图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 516-BBGA |
库存4,880 |
|
32-Bit | 264MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 516-BBGA |
库存4,208 |
|
32-Bit | 264MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 516-BBGA |
库存3,328 |
|
32-Bit | 264MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
4M FLASH 256K RAM Z7 264MHZ
|
封装: 416-BBGA |
库存2,100 |
|
32-Bit | 264MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存2,176 |
|
32-Bit | 264MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存6,400 |
|
32-Bit | 264MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存5,776 |
|
32-Bit | 264MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存2,784 |
|
32-Bit | 144MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 516-BBGA |
库存3,712 |
|
32-Bit | 200MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存3,024 |
|
32-Bit | 144MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存4,192 |
|
32-Bit | 132MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存4,720 |
|
32-Bit | 132MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 105°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存5,664 |
|
32-Bit | 132MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存3,328 |
|
32-Bit | 132MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 105°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存4,144 |
|
32-Bit Dual-Core | 180MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | - | 6MB (6M x 8) | FLASH | - | 384K x 8 | 1.14 V ~ 1.32 V | A/D 64x12b | Internal | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
TELEMATICS PROCESSOR W/O MBX GRA
|
封装: 516-BBGA Exposed Pad |
库存6,416 |
|
32-Bit | 400MHz | CANbus, EBI/EMI, Ethernet, I²C, USB OTG | DMA, WDT | 147 | - | ROMless | - | 128K x 8 | 1.08 V ~ 3.6 V | - | External | -40°C ~ 85°C (TA) | - | 516-BBGA Exposed Pad | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 516-BBGA |
库存4,560 |
|
32-Bit | 200MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存4,016 |
|
32-Bit | 112MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
3M FLASH 256K RAM Z7 200MHZ
|
封装: 416-BBGA |
库存3,888 |
|
32-Bit | 200MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存7,456 |
|
32-Bit | 200MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存4,272 |
|
32-Bit | 80MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
3M FLASH 256K RAM Z7 200MHZ
|
封装: 416-BBGA |
库存9,672 |
|
32-Bit | 200MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存4,032 |
|
32-Bit | 200MHz | CANbus, SCI, SPI | DMA, POR, PWM | 32 | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.08 V ~ 5.25 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存6,240 |
|
32-Bit | 80MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | 256 | 3MB (3M x 8) | FLASH | - | 128K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存5,616 |
|
32-Bit | 132MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM, WDT | 256 | 2MB (2M x 8) | FLASH | - | 64K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |
||
NXP |
NXP 32-BIT MCU QUAD POWER ARCH
|
封装: 512-FBGA |
库存7,728 |
|
32-Bit Tri-Core | 300MHz | CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART | DMA, LVD, POR, Zipwire | - | 8.64MB (8M x 8) | FLASH | - | 404K x 8 | 3 V ~ 5.5 V | A/D 12b SAR, 16b Sigma-Delta | Internal | -40°C ~ 125°C (TA) | - | 512-FBGA | 512-TEPBGA (25x25) |
||
NXP |
TRIPLE CORE 6M FLASH
|
封装: 324-LBGA |
库存6,432 |
|
32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 246 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3 V ~ 5.5 V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | 324-LBGA | 324-MAPBGA (19x19) |
||
NXP |
POWER ARCH CORES 8MB FL
|
封装: 516-BGA |
库存7,904 |
|
32-Bit Tri-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | - | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 16b Sigma-Delta, eQADC | Internal | -40°C ~ 125°C (TA) | - | 516-BGA | 516-MAPBGA (27x27) |
||
NXP |
POWER ARCH CORES 8MB FL
|
封装: 416-BGA |
库存3,792 |
|
32-Bit Tri-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | - | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3 V ~ 5.5 V | A/D 16b Sigma-Delta, eQADC | Internal | -40°C ~ 125°C (TA) | - | 416-BGA | 416-MAPBGA (27x27) |
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 416-BBGA |
库存2,768 |
|
32-Bit | 112MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM, WDT | 256 | 2MB (2M x 8) | FLASH | - | 64K x 8 | 1.35 V ~ 1.65 V | A/D 40x12b | External | -40°C ~ 125°C (TA) | - | 416-BBGA | 416-PBGA (27x27) |