NXP 产品

MRFE6P9220HR3

NXP

FET RF 66V 880MHZ NI-860C3

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 20dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.6A
• Power - Output: 47W
• Voltage - Rated: 66V
• Package / Case: NI-860C3
• Supplier Device Package: NI-860C3

封装: NI-860C3

BF908WR,115

NXP

MOSFET NCH DUAL GATE 12V CMPAK-4

• Transistor Type: N-Channel Dual Gate
• Frequency: 200MHz
• Gain: -
• Voltage - Test: 8V
• Current Rating: 40mA
• Noise Figure: 0.6dB
• Current - Test: 15mA
• Power - Output: -
• Voltage - Rated: 12V
• Package / Case: SC-82A, SOT-343
• Supplier Device Package: CMPAK-4

封装: SC-82A, SOT-343

MRF6S19140HSR3

NXP

FET RF 68V 1.99GHZ NI-880S

• Transistor Type: LDMOS
• Frequency: 1.93GHz ~ 1.99GHz
• Gain: 16dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.15A
• Power - Output: 29W
• Voltage - Rated: 68V
• Package / Case: NI-880S
• Supplier Device Package: NI-880S

封装: NI-880S

PDTB113EK,115

NXP

TRANS PREBIAS PNP 250MW SMT3

• Transistor Type: PNP - Pre-Biased
• Current - Collector (Ic) (Max): 500mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 1k
• Resistor - Emitter Base (R2) (Ohms): 1k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 33 @ 50mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
• Current - Collector Cutoff (Max): 500nA
• Frequency - Transition: -
• Power - Max: 250mW
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

封装: TO-236-3, SC-59, SOT-23-3

MPC17529EPR2

NXP

IC MOTOR DRIVER PAR 24QFN

• Motor Type - Stepper: Bipolar
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (4)
• Interface: Parallel
• Technology: CMOS
• Step Resolution: -
• Applications: Battery Powered
• Current - Output: 700mA
• Voltage - Supply: 2.7 V ~ 5.6 V
• Voltage - Load: 2 V ~ 6.8 V
• Operating Temperature: -20°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-QFN-EP (4x4)

封装: 24-VFQFN Exposed Pad

MPC17C724EP

NXP

IC MOTOR DRIVER PAR 16QFN

• Motor Type - Stepper: Bipolar
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (4)
• Interface: Parallel
• Technology: Power MOSFET
• Step Resolution: -
• Applications: Camera
• Current - Output: 400mA
• Voltage - Supply: 2.7 V ~ 5.5 V
• Voltage - Load: 2.7 V ~ 5.5 V
• Operating Temperature: -20°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-QFN (3x3)

封装: 16-VFQFN Exposed Pad

ASL1002NTK,118

NXP

IC LED DRIVER AUTO 14HVSON

• Type: -
• Topology: -
• Internal Switch(s): -
• Number of Outputs: -
• Voltage - Supply (Min): -
• Voltage - Supply (Max): -
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: -
• Dimming: -
• Applications: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

CBT6832DGG,118

NXP

IC 16BIT 1OF2 MUX/DEMUX 56TSSOP

• Type: Multiplexer/Demultiplexer
• Circuit: 16 x 1:2
• Independent Circuits: 1
• Current - Output High, Low: 15mA, 64mA
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

封装: 56-TFSOP (0.240", 6.10mm Width)

74ABT841DB,118

NXP

IC 10BIT BUS INTRFC LATCH 24SSOP

• Logic Type: D-Type Transparent Latch
• Circuit: 10:10
• Output Type: Tri-State
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 4ns
• Current - Output High, Low: 32mA, 64mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

封装: 24-SSOP (0.209", 5.30mm Width)

74LVCH32245AEC,551

NXP

IC TRANSCVR TRI-ST 32BIT 96BGA

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

封装: 96-LFBGA

TDF8546AJ/N1,112

NXP

IC AMP AUDIO BTL DBS27P

• Type: Class AB
• Output Type: 4-Channel (Quad)
• Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm
• Voltage - Supply: 6 V ~ 18 V
• Features: Depop, Short-Circuit and Thermal Protection
• Mounting Type: Through Hole
• Operating Temperature: -
• Supplier Device Package: DBS27P
• Package / Case: 27-SIP, Formed Leads

封装: 27-SIP, Formed Leads

PCA9674TS,112

NXP

IC I/O EXPANDER I2C 8B 20SSOP

• Number of I/O: 8
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSOP

封装: 20-LSSOP (0.173", 4.40mm Width)

SGTL5000XNAA3

NXP

IC AUDIO CODEC STEREO 32-QFN

• Type: Stereo Audio
• Data Interface: I2C, Serial, SPI?
• Resolution (Bits): -
• Number of ADCs / DACs: 1 / 1
• Sigma Delta: No
• S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
• Dynamic Range, ADCs / DACs (db) Typ: -
• Voltage - Supply, Analog: 1.62 V ~ 3.6 V
• Voltage - Supply, Digital: 1.1 V ~ 2 V, 1.62 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN Exposed Pad (5x5)

封装: 32-VFQFN Exposed Pad

NX3DV3899GU,115

NXP

IC ANLG SWITCH DPDT 16XQFN

• Switch Circuit: DPDT
• Multiplexer/Demultiplexer Circuit: 2:2
• Number of Circuits: 2
• On-State Resistance (Max): 3.3 Ohm
• Channel-to-Channel Matching (ΔRon): 700 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 40ns, 20ns
• -3db Bandwidth: 200MHz
• Charge Injection: 4pC
• Channel Capacitance (CS(off), CD(off)): 8pF
• Current - Leakage (IS(off)) (Max): 5nA
• Crosstalk: -90dB @ 1MHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 16-XFQFN
• Supplier Device Package: 16-XQFN (1.8x2.6)

封装: 16-XFQFN

MPC862PVR50B

NXP

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

BSC9132NSN7KNKB

NXP

IC MPU Q OR IQ 1.333GHZ 780FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SC3850 - Dual
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 780-BFBGA, FCBGA
• Supplier Device Package: 780-FCBGA (23x23)

封装: 780-BFBGA, FCBGA

T1020NXE7MQB

NXP

IC SOC 2CORE 1200MHZ SW 780FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 1.4GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L/4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (12)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
• Package / Case: 780-FBGA, FCBGA
• Supplier Device Package: 780-FCPBGA (23x23)

封装: 780-FBGA, FCBGA

MPC859PZP133A

NXP

IC MPU MPC8XX 133MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 133MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

MC711D3CFNE2R

NXP

IC MCU 8BIT 4KB OTP 44PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 26
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (17.525x17.525)

封装: 44-LCC (J-Lead)

MC9S08LG16CLF

NXP

IC MCU 8BIT 18KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LCD, LVD, PWM
• Number of I/O: 39
• Program Memory Size: 18KB (18K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.9K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

MK10DX128VFT5

NXP

IC MCU 32BIT 128KB FLASH 48QFN

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 33
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

封装: 48-VFQFN Exposed Pad

ADC0808S125HW/C1:1

NXP

ADC 8BIT SGL 125MHZ 48HTQFP

• Number of Bits: 8
• Sampling Rate (Per Second): 125M
• Number of Inputs: 1
• Input Type: Differential
• Data Interface: Parallel
• Configuration: S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: -
• Reference Type: External, Internal
• Voltage - Supply, Analog: 3 V ~ 3.6 V
• Voltage - Supply, Digital: 1.65 V ~ 1.95 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TQFP Exposed Pad
• Supplier Device Package: 48-HTQFP
• Mounting Type: -

封装: 48-TQFP Exposed Pad

MPX5050D

NXP

SENSOR DIFF PRESS 7.25 PSI MAX

• Pressure Type: Differential
• Operating Pressure: 7.25 PSI (50 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±2.5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 29.01 PSI (200 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 6-SIP Module
• Supplier Device Package: -

封装: 6-SIP Module

SPC5777CCK3MME3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

• Core Processor: e200z7
• Core Size: 32-Bit Tri-Core
• Speed: 264MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
• Peripherals: DMA, LVD, POR, Zipwire
• Number of I/O: -
• Program Memory Size: 8MB (8M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16b Sigma-Delta, eQADC
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BGA
• Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

S912XEQ384BCAG

NXP

16-BIT MCU S12X CORE 384KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

S912XEQ512F0MALR

NXP

16-BIT MCU S12X CORE 512KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

封装: 112-LQFP

SPC5745BK1CMH2R

NXP

32 BIT SINGLE CORE 2M FLASH 2

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, I²S, POR, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 36x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LBGA
• Supplier Device Package: 100-MAPBGA (11x11)

封装: 100-LBGA

S9S12G48F0MLFR

NXP

16-BIT MCU S12 CORE 48KB FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

SAF775CHV-N208W-BY

NXP

IC

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

Request a Quote

MFS2602AMBA0ADR2

NXP

AUTO SBC

• Applications: -
• Current - Supply: 30µA
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

封装: -

Request a Quote