NXP 产品

MRF9060LR5

NXP

FET RF 65V 945MHZ NI-360

• Transistor Type: LDMOS
• Frequency: 945MHz
• Gain: 17dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 450mA
• Power - Output: 60W
• Voltage - Rated: 65V
• Package / Case: NI-360
• Supplier Device Package: NI-360 Short Lead

封装: NI-360

MRF1K50NR5

NXP

WIDEBAND RF POWER LDMOS TRANSIST

• Transistor Type: LDMOS
• Frequency: 1.8MHz ~ 500MHz
• Gain: 23dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: 1500W
• Voltage - Rated: 50V
• Package / Case: OM-1230-4L
• Supplier Device Package: OM-1230-4L

封装: OM-1230-4L

BFU760F,115

NXP

TRANS RF NPN 2.8V 70MA SOT343F

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 2.8V
• Frequency - Transition: 45GHz
• Noise Figure (dB Typ @ f): 0.4dB ~ 0.5dB @ 1.5GHz ~ 2.4GHz
• Gain: -
• Power - Max: 220mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
• Current - Collector (Ic) (Max): 70mA
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SOT-343F
• Supplier Device Package: 4-DFP

封装: SOT-343F

MC34VR5100A0EP

NXP

IC REG 9OUT BUCK/LDO 48QFN

• Topology: Step-Down (Buck) (3), Linear (LDO) (6)
• Function: Communications Processors
• Number of Outputs: 9
• Frequency - Switching: -
• Voltage/Current - Output 1: 1.8V/3.3V/0.7 V ~ 1.425 V, 3.8A
• Voltage/Current - Output 2: 1.5 V ~ 1.85 V/2.5 V ~ 3.3 V, 1.25A
• Voltage/Current - Output 3: 0.9 V ~ 1.65 V, 1.5A
• w/LED Driver: No
• w/Supervisor: No
• w/Sequencer: No
• Voltage - Supply: 2.8 V ~ 4.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

封装: 48-VFQFN Exposed Pad

TL431ASDT,215

NXP

IC VREF SHUNT ADJ SOT23-3

• Reference Type: Shunt
• Output Type: Adjustable
• Voltage - Output (Min/Fixed): 2.495V
• Voltage - Output (Max): 36V
• Current - Output: 100mA
• Tolerance: ±1%
• Temperature Coefficient: -
• Noise - 0.1Hz to 10Hz: -
• Noise - 10Hz to 10kHz: -
• Voltage - Input: -
• Current - Supply: -
• Current - Cathode: 600µA
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

封装: TO-236-3, SC-59, SOT-23-3

MR2A16ATS35CR

NXP

IC MRAM 4MBIT 35NS 44TSOP

• Memory Type: Non-Volatile
• Memory Format: RAM
• Technology: MRAM (Magnetoresistive RAM)
• Memory Size: 4Mb (256K x 16)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 35ns
• Access Time: 35ns
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TSOP (0.400", 10.16mm Width)
• Supplier Device Package: 44-TSOP II

封装: 44-TSOP (0.400", 10.16mm Width)

74LV365D,118

NXP

IC BUFF/DVR TRI-ST 6BIT 16SOIC

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 6
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 1 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

封装: 16-SOIC (0.154", 3.90mm Width)

NCX2222DPH

NXP

IC COMPARATOR OD LV 8TSSOP

• Type: General Purpose
• Number of Elements: 2
• Output Type: Open Drain
• Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
• Voltage - Input Offset (Max): 30mV @ 5.5V
• Current - Input Bias (Max): 1pA
• Current - Output (Typ): 68mA
• Current - Quiescent (Max): 5µA
• CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
• Propagation Delay (Max): 0.8µs
• Hysteresis: 9mV
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Mounting Type: Surface Mount
• Supplier Device Package: 8-TSSOP

封装: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

NX3V1G384GM,132

NXP

IC ANALOG SWITCH SPST XSON6

• Switch Circuit: SPST - NC
• Multiplexer/Demultiplexer Circuit: 1:1
• Number of Circuits: 1
• On-State Resistance (Max): 450 mOhm
• Channel-to-Channel Matching (ΔRon): -
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 26ns, 10ns
• -3db Bandwidth: 25MHz
• Charge Injection: 12pC
• Channel Capacitance (CS(off), CD(off)): 70pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

封装: 6-XFDFN

MC8641VU1500KB

NXP

IC MPU MPC86XX 1.5GHZ 994FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.5GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 994-BCBGA, FCCBGA
• Supplier Device Package: 994-FCCBGA (33x33)

封装: 994-BCBGA, FCCBGA

MPC860ENCZQ50D4

NXP

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

MCIMX535DVV1C

NXP

IC MPU I.MX53 1.0GHZ 529TEBGA-2

• Core Processor: ARM? Cortex?-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, DDR2, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: SATA 1.5Gbps (1)
• USB: USB 2.0 (2), USB 2.0 + PHY (2)
• Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
• Operating Temperature: -20°C ~ 85°C (TC)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 529-FBGA
• Supplier Device Package: 529-TEPBGA-2 (19x19)

封装: 529-FBGA

MC908QY2ACPE

NXP

IC MCU 8BIT 1.5KB FLASH 16DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

封装: 16-DIP (0.300", 7.62mm)

MC68HC908LJ12CFB

NXP

IC MCU 8BIT 12KB FLASH 52LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: IRSCI, SPI
• Peripherals: LCD, LVD, POR, PWM
• Number of I/O: 20
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 52-LQFP
• Supplier Device Package: 52-LQFP (10x10)

封装: 52-LQFP

MC68HC11E0CFN2

NXP

IC MCU 8BIT ROMLESS 52PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 38
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 52-LCC (J-Lead)
• Supplier Device Package: 52-PLCC (19.1x19.1)

封装: 52-LCC (J-Lead)

S912XEQ512BVAGR

NXP

IC MCU 16BIT 512KB FLASH 144LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

MC908LJ12CFUER

NXP

IC MCU 8BIT 12KB FLASH 64QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: IRSCI, SPI
• Peripherals: LCD, LVD, POR, PWM
• Number of I/O: 32
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

封装: 64-QFP

MK10DN64VLF5

NXP

IC MCU 32BIT 64KB FLASH 48LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 33
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 16x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

ADC1210S125HN/C1:5

NXP

ADC 12BIT SPI 125MSPS 40HVQFN

• Number of Bits: 12
• Sampling Rate (Per Second): 125M
• Number of Inputs: 1
• Input Type: Differential, Single Ended
• Data Interface: LVDS - Parallel, Parallel
• Configuration: S/H-ADC
• Ratio - S/H:ADC: 1:1
• Number of A/D Converters: 1
• Architecture: Pipelined
• Reference Type: External, Internal
• Voltage - Supply, Analog: 2.85 V ~ 3.4 V
• Voltage - Supply, Digital: 2.85 V ~ 3.4 V
• Features: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)
• Mounting Type: -

封装: 40-VFQFN Exposed Pad

PCK9447BD,157

NXP

IC CLK BUFFER 2:9 350MHZ 32LQFP

• Type: Fanout Buffer (Distribution), Multiplexer
• Number of Circuits: 1
• Ratio - Input:Output: 2:9
• Differential - Input:Output: No/No
• Input: LVCMOS
• Output: LVCMOS
• Frequency - Max: 350MHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

MPXAZ4115A6T1

NXP

PRESSURE SENS 16.7PSI MAX 8-SOP

• Pressure Type: Absolute
• Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.8 V
• Accuracy: ±1.5%
• Voltage - Supply: 4.85 V ~ 5.35 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD Module
• Supplier Device Package: -

封装: 8-SMD Module

T1040NSE7WQB

NXP

QORIQ 4X E5500 1500MHZ DDR3L/

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

封装: -

SPC5644BCF0VLU8R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z4d
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 147
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 27x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

封装: 176-LQFP

S912XD256F1CAG

NXP

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b, 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

NTS0302JKZ

NXP

IC VOLT TRANSLATOR X2SON8

• Logic Type: Translating Transceiver
• Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
• Number of Bits: 2
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-XFDFN
• Supplier Device Package: 8-X2SON (1.4x1)

封装: -

MC33FS6525LAE

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

封装: -

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SAF4000EL-103Q203K

NXP

IC

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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PWPR1516CALR

NXP

NO DESCRIPTION

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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NTS0102JKZ

NXP

IC TRANSLTR BIDIRECTIONAL 8XSON

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: 1.65 V ~ 3.6 V
• Voltage - VCCB: 2.3 V ~ 5.5 V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain, Push-Pull
• Data Rate: 50Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 8-XFDFN
• Supplier Device Package: 8-X2SON (1.35x1)

封装: -

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TFA9894UK-N2Z

NXP

5.6W/CLASS D/ I2S/TDM 10V BOOST

• Type: -
• Output Type: -
• Max Output Power x Channels @ Load: -
• Voltage - Supply: -
• Features: -
• Mounting Type: -
• Operating Temperature: -
• Supplier Device Package: -
• Package / Case: -

封装: -

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