Intel 产品

N87C5833SF76

Intel

IC MCU 8BIT 32KB OTP 44PLCC

• Core Processor: MCS 51
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: SIO
• Peripherals: -
• Number of I/O: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC

封装: 44-LCC (J-Lead)

10AS032E4F29E3LG

Intel

780-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 320K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

EPF10K200SBC672-2X

Intel

IC FPGA

• Number of LABs/CLBs: 1248
• Number of Logic Elements/Cells: 9984
• Total RAM Bits: 98304
• Number of I/O: 470
• Number of Gates: 513000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 672-BBGA
• Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA

EP20K600EFC784-1

Intel

IC FPGA

• Number of LABs/CLBs: 2432
• Number of Logic Elements/Cells: 24320
• Total RAM Bits: 311296
• Number of I/O: -
• Number of Gates: 1537000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

EPF10K50ETC144-2

Intel

IC FPGA 102 I/O 144TQFP

• Number of LABs/CLBs: 360
• Number of Logic Elements/Cells: 2880
• Total RAM Bits: 40960
• Number of I/O: 102
• Number of Gates: 199000
• Voltage - Supply: 2.3 V ~ 2.7 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

封装: 144-LQFP

EPF10K40RC208-4

Intel

IC FPGA 147 I/O 208RQFP

• Number of LABs/CLBs: 288
• Number of Logic Elements/Cells: 2304
• Total RAM Bits: 16384
• Number of I/O: 147
• Number of Gates: 93000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 208-BFQFP Exposed Pad
• Supplier Device Package: 208-RQFP (28x28)

封装: 208-BFQFP Exposed Pad

EPF6016QI208-3

Intel

IC FPGA 171 I/O 208QFP

• Number of LABs/CLBs: 132
• Number of Logic Elements/Cells: 1320
• Total RAM Bits: -
• Number of I/O: 171
• Number of Gates: 16000
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

封装: 208-BFQFP

10M25DAF256C8G

Intel

IC FPGA 178 I/O 256FBGA

• Number of LABs/CLBs: 1563
• Number of Logic Elements/Cells: 25000
• Total RAM Bits: 691200
• Number of I/O: 178
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

封装: 256-LBGA

EP4CE6F17C8N

Intel

IC FPGA 179 I/O 256FBGA

• Number of LABs/CLBs: 392
• Number of Logic Elements/Cells: 6272
• Total RAM Bits: 276480
• Number of I/O: 179
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

封装: 256-LBGA

EP3SE260F1517C2N

Intel

IC FPGA 976 I/O 1517FBGA

• Number of LABs/CLBs: 10200
• Number of Logic Elements/Cells: 255000
• Total RAM Bits: 16672768
• Number of I/O: 976
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

EP3SE260F1152C4L

Intel

IC FPGA 744 I/O 1152FBGA

• Number of LABs/CLBs: 10200
• Number of Logic Elements/Cells: 255000
• Total RAM Bits: 16672768
• Number of I/O: 744
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

5SGSED6K1F40C2LN

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 220000
• Number of Logic Elements/Cells: 583000
• Total RAM Bits: 54553600
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

EP4SGX290NF45C3

Intel

IC FPGA 920 I/O 1932FBGA

• Number of LABs/CLBs: 11648
• Number of Logic Elements/Cells: 291200
• Total RAM Bits: 17661952
• Number of I/O: 920
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

封装: 1932-BBGA, FCBGA

5SGXEA5H2F35I3LN

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 53105664
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

5SGXEA3K3F35C2L

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 23704576
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

10AX066K2F35E2SG

Intel

IC FPGA 396 I/O 1152FCBGA

• Number of LABs/CLBs: 250540
• Number of Logic Elements/Cells: 660000
• Total RAM Bits: 49610752
• Number of I/O: 396
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

封装: 1152-BBGA, FCBGA

5AGXMB7G4F40I5

Intel

IC FPGA 704 I/O 1517FBGA

• Number of LABs/CLBs: 23780
• Number of Logic Elements/Cells: 504000
• Total RAM Bits: 27695104
• Number of I/O: 704
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA
• Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA

5SGXMB5R1F40C1N

Intel

IC FPGA 432 I/O 1517FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 48927744
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

EP2AGX190EF29I3N

Intel

IC FPGA 372 I/O 780FBGA

• Number of LABs/CLBs: 7612
• Number of Logic Elements/Cells: 181165
• Total RAM Bits: 10177536
• Number of I/O: 372
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

5AGTFC7H3F35I5N

Intel

IC FPGA 544 I/O 1152FBGA

• Number of LABs/CLBs: 11460
• Number of Logic Elements/Cells: 242000
• Total RAM Bits: 15470592
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA Exposed Pad
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA Exposed Pad

5AGXMB3G4F35C5N

Intel

IC FPGA 544 I/O 1152FBGA

• Number of LABs/CLBs: 17110
• Number of Logic Elements/Cells: 362000
• Total RAM Bits: 19822592
• Number of I/O: 544
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA Exposed Pad
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA Exposed Pad

10AX027H4F35I3SG

Intel

1152-PIN FBGA

• Number of LABs/CLBs: 101620
• Number of Logic Elements/Cells: 270000
• Total RAM Bits: 17870848
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

EP2AGX95DF25C6

Intel

IC FPGA 260 I/O 572FBGA

• Number of LABs/CLBs: 3747
• Number of Logic Elements/Cells: 89178
• Total RAM Bits: 6839296
• Number of I/O: 260
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 572-BGA, FCBGA
• Supplier Device Package: 572-FBGA, FC (25x25)

封装: 572-BGA, FCBGA

5CGXBC5C6F23C7N

Intel

IC FPGA 240 I/O 484FBGA

• Number of LABs/CLBs: 29080
• Number of Logic Elements/Cells: 77000
• Total RAM Bits: 5001216
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

5CEFA4F23C7N

Intel

IC FPGA 224 I/O 484FBGA

• Number of LABs/CLBs: 18480
• Number of Logic Elements/Cells: 49000
• Total RAM Bits: 3464192
• Number of I/O: 224
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

封装: 484-BGA

EPM7256AEFI256-7

Intel

IC CPLD 256MC 7.5NS 256FBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 5000
• Number of I/O: 164
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

封装: 256-BGA

EPM1270T144C3N

Intel

IC CPLD 980MC 6.2NS 144TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 6.2ns
• Voltage Supply - Internal: 2.5V, 3.3V
• Number of Logic Elements/Blocks: 1270
• Number of Macrocells: 980
• Number of Gates: -
• Number of I/O: 116
• Operating Temperature: 0°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

封装: 144-LQFP

EP4SGX110DF29I3G

Intel

IC FPGA 372 I/O 780FBGA

• Number of LABs/CLBs: 4224
• Number of Logic Elements/Cells: 105600
• Total RAM Bits: 9793536
• Number of I/O: 372
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

5AGXBA3D4F27C4G

Intel

IC FPGA 336 I/O 672FBGA

• Number of LABs/CLBs: 7362
• Number of Logic Elements/Cells: 156000
• Total RAM Bits: 11746304
• Number of I/O: 336
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA, FCBGA

5AGXBA1D4F31C4G

Intel

IC FPGA 384 I/O 896FBGA

• Number of LABs/CLBs: 3537
• Number of Logic Elements/Cells: 75000
• Total RAM Bits: 8666112
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FBGA (31x31)

封装: 896-BBGA, FCBGA