图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
---|---|---|---|---|---|---|
NXP |
MOSFET N-CH 25V 75A DPAK
|
封装: TO-252-3, DPak (2 Leads + Tab), SC-63 |
库存6,624 |
|
||
NXP |
DIODE ZENER TO-236AB SOT23
|
封装: TO-236-3, SC-59, SOT-23-3 |
库存7,536 |
|
||
NXP |
IC REG BUCK 2.85V 0.65A 6WLCSP
|
封装: 6-XFBGA, WLCSP |
库存4,896 |
|
||
NXP |
IC REG BCK PROG 0.5A SYNC 6WLCSP
|
封装: 6-XFBGA, WLCSP |
库存7,168 |
|
||
NXP |
IC D-TYPE POS TRG SNGL 20DIP
|
封装: 20-DIP (0.300", 7.62mm) |
库存4,464 |
|
||
NXP |
IC COMPARATOR IDENTITY 8B 20SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存6,528 |
|
||
NXP |
IC DVI HDMI INTERFACE 38TSSOP
|
封装: 38-TFSOP (0.173", 4.40mm Width) |
库存5,248 |
|
||
NXP |
IC SWITCH DETECT SPI 32-SOIC
|
封装: 32-BSSOP Exposed Pad |
库存96,000 |
|
||
NXP |
IC TXRX CAN 14SOIC
|
封装: 14-SOIC (0.154", 3.90mm Width) |
库存8,088 |
|
||
NXP |
IC MUX/DEMUX 8X1 16SOIC
|
封装: 16-SOIC (0.154", 3.90mm Width) |
库存3,136 |
|
||
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
封装: 425-FBGA |
库存3,392 |
|
||
NXP |
IC MPU MPC85XX 1.0GHZ 1023FCBGA
|
封装: 1023-BBGA, FCBGA |
库存6,432 |
|
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
封装: 783-BBGA, FCBGA |
库存5,568 |
|
||
NXP |
IC MCU 16BIT 256KB FLASH 112LQFP
|
封装: 112-LQFP |
库存6,144 |
|
||
NXP |
IC MCU 32BIT ROMLESS 196MAPBGA
|
封装: 196-LBGA |
库存7,296 |
|
||
NXP |
IC MCU 8BIT 60KB FLASH 44LQFP
|
封装: 44-LQFP |
库存5,280 |
|
||
NXP |
IC MCU 8BIT 16KB FLASH 48LQFP
|
封装: 48-LQFP |
库存15,000 |
|
||
NXP |
IC MCU 8BIT 16KB FLASH 20SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存31,440 |
|
||
NXP |
IC MCU 32BIT 128KB FLASH 64LQFP
|
封装: 64-LQFP |
库存7,120 |
|
||
NXP |
IC CLK BUFFER 2:10 1.5GHZ 32LQFP
|
封装: 32-LQFP |
库存4,400 |
|
||
NXP |
PRESSURE SENSOR ABS AXIAL 5-MPAK
|
封装: 5-SMD Module |
库存14,592 |
|
||
NXP |
SENS PRESSURE 1.45 PSI MAX 5MPAK
|
封装: 5-SMD Module |
库存4,734 |
|
||
NXP |
ACCELEROMETER
|
封装: - |
库存5,940 |
|
||
NXP |
ACCELEROMETER PSI5 16QFN
|
封装: - |
库存3,636 |
|
||
NXP |
IC SMPS CTRLR SMART CHRG HVSON16
|
封装: 16-VDFN Exposed Pad |
库存7,024 |
|
||
NXP |
ARIK-Q POP ROM PERF ENHA
|
封装: 569-LFBGA |
库存3,904 |
|
||
NXP |
I.MX 8MDUAL 17X17 NO LID 621FBGA
|
封装: 621-FBGA, FCBGA |
库存4,848 |
|
||
NXP |
NXP 32-BIT MCU POWER ARCH CORE
|
封装: 100-LQFP |
库存6,384 |
|
||
NXP |
16-BIT MCU S12X CORE 384KB FLA
|
封装: 80-QFP |
库存5,168 |
|
||
NXP |
IC MPU POWERQUICC II PRO 516PBGA
|
封装: 516-BBGA Exposed Pad |
库存3,360 |
|