页 436 - NXP 产品 | 黑森尔电子

零件编号	制造商	描述	封装	库存
PZM24NB3,115	NXP	DIODE ZENER 24V 300MW SMT3 Voltage - Zener (Nom) (Vz): 24V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 30 Ohms Current - Reverse Leakage @ Vr: 70nA @ 19V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	封装: TO-236-3, SC-59, SOT-23-3	库存4,464
SSL21153T/1,118	NXP	IC LED DRIVER RGLTR 1.5A 7SOIC Type: DC DC Regulator Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost) Internal Switch(s): Yes Number of Outputs: 1 Voltage - Supply (Min): - Voltage - Supply (Max): 35V Voltage - Output: - Current - Output / Channel: 1.5A (Switch) Frequency: 50.5kHz Dimming: - Applications: - Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) 7 leads Supplier Device Package: 7-SOIC	封装: 8-SOIC (0.154", 3.90mm Width) 7 leads	库存7,648
74AHC259D,118	NXP	IC 8BIT ADDRESSABLE LATCH 16SOIC Logic Type: D-Type, Addressable Circuit: 1:8 Output Type: Standard Voltage - Supply: 2 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 4.1ns Current - Output High, Low: 8mA, 8mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封装: 16-SOIC (0.154", 3.90mm Width)	库存5,952
74HC240N,652	NXP	IC BUFFER/LINE DVR OCT 20DIP Logic Type: Buffer, Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 7.8mA, 7.8mA Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	封装: 20-DIP (0.300", 7.62mm)	库存5,072
BGO807CE/SC0,112	NXP	IC AMP MODULE RCVR CATV SOT115X Applications: CATV Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 190mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: - Package / Case: SOT-115X Supplier Device Package: SOT115X	封装: SOT-115X	库存6,992
SC16C752BIB48,157	NXP	IC UART DUAL W/FIFO 48-LQFP Features: - Number of Channels: 2, DUART FIFO's: 64 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP	库存17,232
P1014NXN5HFA	NXP	IC MPU Q OR IQ 800MHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	封装: 425-FBGA	库存5,984
MPC8536CVTAQGA	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封装: 783-BBGA, FCBGA	库存2,256
MPC8379ECVRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封装: 689-BBGA Exposed Pad	库存5,232
MC7448VU1250ND	NXP	IC MPU MPC74XX 1.25GHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	封装: 360-CBGA, FCCBGA	库存5,520
MCIMX507CVM1BR2	NXP	IC MPU I.MX50 800MHZ 400MAPBGA Core Processor: ARM? Cortex?-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Secure JTAG Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	封装: 400-LFBGA	库存2,720
MC9S08SH32VTG	NXP	IC MCU 8BIT 32KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 13 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封装: 16-TSSOP (0.173", 4.40mm Width)	库存3,632
MC56F8167VVFE	NXP	IC MCU 16BIT 512KB FLASH 160BGA Core Processor: 56800E Core Size: 16-Bit Speed: 40MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 76 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 16 Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 160-BGA Supplier Device Package: 160-MAPBGA (15x15)	封装: 160-BGA	库存7,728
S912ZVH128F2VLQ	NXP	IC MCU 16BIT 128KB FLASH 144LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封装: 144-LQFP	库存5,680
S9S08DZ60F2MLC	NXP	IC MCU 8BIT 60KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封装: 32-LQFP	库存130,500
S9S12GN48F0CLH	NXP	IC MCU 16BIT 48KB FLASH 64LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封装: 64-LQFP	库存3,184
MKV31F512VLH12	NXP	IC MCU 32BIT 512KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 46 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 24x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封装: 64-LQFP	库存5,904
MKE04Z64VLD4	NXP	IC MCU 32BIT 64KB FLASH 44LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 38 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	封装: 44-LQFP	库存16,302
MC68331CEH16	NXP	IC MCU 32BIT ROMLESS 132QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 16MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 18 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	封装: 132-BQFP Bumpered	库存8,436
MSC8144VT800B	NXP	ENCRYPTION PACSUN R2.1 783FCBGA Type: SC3400 Core Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA Clock Rate: 800MHz Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封装: 783-BBGA, FCBGA	库存2,928
DSPB56362AG120	NXP	IC DSP 24BIT AUD 120MHZ 144-LQFP Type: Audio Processor Interface: Host Interface, I2C, SAI, SPI Clock Rate: 120MHz Non-Volatile Memory: ROM (126 kB) On-Chip RAM: 42kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封装: 144-LQFP	库存50,196
MC100ES6210AC	NXP	IC CLK BUFFER 1:5 3GHZ 32LQFP Type: Fanout Buffer (Distribution) Number of Circuits: 2 Ratio - Input:Output: 1:5 Differential - Input:Output: Yes/Yes Input: ECL, PECL Output: ECL, PECL Frequency - Max: 3GHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: 0°C ~ 110°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封装: 32-LQFP	库存3,056
MF1S5000XDA8/V1J	NXP	MIFARE CLASSIC SMART CARD IC Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443, MIFARE Interface: UART Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: MOA8, Smart Card Module Supplier Device Package: PLLMC	封装: MOA8, Smart Card Module	库存7,128
JN5139-001-M/00R1T	NXP	RF TXRX MOD 802.15.4 TRACE ANT RF Family/Standard: 802.15.4 Protocol: Zigbee? Modulation: - Frequency: 2.4GHz Data Rate: - Power - Output: 2.5dBm Sensitivity: -96dBm Serial Interfaces: I2C, SPI, UART Antenna Type: Integrated, Trace Memory Size: 192kB ROM, 96kB RAM Voltage - Supply: 2.2 V ~ 3.6 V Current - Receiving: 37mA Current - Transmitting: 37mA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Package / Case: Module	封装: Module	库存6,912
JN5169-001-M06-2Z	NXP	JN5169-001-M06-2 ZIGBEE 3.0, ZIG RF Family/Standard: 802.15.4 Protocol: Zigbee? Modulation: - Frequency: 2.4GHz ~ 2.5GHz Data Rate: - Power - Output: 10dBm Sensitivity: -96dBm Serial Interfaces: I2C, SPI, UART Antenna Type: Not Included, U.FL Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM Voltage - Supply: 2 V ~ 3.6 V Current - Receiving: 21.5mA Current - Transmitting: 153mA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Package / Case: 27-SMD Module	封装: 27-SMD Module	库存10,464
MC33PF3000A4ESR2	NXP	POWER MANAGEMENT IC I.MX7 PRE- Applications: i.MX Processors Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	封装: 48-VFQFN Exposed Pad	库存5,008
MPC5554MZP112	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z6 Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 256 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	封装: 416-BBGA	库存2,768
S912XEP100J4CVL	NXP	16-BIT MCU S12X CORE 1MB FLASH Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 152 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 32x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	封装: 208-BGA	库存5,520
S9S08DZ32F2CLFR	NXP	8-BIT MCU S08 CORE 32KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封装: 48-LQFP	库存3,216
TJA1128ETK/0Z	NXP	IC TRANSCEIVER FULL 1/1 14HVSON Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: - Data Rate: 20kBd Voltage - Supply: 5V ~ 28V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5)	封装: 14-VDFN Exposed Pad	库存6,960

PZM24NB3,115

NXP

DIODE ZENER 24V 300MW SMT3

Voltage - Zener (Nom) (Vz): 24V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 30 Ohms
Current - Reverse Leakage @ Vr: 70nA @ 19V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

封装: TO-236-3, SC-59, SOT-23-3

库存4,464

SSL21153T/1,118

NXP

IC LED DRIVER RGLTR 1.5A 7SOIC

Type: DC DC Regulator
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Internal Switch(s): Yes
Number of Outputs: 1
Voltage - Supply (Min): -
Voltage - Supply (Max): 35V
Voltage - Output: -
Current - Output / Channel: 1.5A (Switch)
Frequency: 50.5kHz
Dimming: -
Applications: -
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width) 7 leads
Supplier Device Package: 7-SOIC

封装: 8-SOIC (0.154", 3.90mm Width) 7 leads

库存7,648

74AHC259D,118

NXP

IC 8BIT ADDRESSABLE LATCH 16SOIC

Logic Type: D-Type, Addressable
Circuit: 1:8
Output Type: Standard
Voltage - Supply: 2 V ~ 5.5 V
Independent Circuits: 1
Delay Time - Propagation: 4.1ns
Current - Output High, Low: 8mA, 8mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封装: 16-SOIC (0.154", 3.90mm Width)

库存5,952

74HC240N,652

NXP

IC BUFFER/LINE DVR OCT 20DIP

Logic Type: Buffer, Inverting
Number of Elements: 2
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 7.8mA, 7.8mA
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

封装: 20-DIP (0.300", 7.62mm)

库存5,072

BGO807CE/SC0,112

NXP

IC AMP MODULE RCVR CATV SOT115X

Applications: CATV
Output Type: -
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 190mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): -
Mounting Type: -
Package / Case: SOT-115X
Supplier Device Package: SOT115X

封装: SOT-115X

库存6,992

SC16C752BIB48,157

NXP

IC UART DUAL W/FIFO 48-LQFP

Features: -
Number of Channels: 2, DUART
FIFO's: 64 Byte
Protocol: -
Data Rate (Max): 5Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

库存17,232

P1014NXN5HFA

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA I (19x19)

封装: 425-FBGA

库存5,984

MPC8536CVTAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封装: 783-BBGA, FCBGA

库存2,256

MPC8379ECVRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (4)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封装: 689-BBGA Exposed Pad

库存5,232

MC7448VU1250ND

NXP

IC MPU MPC74XX 1.25GHZ 360FCCBGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.25GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-CBGA, FCCBGA
Supplier Device Package: 360-FCCBGA (25x25)

封装: 360-CBGA, FCCBGA

库存5,520

MCIMX507CVM1BR2

NXP

IC MPU I.MX50 800MHZ 400MAPBGA

Core Processor: ARM? Cortex?-A8
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: Boot Security, Cryptography, Secure JTAG
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

封装: 400-LFBGA

库存2,720

MC9S08SH32VTG

NXP

IC MCU 8BIT 32KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 13
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封装: 16-TSSOP (0.173", 4.40mm Width)

库存3,632

MC56F8167VVFE

NXP

IC MCU 16BIT 512KB FLASH 160BGA

Core Processor: 56800E
Core Size: 16-Bit
Speed: 40MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 76
Program Memory Size: 512KB (256K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 16
Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 160-BGA
Supplier Device Package: 160-MAPBGA (15x15)

封装: 160-BGA

库存7,728

S912ZVH128F2VLQ

NXP

IC MCU 16BIT 128KB FLASH 144LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

库存5,680

S9S08DZ60F2MLC

NXP

IC MCU 8BIT 60KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

库存130,500

S9S12GN48F0CLH

NXP

IC MCU 16BIT 48KB FLASH 64LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

库存3,184

MKV31F512VLH12

NXP

IC MCU 32BIT 512KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Number of I/O: 46
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 24x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封装: 64-LQFP

库存5,904

MKE04Z64VLD4

NXP

IC MCU 32BIT 64KB FLASH 44LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Number of I/O: 38
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b, D/A 2x6b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

封装: 44-LQFP

库存16,302

MC68331CEH16

NXP

IC MCU 32BIT ROMLESS 132QFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 16MHz
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 18
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

封装: 132-BQFP Bumpered

库存8,436

MSC8144VT800B

NXP

ENCRYPTION PACSUN R2.1 783FCBGA

Type: SC3400 Core
Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
Clock Rate: 800MHz
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Operating Temperature: 0°C ~ 90°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封装: 783-BBGA, FCBGA

库存2,928

DSPB56362AG120

NXP

IC DSP 24BIT AUD 120MHZ 144-LQFP

Type: Audio Processor
Interface: Host Interface, I2C, SAI, SPI
Clock Rate: 120MHz
Non-Volatile Memory: ROM (126 kB)
On-Chip RAM: 42kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

库存50,196

MC100ES6210AC

NXP

IC CLK BUFFER 1:5 3GHZ 32LQFP

Type: Fanout Buffer (Distribution)
Number of Circuits: 2
Ratio - Input:Output: 1:5
Differential - Input:Output: Yes/Yes
Input: ECL, PECL
Output: ECL, PECL
Frequency - Max: 3GHz
Voltage - Supply: 2.375 V ~ 3.465 V
Operating Temperature: 0°C ~ 110°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封装: 32-LQFP

库存3,056

MF1S5000XDA8/V1J

NXP

MIFARE CLASSIC SMART CARD IC

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443, MIFARE
Interface: UART
Voltage - Supply: -
Operating Temperature: -25°C ~ 70°C
Package / Case: MOA8, Smart Card Module
Supplier Device Package: PLLMC

封装: MOA8, Smart Card Module

库存7,128

JN5139-001-M/00R1T

NXP

RF TXRX MOD 802.15.4 TRACE ANT

RF Family/Standard: 802.15.4
Protocol: Zigbee?
Modulation: -
Frequency: 2.4GHz
Data Rate: -
Power - Output: 2.5dBm
Sensitivity: -96dBm
Serial Interfaces: I2C, SPI, UART
Antenna Type: Integrated, Trace
Memory Size: 192kB ROM, 96kB RAM
Voltage - Supply: 2.2 V ~ 3.6 V
Current - Receiving: 37mA
Current - Transmitting: 37mA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Package / Case: Module

封装: Module

库存6,912

JN5169-001-M06-2Z

NXP

JN5169-001-M06-2 ZIGBEE 3.0, ZIG

RF Family/Standard: 802.15.4
Protocol: Zigbee?
Modulation: -
Frequency: 2.4GHz ~ 2.5GHz
Data Rate: -
Power - Output: 10dBm
Sensitivity: -96dBm
Serial Interfaces: I2C, SPI, UART
Antenna Type: Not Included, U.FL
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Voltage - Supply: 2 V ~ 3.6 V
Current - Receiving: 21.5mA
Current - Transmitting: 153mA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Package / Case: 27-SMD Module

封装: 27-SMD Module

库存10,464

MC33PF3000A4ESR2

NXP

POWER MANAGEMENT IC I.MX7 PRE-

Applications: i.MX Processors
Current - Supply: -
Voltage - Supply: 2.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

封装: 48-VFQFN Exposed Pad

库存5,008

MPC5554MZP112

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z6
Core Size: 32-Bit
Speed: 112MHz
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 256
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

库存2,768

S912XEP100J4CVL

NXP

16-BIT MCU S12X CORE 1MB FLASH

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 152
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 32x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 208-BGA
Supplier Device Package: 208-MAPBGA (17x17)

封装: 208-BGA

库存5,520

S9S08DZ32F2CLFR

NXP

8-BIT MCU S08 CORE 32KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封装: 48-LQFP

库存3,216

TJA1128ETK/0Z

NXP

IC TRANSCEIVER FULL 1/1 14HVSON

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: -
Data Rate: 20kBd
Voltage - Supply: 5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)

封装: 14-VDFN Exposed Pad

库存6,960