页 497 - NXP 产品 | 深圳黑森尔电子

零件编号	制造商	描述	封装	库存
BFR93AW,135	NXP	TRANS NPN 12V 35MA 5GHZ SOT323 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 12V Frequency - Transition: 5GHz Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz Gain: - Power - Max: 300mW DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V Current - Collector (Ic) (Max): 35mA Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	封装: SC-70, SOT-323	库存7,200
MC33981BHFKR2	NXP	IC SWITCH HI SIDE SINGLE 16PQFN Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: PWM Voltage - Load: 6 V ~ 27 V Voltage - Supply (Vcc/Vdd): - Current - Output (Max): 40A Rds On (Typ): 4 mOhm Input Type: - Features: Slew Rate Controlled Fault Protection: Current Limiting (Fixed), Over Temperature Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 16-PowerDFN Supplier Device Package: 16-PQFN (12x12)	封装: 16-PowerDFN	库存2,912
TEA18363T/1J	NXP	IC CTRLR SMPS DCM/QR 8SOIC Output Isolation: Isolated Internal Switch(s): No Voltage - Breakdown: - Topology: Flyback Voltage - Start Up: 14.9V Voltage - Supply (Vcc/Vdd): 9.9 V ~ 30 V Duty Cycle: - Frequency - Switching: 25kHz ~ 132.5kHz Power (Watts): 75W Fault Protection: Over Power, Over Temperature, Over Voltage Control Features: - Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO Mounting Type: Surface Mount	封装: 8-SOIC (0.154", 3.90mm Width)	库存2,304
GTL2000DGG,518	NXP	IC XLATR 22BIT BI-DIREC TSSOP48 Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 22 Voltage - VCCA: 1V ~ 5.5V Voltage - VCCB: 1V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	封装: 48-TFSOP (0.240", 6.10mm Width)	库存4,800
SSTUA32S865ET,518	NXP	IC BUFFER 1.8V 28BIT SOT802-1 Logic Type: 1:2 Registered Buffer with Parity Supply Voltage: 1.7 V ~ 2 V Number of Bits: 28 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 160-TFBGA Supplier Device Package: 160-TFBGA (9x13)	封装: 160-TFBGA	库存5,776
HEF4068BT,653	NXP	IC GATE NAND 1CH 8-INP 14-SO Logic Type: NAND Gate Number of Circuits: 1 Number of Inputs: 8 Features: - Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Max): 4µA Current - Output High, Low: 3mA, 3mA Logic Level - Low: 1.5 V ~ 4 V Logic Level - High: 3.5 V ~ 11 V Max Propagation Delay @ V, Max CL: 65ns @ 15V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	封装: 14-SOIC (0.154", 3.90mm Width)	库存7,152
PCA82C251T/N,112	NXP	IC CAN TXRX 24V 8SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 150mV Data Rate: - Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封装: 8-SOIC (0.154", 3.90mm Width)	库存5,168
T1022NXE7MQB	NXP	IC SOC 2CORE 1200MHZ 780FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: - RAM Controllers: DDR3L/4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (5) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	封装: 780-FBGA, FCBGA	库存3,904
MC705L16CFUE	NXP	IC MCU 8BIT 16KB OTP 80QFP Core Processor: HC05 Core Size: 8-Bit Speed: 2.1MHz Connectivity: SPI Peripherals: LCD, POR, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	封装: 80-QFP	库存5,520
P89LPC922FDH,512	NXP	IC MCU 8BIT 8KB FLASH 20TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封装: 20-TSSOP (0.173", 4.40mm Width)	库存2,400
S912XEP768J5MAG	NXP	IC MCU 16BIT 768KB FLASH 144LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封装: 144-LQFP	库存2,496
S912XEP100BCAG	NXP	IC MCU 16BIT 1MB FLASH 144LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封装: 144-LQFP	库存3,440
MM912G634DC2APR2	NXP	IC MCU 48KB LS/HS SWITCH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP	库存5,264
MMA2300D	NXP	ACCELEROMETER 281G ANALOG 16SOIC Type: Analog Axis: X Acceleration Range: ±281g Sensitivity (LSB/g): - Sensitivity (mV/g): 8 Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封装: 16-SOIC (0.295", 7.50mm Width)	库存7,308
LS1023AXE7PQB	NXP	QORIQ 2XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封装: -	库存4,848
MCIMX6U6AVM08ADR	NXP	I.MX6 ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	封装: 624-LFBGA	库存7,248
MCIMX6S5DVM10ADR	NXP	II.MX 6S ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	封装: 624-LFBGA	库存3,776
LS1012AXN7HKA	NXP	QORIQ 64-BIT ARM MPU 800MHZ EXT Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封装: -	库存6,032
S912XEQ512F1VAL	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封装: 112-LQFP	库存2,144
S9S12GA192F0MLFR	NXP	16-BIT MCU S12 CORE 192KB FLAS Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 11K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP	库存6,576
S9S08SL16F1MTJR	NXP	8-BIT MCU S08 CORE 16KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封装: 20-TSSOP (0.173", 4.40mm Width)	库存3,136
SAF7751HV/N205K	NXP	DSP AUDIO MULTI-TUNER Type: Audio, Car Signal Processor Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24x24)	封装: 176-LQFP Exposed Pad	库存3,376
PCF8553DTT-AY	NXP	LCD DRIVER Display Type: LCD Configuration: 40 Segment Interface: I2C, SPI Digits or Characters: 10 Characters, 20 Characters, 160 Elements Current - Supply: 1.2 µA Voltage - Supply: 1.8V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	封装: -	Request a Quote
S9S12GN32J0VFTR	NXP	IC MCU 16BIT 32KB FLASH 48TFQFN Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	封装: -	Request a Quote
FB32K116BFT0MFMR	NXP	S32K116, M0+, FLASH 128K, RAM 17 Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封装: -	Request a Quote
LPC55S26JEV98E	NXP	IC MCU 32BIT 256KB FLASH 98VFBGA Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 144K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 98-VFBGA Supplier Device Package: 98-VFBGA (7x7)	封装: -	Request a Quote
MPF5020CMMACES	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	封装: -	Request a Quote
PCF85053ATKJ	NXP	IC CPU RTC I2C SOT2413-1 Type: Clock/Calendar Features: Alarm, Daylight Savings, Leap Year, SRAM Memory Size: 128B Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD Interface: I2C Voltage - Supply: 1.7V ~ 3.6V Voltage - Supply, Battery: 1.55V ~ 3.6V Current - Timekeeping (Max): 1mA @ 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 12-VFDFN Exposed Pad Supplier Device Package: 12-HVSON (3x3)	封装: -	库存35,853
TJA1128ATK-1Z	NXP	LIN MINI SYSTEM BASIS CHIP WITH Applications: System Basis Chip Interface: SPI Voltage - Supply: 3V ~ 28V Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5) Mounting Type: Surface Mount	封装: -	库存15,000
MC33PF8100FJES	NXP	POWER MANAGEMENT IC, I.MX8, PRE- Applications: Processor Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封装: -	Request a Quote

BFR93AW,135

NXP

TRANS NPN 12V 35MA 5GHZ SOT323

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 12V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
Gain: -
Power - Max: 300mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Current - Collector (Ic) (Max): 35mA
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Supplier Device Package: SOT-323-3

封装: SC-70, SOT-323

库存7,200

MC33981BHFKR2

NXP

IC SWITCH HI SIDE SINGLE 16PQFN

Switch Type: General Purpose
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: PWM
Voltage - Load: 6 V ~ 27 V
Voltage - Supply (Vcc/Vdd): -
Current - Output (Max): 40A
Rds On (Typ): 4 mOhm
Input Type: -
Features: Slew Rate Controlled
Fault Protection: Current Limiting (Fixed), Over Temperature
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 16-PowerDFN
Supplier Device Package: 16-PQFN (12x12)

封装: 16-PowerDFN

库存2,912

TEA18363T/1J

NXP

IC CTRLR SMPS DCM/QR 8SOIC

Output Isolation: Isolated
Internal Switch(s): No
Voltage - Breakdown: -
Topology: Flyback
Voltage - Start Up: 14.9V
Voltage - Supply (Vcc/Vdd): 9.9 V ~ 30 V
Duty Cycle: -
Frequency - Switching: 25kHz ~ 132.5kHz
Power (Watts): 75W
Fault Protection: Over Power, Over Temperature, Over Voltage
Control Features: -
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO
Mounting Type: Surface Mount

封装: 8-SOIC (0.154", 3.90mm Width)

库存2,304

GTL2000DGG,518

NXP

IC XLATR 22BIT BI-DIREC TSSOP48

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 22
Voltage - VCCA: 1V ~ 5.5V
Voltage - VCCB: 1V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

封装: 48-TFSOP (0.240", 6.10mm Width)

库存4,800

SSTUA32S865ET,518

NXP

IC BUFFER 1.8V 28BIT SOT802-1

Logic Type: 1:2 Registered Buffer with Parity
Supply Voltage: 1.7 V ~ 2 V
Number of Bits: 28
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 160-TFBGA
Supplier Device Package: 160-TFBGA (9x13)

封装: 160-TFBGA

库存5,776

HEF4068BT,653

NXP

IC GATE NAND 1CH 8-INP 14-SO

Logic Type: NAND Gate
Number of Circuits: 1
Number of Inputs: 8
Features: -
Voltage - Supply: 3 V ~ 15 V
Current - Quiescent (Max): 4µA
Current - Output High, Low: 3mA, 3mA
Logic Level - Low: 1.5 V ~ 4 V
Logic Level - High: 3.5 V ~ 11 V
Max Propagation Delay @ V, Max CL: 65ns @ 15V, 50pF
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

封装: 14-SOIC (0.154", 3.90mm Width)

库存7,152

PCA82C251T/N,112

NXP

IC CAN TXRX 24V 8SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 150mV
Data Rate: -
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封装: 8-SOIC (0.154", 3.90mm Width)

库存5,168

T1022NXE7MQB

NXP

IC SOC 2CORE 1200MHZ 780FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 1.4GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (5)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Package / Case: 780-FBGA, FCBGA
Supplier Device Package: 780-FCPBGA (23x23)

封装: 780-FBGA, FCBGA

库存3,904

MC705L16CFUE

NXP

IC MCU 8BIT 16KB OTP 80QFP

Core Processor: HC05
Core Size: 8-Bit
Speed: 2.1MHz
Connectivity: SPI
Peripherals: LCD, POR, WDT
Number of I/O: 16
Program Memory Size: 16KB (16K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

封装: 80-QFP

库存5,520

P89LPC922FDH,512

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

Core Processor: 8051
Core Size: 8-Bit
Speed: 18MHz
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封装: 20-TSSOP (0.173", 4.40mm Width)

库存2,400

S912XEP768J5MAG

NXP

IC MCU 16BIT 768KB FLASH 144LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

库存2,496

S912XEP100BCAG

NXP

IC MCU 16BIT 1MB FLASH 144LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

库存3,440

MM912G634DC2APR2

NXP

IC MCU 48KB LS/HS SWITCH 48LQFP

Applications: Automotive
Core Processor: S12
Program Memory Type: FLASH (48 kB)
Controller Series: HCS12
RAM Size: 2K x 8
Interface: LIN, SCI
Number of I/O: 9
Voltage - Supply: 2.25 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

库存5,264

MMA2300D

NXP

ACCELEROMETER 281G ANALOG 16SOIC

Type: Analog
Axis: X
Acceleration Range: ±281g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 8
Bandwidth: 400Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封装: 16-SOIC (0.295", 7.50mm Width)

库存7,308

LS1023AXE7PQB

NXP

QORIQ 2XCPU 64-BIT ARM ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封装: -

库存4,848

MCIMX6U6AVM08ADR

NXP

I.MX6 ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

封装: 624-LFBGA

库存7,248

MCIMX6S5DVM10ADR

NXP

II.MX 6S ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

封装: 624-LFBGA

库存3,776

LS1012AXN7HKA

NXP

QORIQ 64-BIT ARM MPU 800MHZ EXT

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封装: -

库存6,032

S912XEQ512F1VAL

NXP

16-BIT MCU S12X CORE 512KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封装: 112-LQFP

库存2,144

S9S12GA192F0MLFR

NXP

16-BIT MCU S12 CORE 192KB FLAS

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 192KB (192K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 11K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 2x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

库存6,576

S9S08SL16F1MTJR

NXP

8-BIT MCU S08 CORE 16KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封装: 20-TSSOP (0.173", 4.40mm Width)

库存3,136

SAF7751HV/N205K

NXP

DSP AUDIO MULTI-TUNER

Type: Audio, Car Signal Processor
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-HLQFP (24x24)

封装: 176-LQFP Exposed Pad

库存3,376

PCF8553DTT-AY

NXP

LCD DRIVER

Display Type: LCD
Configuration: 40 Segment
Interface: I2C, SPI
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Current - Supply: 1.2 µA
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

封装: -

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S9S12GN32J0VFTR

NXP

IC MCU 16BIT 32KB FLASH 48TFQFN

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

封装: -

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FB32K116BFT0MFMR

NXP

S32K116, M0+, FLASH 128K, RAM 17

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封装: -

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LPC55S26JEV98E

NXP

IC MCU 32BIT 256KB FLASH 98VFBGA

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Supplier Device Package: 98-VFBGA (7x7)

封装: -

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MPF5020CMMACES

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

封装: -

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PCF85053ATKJ

NXP

IC CPU RTC I2C SOT2413-1

Type: Clock/Calendar
Features: Alarm, Daylight Savings, Leap Year, SRAM
Memory Size: 128B
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Interface: I2C
Voltage - Supply: 1.7V ~ 3.6V
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 12-VFDFN Exposed Pad
Supplier Device Package: 12-HVSON (3x3)

封装: -

库存35,853

TJA1128ATK-1Z

NXP

LIN MINI SYSTEM BASIS CHIP WITH

Applications: System Basis Chip
Interface: SPI
Voltage - Supply: 3V ~ 28V
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)
Mounting Type: Surface Mount

封装: -

库存15,000

MC33PF8100FJES

NXP

POWER MANAGEMENT IC, I.MX8, PRE-

Applications: Processor
Current - Supply: 10µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封装: -

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