图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER
|
封装: - |
库存2,480 |
|
- | - | - | - | - | - |
||
NXP |
IC PMU I.MX51/37/35/27 139MAPBGA
|
封装: 139-TFBGA |
库存102,672 |
|
- | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
||
Texas Instruments |
IC CTRLR PROG REG 5BIT 20TSSOP
|
封装: 20-TSSOP (0.173", 4.40mm Width) |
库存6,160 |
|
2.5mA | 4.5 V ~ 5.5 V | 0°C ~ 125°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Holt Integrated Circuits Inc. |
LOW SIDE DRIVER
|
封装: 44-QFP |
库存4,480 |
|
10mA | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-QFP (10x10) |
||
NXP |
IC MULTI COIL 5W 5V 32QFN
|
封装: - |
库存5,712 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
IC TFT-LCD PWR SUPPLY 28TSSOP
|
封装: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
库存2,944 |
|
1.5mA | 3 V ~ 5.5 V, 4 V ~ 28 V | -40°C ~ 105°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) Exposed Pad | 28-TSSOP-EP |
||
Maxim Integrated |
IC REG LDO/SWITCH ADJ 16QSOP
|
封装: 16-LSSOP (0.154", 3.90mm Width) Exposed Pad |
库存30,000 |
|
2.1mA | 4.5 V ~ 18 V | -40°C ~ 105°C | Surface Mount | 16-LSSOP (0.154", 3.90mm Width) Exposed Pad | 16-QSOP-EP |
||
NXP |
IC SYSTEM BASIS CHIP LIN 32-LQFP
|
封装: 32-LQFP |
库存6,512 |
|
4.5mA | 5.5 V ~ 27 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Maxim Integrated |
IC XFRMR DRIVER RS485 8-SOIC
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存42,588 |
|
450µA | 3.3V, 5V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
FS4500
|
封装: 48-LQFP Exposed Pad |
库存6,288 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
封装: 48-LQFP Exposed Pad |
库存5,280 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
封装: 48-VFQFN Exposed Pad |
库存5,104 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC: 3 BUCK REGS
|
封装: 40-VFQFN Exposed Pad |
库存5,168 |
|
- | 3.8 V ~ 7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
||
Sipex |
LOW POWER MICROPROCESSOR SUPERVI
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
IC AC-DC CONTROLLER SOT25
|
封装: - |
Request a Quote |
|
200µA | 4.5V ~ 9V | -40°C ~ 85°C (TA) | Surface Mount | SC-74A, SOT-753 | SOT-25 |
||
STMicroelectronics |
FLEXIBLE U-CHIP FOR BRAKING & TR
|
封装: - |
Request a Quote |
|
- | 5.5V ~ 19V | -40°C ~ 135°C (TA) | Surface Mount | 80-TQFP Exposed Pad | 80-TQFP-EP (14x14) |
||
Monolithic Power Systems Inc. |
4.5A, SINGLE-CELL FAST CHARGER W
|
封装: - |
库存2,283 |
|
4mA | 3.7V ~ 16V | -40°C ~ 125°C (TJ) | Surface Mount | 26-PowerVFQFN | 26-QFN (3.5x3.5) |
||
Nisshinbo Micro Devices Inc. |
300MA ULTRA-LOW POWER BUCK BOOST
|
封装: - |
库存300 |
|
300nA | 1.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 20-XFBGA, WLCSP | 20-WLCSP-P3 (2.32x1.71) |
||
NXP |
SAFETY POWER MANAGEMENT IC, QFN5
|
封装: - |
Request a Quote |
|
15mA | 60V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
Renesas Electronics Corporation |
IC WIRELESS TRANSMITTER
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Renesas Electronics Corporation |
P9221-15AHGI8
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
DUAL 36V AUTOMOTIVE DC-DC CONTRO
|
封装: - |
Request a Quote |
|
140µA | 2.7V ~ 36V | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) |
||
Analog Devices Inc./Maxim Integrated |
WEARABLE CHARGE MANAGEMENT SOLUT
|
封装: - |
Request a Quote |
|
900nA | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 36-WFBGA, WLBGA | 36-WLP (2.69x2.44) |
||
Analog Devices Inc./Maxim Integrated |
IC INTEGRATED CIRCUIT
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
SAFETY POWER MANAGEMENT IC, QFN5
|
封装: - |
Request a Quote |
|
- | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
SAFETY SYSTEM BASIS CHIP WITH LO
|
封装: - |
库存30 |
|
- | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
Monolithic Power Systems Inc. |
5.5V/0.5A HIGH-EFFICIENCY INTEGR
|
封装: - |
库存6,717 |
|
220µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TJ) | Surface Mount | 12-UFBGA, CSPBGA | 12-CSP (1.4x1.8) |
||
Silicon Labs |
EFP0110 BOOST PMIC
|
封装: - |
库存5,790 |
|
24nA | 1.8V ~ 3.6V | -40°C ~ 100°C (TJ) | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (3x3) |
||
Analog Devices Inc./Maxim Integrated |
PMIC FOR SMART PHONE
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - |