIT ROMLESS 388PBGA

• Core Processor: Coldfire V4E
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: DMA, PWM, WDT
• Number of I/O: 99
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 388-BBGA
• Supplier Device Package: 388-PBGA (27x27)

封装: 388-BBGA

S912XEP100W1MAL

NXP

IC MCU 16BIT 1MB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

封装: 112-LQFP

MCF51JM64EVLK

NXP

IC MCU 32BIT 64KB FLASH 80LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (14x14)

封装: 80-LQFP

MCF51AC256BVPUE

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 20x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

S9S08AW16AE0MFT

NXP

IC MCU 8BIT 16KB FLASH 48QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

封装: 48-VFQFN Exposed Pad

MPVZ7025GC6U

NXP

IC PRESSURE SENSOR 8-SOP

• Pressure Type: Compound
• Operating Pressure: ±3.63 PSI (±25 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.17mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: ±29.01 PSI (±200 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD Module
• Supplier Device Package: -

封装: 8-SMD Module

J3D081GUA/T1DGAG5D

NXP

IC RF MODULE UNCASED

• Function: -
• Frequency: -
• RF Type: -
• Secondary Attributes: -
• Package / Case: -
• Supplier Device Package: -

封装: -

TDA18264HB/C1Y

NXP

CABLE FULL SPECTRUM TRANSCEIVER

• Function: -
• Interface: -
• Number of Circuits: -
• Voltage - Supply: -
• Current - Supply: -
• Power (Watts): -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

T1013NSN7KQA

NXP

QORIQ 1XCPU 64-BIT PWR ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MCIMX6S8DVM10AD

NXP

I.MX 6S ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

封装: 624-LFBGA

LPC54605J512BD100E

NXP

32-BIT ARM CORTEX-M4

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 200K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封装: 100-LQFP

MKL36Z128VLL4R

NXP

KINETIS L 32-BIT MCU ARM CORTEX

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 84
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D - 16bit, D/A - 12bit
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封装: 100-LQFP

MKM33Z64ACLL5R

NXP

KINETIS KM33: 50MHZ CORTEX-M0+ M

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: DMA, LCD, WDT
• Number of I/O: 68
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x16b, 4x24b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封装: 100-LQFP

LS1018ASE7KQA

NXP

IC MPU QORIQ LAYER 1GHZ 448FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 1GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: -
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

封装: -

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TJA1029T-2Z

NXP

IC TRANSCEIVER 1/1 8SO

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: 175 mV
• Data Rate: -
• Voltage - Supply: 5V ~ 18V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

封装: -

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LPC54606J512BD208K

NXP

IC MCU 32BIT 512KB FLASH 208LQFP

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit Single-Core
• Speed: 180MHz
• Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 171
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 200K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 12x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 208-LQFP
• Supplier Device Package: 208-LQFP (28x28)

封装: -

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SAF4000EL-101Z430K

NXP

SAF4000EL

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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PCF85263AUKZ

NXP

IC RTC CLK/CALENDAR I2C 12WLCSP

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Watchdog Timer
• Memory Size: -
• Time Format: HH:MM:SS:hh (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C
• Voltage - Supply: 0.9V ~ 5.5V, 1.8V ~ 5.5V
• Voltage - Supply, Battery: 0.9V ~ 5.5V
• Current - Timekeeping (Max): 0.885µA @ 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 12-XFBGA, WLCSP
• Supplier Device Package: 12-WLCSP (1.19x0.94)

封装: -

MIMXRT685SFFOB

NXP

IC MCU 32BIT EXT MEM 249FOWLP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Dual-Core
• Speed: 300MHz
• Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 147
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 4.5M x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 12x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 249-WFBGA
• Supplier Device Package: 249-FOWLP (7x7)

封装: -

SAF7771EL-203Z130K

NXP

IC

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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