NXP 产品

BUK9907-55ATE,127

NXP

MOSFET N-CH 55V 75A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 108nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 5836pF @ 25V
• Vgs (Max): ±15V
• FET Feature: Temperature Sensing Diode
• Power Dissipation (Max): 272W (Tc)
• Rds On (Max) @ Id, Vgs: 6.2 mOhm @ 50A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220-5
• Package / Case: TO-220-5

封装: TO-220-5

MRF9060LR1

NXP

FET RF 65V 945MHZ NI-360

• Transistor Type: LDMOS
• Frequency: 945MHz
• Gain: 17dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 450mA
• Power - Output: 60W
• Voltage - Rated: 65V
• Package / Case: NI-360
• Supplier Device Package: NI-360

封装: NI-360

MRF8P29300HSR6

NXP

FET RF 2CH 65V 2.9GHZ NI1230S

• Transistor Type: LDMOS (Dual)
• Frequency: 2.9GHz
• Gain: 13.3dB
• Voltage - Test: 30V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 320W
• Voltage - Rated: 65V
• Package / Case: NI-1230S
• Supplier Device Package: NI-1230S

封装: NI-1230S

BB202,135

NXP

DIODE VAR CAP 6V 10MA SOD523

• Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
• Capacitance Ratio: 2.5
• Capacitance Ratio Condition: C0.2/C2.3
• Voltage - Peak Reverse (Max): 6V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

封装: SC-79, SOD-523

LD6816CX4/25H,315

NXP

IC REG LINEAR 2.5V 150MA 4WLCSP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.5V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.075V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Transient Voltage
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-XFBGA, WLCSP
• Supplier Device Package: 4-WLCSP (0.76x0.76)

封装: 4-XFBGA, WLCSP

TDA8547TS/N1,112

NXP

IC AMP AUDIO PWR 1.2W AB 20SSOP

• Type: Class AB
• Output Type: 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 1.2W x 2 @ 8 Ohm
• Voltage - Supply: 2.2 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 20-SSOP
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)

封装: 20-LSSOP (0.173", 4.40mm Width)

PTN3356R1BSZ

NXP

IC DISPLAYPORT TO VGA 32HVQFN

• Applications: DisplayPort
• Interface: -
• Voltage - Supply: 2.8 V ~ 3.6 V
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)
• Mounting Type: Surface Mount

封装: 32-VFQFN Exposed Pad

PCA9512BD,118

NXP

IC BUFFER I2C/SMBUS HOTSWAP 8SO

• Type: Buffer, Accelerator
• Applications: I2C - Hotswap
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 1
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 10pF
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: 1.8mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

封装: 8-SOIC (0.154", 3.90mm Width)

PCA9618UKZ

NXP

IC BUS REPEATER FM 4WLCSP

• Type: Buffer, ReDriver
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): -
• Number of Channels: 1
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 7pF
• Voltage - Supply: 2.2 V ~ 5.5 V
• Current - Supply: 1.7mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 4-UFBGA, WLCSP
• Supplier Device Package: 4-WLCSP (0.83x0.78)

封装: 4-UFBGA, WLCSP

MC145012P

NXP

IC SMOKE DETECTOR WITH I/O 16DIP

• Type: Smoke Detector
• Input Type: Photoelectric
• Output Type: Voltage
• Interface: -
• Current - Supply: 8µA
• Operating Temperature: -10°C ~ 60°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-PDIP

封装: 16-DIP (0.300", 7.62mm)

MC34901WNEF

NXP

CANHS 8SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封装: -

KMC68EN360RC33L

NXP

IC MPU M683XX 33MHZ 241PGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 241-BEPGA
• Supplier Device Package: 241-PGA (47.24x47.24)

封装: 241-BEPGA

MPC852TZT66A

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

封装: 256-BBGA

LPC812M101FDH16FP

NXP

IC MCU 32BIT 16KB FLASH 16TSSOP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 30MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 14
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

封装: 16-TSSOP (0.173", 4.40mm Width)

S9S08DZ32F1MLC

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

S9S12P96J0MFTR

NXP

IC MCU 16BIT 96KB FLASH 48QFN

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

封装: 48-VFQFN Exposed Pad

MC56F8035VLD

NXP

IC MCU 16BIT 64KB FLASH 44LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

封装: 44-LQFP

MPC555LFMVR40

NXP

IC MCU 32BIT 448KB FLASH 272BGA

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 101
• Program Memory Size: 448KB (448K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 26K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 272-BBGA
• Supplier Device Package: 272-PBGA (27x27)

封装: 272-BBGA

MCF5307AI90B

NXP

IC MCU 32BIT ROMLESS 208FQFP

• Core Processor: Coldfire V3
• Core Size: 32-Bit
• Speed: 90MHz
• Connectivity: EBI/EMI, I2C, UART/USART
• Peripherals: DMA, POR, WDT
• Number of I/O: 16
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-FQFP (28x28)

封装: 208-BFQFP

MKE02Z64VLC4

NXP

IC MCU 32BIT 64KB FLASH 32LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: LVD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 2x6b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

IP4286CZ6-TTY,125

NXP

TVS DIODE 6TSSOP

• Type: Steering (Rail to Rail)
• Unidirectional Channels: 4
• Bidirectional Channels: -
• Voltage - Reverse Standoff (Typ): -
• Voltage - Breakdown (Min): 6V
• Voltage - Clamping (Max) @ Ipp: -
• Current - Peak Pulse (10/1000µs): -
• Power - Peak Pulse: -
• Power Line Protection: Yes
• Applications: General Purpose
• Capacitance @ Frequency: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

封装: 6-TSSOP, SC-88, SOT-363

MPXV5100GC7U

NXP

PRESSURE SENSOR SILICON 8-DIP

• Pressure Type: Vented Gauge
• Operating Pressure: 14.5 PSI (100 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±2.5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.17mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-DIP (0.550", 13.97mm), Top Port
• Supplier Device Package: 8-DIP

封装: 8-DIP (0.550", 13.97mm), Top Port

OM7608/BGA2716

NXP

EVAL BOARD FOR BGA2716

• Type: Amplifier
• Frequency: 50MHz ~ 3.6GHz
• For Use With/Related Products: BGA2716
• Supplied Contents: Board

封装: -

P1020-WLAN

NXP

P1020-WLAN WIRESS LAN

• Type: Transceiver; 802.11 a/b/g/n (Wi-Fi, WiFi, WLAN)
• Frequency: 2.4GHz
• For Use With/Related Products: P1020
• Supplied Contents: Board

封装: -

MC33FS6503NAE

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP Exposed Pad

MC35FS6511NAER2

NXP

FS6500

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP Exposed Pad

NX30P6090UKZ

NXP

I2C CONTROLLED OVP LOAD SWITCH

• Switch Type: -
• Number of Outputs: -
• Ratio - Input:Output: -
• Output Configuration: -
• Output Type: -
• Interface: -
• Voltage - Load: -
• Voltage - Supply (Vcc/Vdd): -
• Current - Output (Max): -
• Rds On (Typ): -
• Input Type: -
• Features: -
• Fault Protection: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封装: -

MC50XS4200CEKR2

NXP

IC SWITCH HISD 24V DUAL 32SOIC

• Switch Type: -
• Number of Outputs: -
• Ratio - Input:Output: -
• Output Configuration: -
• Output Type: -
• Interface: -
• Voltage - Load: -
• Voltage - Supply (Vcc/Vdd): -
• Current - Output (Max): -
• Rds On (Typ): -
• Input Type: -
• Features: -
• Fault Protection: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封装: -

SPC5777CLK3MME3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

• Core Processor: e200z7
• Core Size: 32-Bit Tri-Core
• Speed: 264MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
• Peripherals: DMA, LVD, POR, Zipwire
• Number of I/O: -
• Program Memory Size: 8MB (8M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16b Sigma-Delta, eQADC
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BGA
• Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

S912XEQ512J2MAA

NXP

16-BIT MCU S12X CORE 512KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

封装: 80-QFP