页 105 - NXP 产品 | 深圳黑森尔电子
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NXP 产品

记录 26,590
页  105/887
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数量
PZM20NB1,115
NXP

DIODE ZENER 20V 300MW SMT3

  • Voltage - Zener (Nom) (Vz): 20V
  • Tolerance: ±2%
  • Power - Max: 300mW
  • Impedance (Max) (Zzt): 20 Ohms
  • Current - Reverse Leakage @ Vr: 70nA @ 15V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
封装: TO-236-3, SC-59, SOT-23-3
库存3,600
DC6M601X6/18S,135
NXP

IC REG BUCK 1.8V 0.65A 6WLCSP

  • Function: Step-Down
  • Output Configuration: Positive
  • Topology: Buck
  • Output Type: Fixed
  • Number of Outputs: 1
  • Voltage - Input (Min): 2.3V
  • Voltage - Input (Max): 5.5V
  • Voltage - Output (Min/Fixed): 1.8V
  • Voltage - Output (Max): -
  • Current - Output: 650mA
  • Frequency - Switching: 6MHz
  • Synchronous Rectifier: Yes
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 6-XFBGA, WLCSP
  • Supplier Device Package: 6-WLCSP (1.36x0.96)
封装: 6-XFBGA, WLCSP
库存4,016
hot MC33886PVW
NXP

IC MOTOR DRIVER PAR 20HSOP

  • Motor Type - Stepper: -
  • Motor Type - AC, DC: Brushed DC
  • Function: Driver - Fully Integrated, Control and Power Stage
  • Output Configuration: Half Bridge (2)
  • Interface: Parallel
  • Technology: CMOS
  • Step Resolution: -
  • Applications: General Purpose
  • Current - Output: 5A
  • Voltage - Supply: 5 V ~ 40 V
  • Voltage - Load: 5 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
  • Supplier Device Package: 20-HSOP
封装: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
库存16,260
SSTUA32866EC,518
NXP

IC BUFFER 1.8V 25BIT SOT536

  • Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
  • Supply Voltage: 1.7 V ~ 2 V
  • Number of Bits: 25, 14
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 96-LFBGA
  • Supplier Device Package: 96-LFBGA (13.5x5.5)
封装: 96-LFBGA
库存2,320
N74F269DB,112
NXP

IC COUNTER BIN BIDIR 24-SSOP

  • Logic Type: Binary Counter
  • Direction: Up, Down
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Reset: -
  • Timing: -
  • Count Rate: 115MHz
  • Trigger Type: Positive Edge
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 24-SSOP
封装: 24-SSOP (0.209", 5.30mm Width)
库存5,744
N74F827D,602
NXP

IC BUFF DVR TRI-ST 10BIT 24SOIC

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 10
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 24mA, 64mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 24-SO
封装: 24-SOIC (0.295", 7.50mm Width)
库存4,896
TDA1519CJ/N3C,112
NXP

IC AMP AUDIO PWR 22W MONO B 9SIL

  • Type: Class B
  • Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
  • Max Output Power x Channels @ Load: 22W x 1 @ 4 Ohm; 11W x 2 @ 2 Ohm
  • Voltage - Supply: 6 V ~ 17.5 V
  • Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type: Through Hole
  • Operating Temperature: -25°C ~ 150°C (TJ)
  • Supplier Device Package: 9-SIL
  • Package / Case: 9-SIP
封装: 9-SIP
库存5,136
UJA1079ATW/3V3,118
NXP

IC SBC LIN 3.3V 32HTSSOP

  • Applications: Automotive
  • Interface: SPI Serial
  • Voltage - Supply: 4.5 V ~ 28 V
  • Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
  • Supplier Device Package: 32-HTSSOP
  • Mounting Type: Surface Mount
封装: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
库存6,432
PCA9515AD,112
NXP

IC REDRIVER I2C 1CH 400KHZ 8SO

  • Type: Buffer, ReDriver
  • Applications: I2C
  • Input: 2-Wire Bus
  • Output: 2-Wire Bus
  • Data Rate (Max): 400kHz
  • Number of Channels: 1
  • Delay Time: -
  • Signal Conditioning: -
  • Capacitance - Input: 6pF
  • Voltage - Supply: 2.3 V ~ 3.6 V
  • Current - Supply: 800µA
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: -
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
封装: 8-SOIC (0.154", 3.90mm Width)
库存20,172
T2080NXN7PTB
NXP

IC SOC 64BIT 8X1.5GHZ 896FCBGA

  • Core Processor: PowerPC e6500
  • Number of Cores/Bus Width: 4 Core, 64-Bit
  • Speed: 1.8GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 896-FBGA, FCBGA
  • Supplier Device Package: 896-FCPBGA (25x25)
封装: 896-FBGA, FCBGA
库存2,480
MPC8572LVTAULE
NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.333GHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1023-BFBGA, FCBGA
  • Supplier Device Package: 1023-FCPBGA (33x33)
封装: 1023-BFBGA, FCBGA
库存2,624
XC850DECZT50BUR2
NXP

IC MPU MPC8XX 50MHZ 256BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 50MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (23x23)
封装: 256-BBGA
库存6,256
MCIMX6Q4AVT08AC
NXP

IC MPU I.MX6Q 852MHZ 624FCBGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 4 Core, 32-Bit
  • Speed: 852MHZ
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-FBGA, FCBGA
  • Supplier Device Package: 624-FCBGA (21x21)
封装: 624-FBGA, FCBGA
库存6,688
hot MC9S12E256MFUE
NXP

IC MCU 16BIT 256KB FLASH 80QFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: EBI/EMI, I2C, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 60
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
  • Data Converters: A/D 16x10b; D/A 2x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
封装: 80-QFP
库存4,944
MC9S12XA256CAL
NXP

IC MCU 16BIT 256KB FLASH 112LQFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: EBI/EMI, I2C, IrDA, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
封装: 112-LQFP
库存5,296
LPC1112FHN24/202J
NXP

IC MCU 32BIT 16KB FLASH 24HVQFN

  • Core Processor: ARM? Cortex?-M0
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 19
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 6x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-HVQFN (4x4)
封装: 24-VFQFN Exposed Pad
库存3,744
hot MK30DX256VLL7
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 72MHz
  • Connectivity: CAN, I2C, IrDA, SD, SPI, UART/USART
  • Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Number of I/O: 70
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 38x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封装: 100-LQFP
库存5,040
hot MMC2114CFCAG33
NXP

IC MCU 32BIT 256KB FLASH 144LQFP

  • Core Processor: M210
  • Core Size: 32-Bit
  • Speed: 33MHz
  • Connectivity: EBI/EMI, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 67
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封装: 144-LQFP
库存6,832
PCF85063TP/1Z
NXP

IC RTC CLK/CALENDAR I2C 8-SON

  • Type: Clock/Calendar
  • Features: Alarm, Leap Year, Square Wave Output
  • Memory Size: -
  • Time Format: HH:MM:SS (12/24 hr)
  • Date Format: YY-MM-DD-dd
  • Interface: I2C, 2-Wire Serial
  • Voltage - Supply: 0.9 V ~ 5.5 V
  • Voltage - Supply, Battery: -
  • Current - Timekeeping (Max): 0.6µA @ 3.3V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-WFDFN Exposed Pad
  • Supplier Device Package: 8-HWSON (2x3)
封装: 8-WFDFN Exposed Pad
库存966,750
PCA2002TK/1,118
NXP

IC WATCH CIRCUIT 10HVSON

  • PLL: No
  • Main Purpose: Battery operated wrist watches
  • Input: Crystal
  • Output: -
  • Number of Circuits: 1
  • Ratio - Input:Output: 1:2
  • Differential - Input:Output: No/No
  • Frequency - Max: 32kHz
  • Voltage - Supply: 1.1 V ~ 3.6 V
  • Operating Temperature: -10°C ~ 60°C
  • Mounting Type: Surface Mount
  • Package / Case: 10-VFDFN Exposed Pad
  • Supplier Device Package: 10-HVSON (3x3)
封装: 10-VFDFN Exposed Pad
库存2,768
MC33FS6523CAE
NXP

SYSTEM BASIS CHIP DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
封装: 48-LQFP Exposed Pad
库存6,132
TEA19031AOT/1J
NXP

SMART CHARGING PROTOCOL CONTR US

  • Output Isolation: -
  • Internal Switch(s): -
  • Voltage - Breakdown: -
  • Topology: -
  • Voltage - Start Up: -
  • Voltage - Supply (Vcc/Vdd): -
  • Duty Cycle: -
  • Frequency - Switching: -
  • Power (Watts): -
  • Fault Protection: -
  • Control Features: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
  • Mounting Type: -
封装: -
库存7,472
MCIMX6D4AVT10AE
NXP

I.MX6D ROM PERF ENHAN

  • Core Processor: ARM® Cortex®-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 624-FBGA, FCBGA
  • Supplier Device Package: 624-FCBGA (21x21)
封装: 624-FBGA, FCBGA
库存4,944
MC56F82643VLC
NXP

IC DSC 32-BIT 32-LQFP

  • Core Processor: 56800EX
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: SCI
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 26
  • Program Memory Size: 64KB (32K x 16)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
  • Data Converters: A/D 6x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
封装: 32-LQFP
库存5,040
S912XDG128F2MALR
NXP

16-BIT MCU S12X CORE 128KB FLA

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: CANbus, I²C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 91
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 12K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 8x10b, 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
封装: 112-LQFP
库存6,096
MC34PF8100EPEP
NXP

IC POWER MANAGEMENT I.MX8QM

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.7V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封装: 56-VFQFN Exposed Pad
库存3,504
TJA1463ATK-S1Z
NXP

IC TRANSCEIVER HALF 1/1 14HVSON

  • Type: Transceiver
  • Protocol: CANbus
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: 100 mV
  • Data Rate: 8Mbps
  • Voltage - Supply: 4.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 14-VDFN Exposed Pad
  • Supplier Device Package: 14-HVSON (3x4.5)
封装: -
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FD32K142HRT0VLHT
NXP

S32K142 32-BIT MCU, ARM CORTEX-M

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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MIMXRT1176AVM8AR
NXP

IC MCU 32BIT EXT MEM 289MAPBGA

  • Core Processor: ARM® Cortex®-M4, Cortex®-M7
  • Core Size: 32-Bit Dual-Core
  • Speed: 400MHz, 800MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
  • Number of I/O: 13
  • Program Memory Size: -
  • Program Memory Type: External Program Memory
  • EEPROM Size: -
  • RAM Size: 2M x 8
  • Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
  • Data Converters: A/D 20x12b SAR; D/A 1x12b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 289-LFBGA
  • Supplier Device Package: 289-LFBGA (14x14)
封装: -
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LPC5526JEV98Y
NXP

IC MCU 32BIT 256KB FLASH 98VFBGA

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit Single-Core
  • Speed: 150MHz
  • Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
  • Number of I/O: 64
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 144K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 10x16b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 98-VFBGA
  • Supplier Device Package: 98-VFBGA (7x7)
封装: -
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