NXP 产品

MRF7S21110HSR5

NXP

FET RF 65V 2.17GHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 2.17GHz
• Gain: 17.3dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.1A
• Power - Output: 33W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

封装: NI-780S

MRF6S27085HR3

NXP

FET RF 68V 2.66GHZ NI-780

• Transistor Type: LDMOS
• Frequency: 2.66GHz
• Gain: 15.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 900mA
• Power - Output: 20W
• Voltage - Rated: 68V
• Package / Case: NI-780
• Supplier Device Package: NI-780

封装: NI-780

MRF6S19060NR1

NXP

FET RF 68V 1.93GHZ TO270-4

• Transistor Type: LDMOS
• Frequency: 1.93GHz
• Gain: 16dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 610mA
• Power - Output: 12W
• Voltage - Rated: 68V
• Package / Case: TO-270AB
• Supplier Device Package: TO-270 WB-4

封装: TO-270AB

MBC13900NT1

NXP

TRANS RF NPN LO NOISE SOT-343

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 6.5V
• Frequency - Transition: 15GHz
• Noise Figure (dB Typ @ f): 0.8dB ~ 1.1dB @ 900MHz ~ 1.9GHz
• Gain: 15dB ~ 22dB
• Power - Max: 188mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 2V
• Current - Collector (Ic) (Max): 20mA
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-82A, SOT-343
• Supplier Device Package: SOT-343

封装: SC-82A, SOT-343

PBR941,215

NXP

TRANSISTOR NPN UHF 50MA SOT23

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 10V
• Frequency - Transition: 8GHz
• Noise Figure (dB Typ @ f): 1.4dB ~ 2dB @ 1GHz ~ 2GHz
• Gain: -
• Power - Max: 360mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V
• Current - Collector (Ic) (Max): 50mA
• Operating Temperature: 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

封装: TO-236-3, SC-59, SOT-23-3

PZM9.1NB2A,115

NXP

DIODE ZENER 9.1V 220MW SMT3

• Voltage - Zener (Nom) (Vz): 9.1V
• Tolerance: ±2%
• Power - Max: 220mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 500nA @ 6V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

封装: TO-236-3, SC-59, SOT-23-3

NX1117CE18Z,115

NXP

IC REG LINEAR 1.8V 1A SOT223

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 20V
• Voltage - Output (Min/Fixed): 1.8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 1.2V @ 800mA
• Current - Output: 1A
• Current - Quiescent (Iq): -
• Current - Supply (Max): 6mA
• PSRR: 68dB (120Hz)
• Control Features: -
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TO-261-4, TO-261AA
• Supplier Device Package: SOT-223

封装: TO-261-4, TO-261AA

MC34PF3001A1EP

NXP

IC POWER MANAGEMENT 48QFN

• Applications: Processor
• Current - Supply: -
• Voltage - Supply: 2.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

封装: 48-VFQFN Exposed Pad

MCZ33879EK

NXP

IC SWITCH HI/LO SIDE 16B 32-SOIC

• Switch Type: General Purpose
• Number of Outputs: 8
• Ratio - Input:Output: 1:8
• Output Configuration: High Side or Low Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 5.5 V ~ 26.5 V
• Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V
• Current - Output (Max): 600mA
• Rds On (Typ): 750 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

封装: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

74HC03D/AUJ

NXP

IC GATE NAND 4CH 2-INP 14-SO

• Logic Type: NAND Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: Open Drain
• Voltage - Supply: 2 V ~ 6 V
• Current - Quiescent (Max): 2µA
• Current - Output High, Low: -, 5.2mA
• Logic Level - Low: 0.5 V ~ 1.8 V
• Logic Level - High: 1.5 V ~ 4.2 V
• Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

封装: 14-SOIC (0.154", 3.90mm Width)

74HCT27N,652

NXP

IC GATE NOR 3CH 3-INP 14-DIP

• Logic Type: NOR Gate
• Number of Circuits: 3
• Number of Inputs: 3
• Features: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): 2µA
• Current - Output High, Low: 4mA, 4mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Supplier Device Package: 14-DIP
• Package / Case: 14-DIP (0.300", 7.62mm)

封装: 14-DIP (0.300", 7.62mm)

74LVT273PW,112

NXP

IC D-TYPE POS TRG SNGL 20TSSOP

• Function: Master Reset
• Type: D-Type
• Output Type: Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 150MHz
• Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Iq): 190µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)

封装: 20-TSSOP (0.173", 4.40mm Width)

74HCT4016N,112

NXP

IC SWITCH QUAD SPST 14DIP

• Switch Circuit: SPST - NO
• Multiplexer/Demultiplexer Circuit: 1:1
• Number of Circuits: 2
• On-State Resistance (Max): 95 Ohm
• Channel-to-Channel Matching (ΔRon): 5 Ohm
• Voltage - Supply, Single (V+): 4.5 V ~ 5.5 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 30ns, 44ns
• -3db Bandwidth: 200MHz
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): 3.5pF
• Current - Leakage (IS(off)) (Max): 1µA
• Crosstalk: -60dB @ 1MHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-DIP

封装: 14-DIP (0.300", 7.62mm)

MPC8271CZQPIEA

NXP

IC MPU MPC82XX 300MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 300MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

封装: 516-BBGA

KMC68EN360VR33L

NXP

IC MPU M683XX 33MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

封装: 357-BBGA

MPC8245TZU350D

NXP

IC MPU MPC82XX 350MHZ 352TBGA

• Core Processor: PowerPC 603e
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 350MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 352-LBGA
• Supplier Device Package: 352-TBGA (35x35)

封装: 352-LBGA

MPC875ZT133

NXP

IC MPU MPC8XX 133MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 133MHz
• Co-Processors/DSP: Communications; CPM, Security; SEC
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: Cryptography
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

封装: 256-BBGA

MCIMX6S5EVM10ACR

NXP

IC MPU I.MX6S 1.0GHZ 624MAPBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-LFBGA
• Supplier Device Package: 624-MAPBGA (21x21)

封装: 624-LFBGA

MCIMX6Y2CVM08AA

NXP

I.MX 6ULL 800 MHZ INDUSTRIAL

• Core Processor: ARM? Cortex?-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON? MPE
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: Electrophoretic, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-MAPBGA (14x14)

封装: 289-LFBGA

SPC5777CK2MME3R

NXP

IC MCU 32BIT 8MB FLASH 416BGA

• Core Processor: e200z7
• Core Size: 32-Bit Tri-Core
• Speed: 264MHz
• Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
• Peripherals: DMA, LVD, POR, Zipwire
• Number of I/O: -
• Program Memory Size: 8MB (8M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16b Sigma-Delta, eQADC
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BGA
• Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

MC908QY4ACDTE

NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

封装: 16-TSSOP (0.173", 4.40mm Width)

MC908QY2AVDWER

NXP

IC MCU 8BIT 1.5KB FLASH 16SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

封装: 16-SOIC (0.295", 7.50mm Width)

MC68HC908QT1CP

NXP

IC MCU 8BIT 1.5KB FLASH 8DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM
• Number of I/O: 5
• Program Memory Size: 1.5KB (1.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

封装: 8-DIP (0.300", 7.62mm)

MC9S12E128MFUE

NXP

IC MCU 16BIT 128KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I2C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 60
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

封装: 80-QFP

MK20DX128VFT5

NXP

IC MCU 32BIT 128KB FLASH 48QFN

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 29
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 11x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

封装: 48-VFQFN Exposed Pad

SAC57D54HCVMO

NXP

IC MCU 32BIT 4MB FLASH 516MAPBGA

• Core Processor: ARM? Cortex?-A5, -M4, -M0+
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz, 160MHz, 320MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, LIN, SPI
• Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2.3M x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 516-BGA
• Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

MPXY8600DK6T1

NXP

IC PRESSURE SENSOR 32QFN

• Frequency: 315MHz, 434MHz
• Applications: TPM (Tire Pressure Monitor)
• Modulation or Protocol: FSK, OOK
• Data Rate (Max): -
• Power - Output: -
• Current - Transmitting: -
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Memory Size: 8kB Flash, 512B SRAM
• Features: -
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 32-QFN Exposed Pad

封装: 32-QFN Exposed Pad

TWR-KW21D256

NXP

TOWER SYSTEM KIT

• Type: Transceiver; 802.15.4
• Frequency: 2.4GHz
• For Use With/Related Products: KW2x
• Supplied Contents: Board, Cable

封装: -

SP5746CSK1AMMJ6R

NXP

32 BITDUAL CORE3M FLASH384 RA

• Core Processor: e200z2, e200z4
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz/160MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 178
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPPBGA (17x17)

封装: 256-LBGA

SPC5606BF1MLQ6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 121
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 15x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP