图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
IC INCA-IP PHONE LBGA-324
|
封装: 324-LBGA |
库存3,376 |
|
- | - | - | - | - | - | Surface Mount | 324-LBGA | PG-LBGA-324-3 |
|
|
Infineon Technologies |
IC SLIC VOICE ACCESS VQFN-48
|
封装: 48-VFQFN Exposed Pad |
库存5,520 |
|
IOM-2, PCM | 2 | 5V | 60mA, 90mA | - | 0°C ~ 70°C | Surface Mount | 48-VFQFN Exposed Pad | P-VQFN-48-4 |
|
|
|
Microsemi Corporation |
IC TDM/TSI SWITCH 256X256 44MQFP
|
封装: 44-QFP |
库存2,640 |
|
- | 1 | 4.75 V ~ 5.25 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
|
|
Microsemi Corporation |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
封装: 32-LCC (J-Lead) |
库存77,280 |
|
2-Wire | 1 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
|
|
Silicon Labs |
IC PROSLIC LINE FEED 150V 16SOIC
|
封装: 16-SOIC (0.154", 3.90mm Width) |
库存2,016 |
|
GCI, PCM, SPI | 4 | 3.3V | - | - | - | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
|
|
Maxim Integrated |
IC TXRX QUAD E1 208MCM BGA
|
封装: 256-BGA |
库存8,472 |
|
E1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
|
|
|
Inphi Corporation |
IC ETH AGGREGATOR 4PORT 1369-BGA
|
封装: 1369-BGA |
库存3,776 |
|
Interlaken, XAUI | - | - | - | - | - | Surface Mount | 1369-BGA | 1369-BGA (37.5x37.5) |
|
|
Maxim Integrated |
IC TXRX FRONT-END 50MSPS 64LQFP
|
封装: 64-LQFP |
库存7,760 |
|
Serial | 1 | 3 V ~ 3.6 V | 150mA, 220mA | 2W | -40°C ~ 105°C | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
|
|
Maxim Integrated |
IC LIU DS3/E3/STS-1 144-CSBGA
|
封装: 144-BGA, CSPBGA |
库存5,808 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 80mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
|
|
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
封装: 38-TFSOP (0.173", 4.40mm Width) |
库存2,176 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
|
|
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 20SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存3,520 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
|
|
Maxim Integrated |
IC CONTROLLER T1 5V 44-PLCC
|
封装: 44-LCC (J-Lead) |
库存5,584 |
|
Parallel/Serial | - | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
|
|
Maxim Integrated |
IC FRAMER ENHANCED T1 4X 128TQFP
|
封装: 128-LQFP |
库存3,680 |
|
Parallel/Serial | 4 | 2.97 V ~ 3.63 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 128-LQFP | 128-LQFP (14x20) |
|
|
|
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 8CH SHORT 160-BGA
|
封装: 160-BGA |
库存7,440 |
|
LIU | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 160-BGA | 160-PBGA (15x15) |
|
|
|
IXYS Integrated Circuits Division |
IC MOD PHONE LINE HALF 1.07" PCB
|
封装: 18-DIP Module (0.850", 21.59mm), 9 Leads |
库存7,360 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 9 Leads | 18-DIP |
|
|
|
Microsemi Corporation |
IC DGTL SWITCH ISO-CMOS 40DIP
|
封装: 40-DIP (0.620", 15.75mm) |
库存5,712 |
|
- | 1 | 4.75 V ~ 5.25 V | 6mA | - | -40°C ~ 85°C | Through Hole | 40-DIP (0.620", 15.75mm) | 40-PDIP |
|
|
Microsemi Corporation |
IC TDM/TSI ST-BUS 32CH 28SOIC
|
封装: 28-SOIC (0.295", 7.50mm Width) |
库存2,880 |
|
Parallel | 1 | 4.75 V ~ 5.25 V | 10µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
|
|
|
Microsemi Corporation |
IC SLIC 2CH 53DB 44TQFP
|
封装: 44-TQFP Exposed Pad |
库存480,000 |
|
2-Wire | 2 | 4.75 V ~ 5.25 V | - | - | -40°C ~ 85°C | Surface Mount | 44-TQFP Exposed Pad | 44-TQFP-EP (10x10) |
|
|
|
Microsemi Corporation |
IC TXRX DTMF 3V 24DIP
|
封装: 24-DIP (0.300", 7.62mm) |
库存4,496 |
|
- | 1 | 2.7 V ~ 3.6 V | 3.1mA | - | -40°C ~ 85°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
|
|
|
Silicon Labs |
IC PROSLIC FXO FCC/CTR21 16SOIC
|
封装: 16-SOIC (0.154", 3.90mm Width) |
库存7,600 |
|
- | 1 | 3.13 V ~ 3.47 V | 25mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
|
Microchip Technology |
IC 16CH ANALOG SWITCH 8SOIC
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存2,768 |
|
- | 1 | - | - | - | 0°C ~ 50°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
|
Microsemi Solutions Sdn Bhd. |
26 PORT MANAGED LAYER 2-SWITCH
|
封装: - |
库存5,856 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
|
|
|
Microsemi Corporation |
4X10GE TRANSCEIVER WITH OTN-FEC
|
封装: - |
库存6,288 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
2P Q/SGMII CU/FI 3E, 256, 4NS CO
|
封装: - |
库存2,464 |
|
- | - | - | - | - | - | - | - | - |
|
|
Microchip Technology |
IC ETHERNET SWITCH 302TQFP
|
封装: - |
库存6,352 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 302-TQFP (24x24) |
|
|
|
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
封装: 324-BGA |
库存4,192 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
|
|
|
Microchip Technology |
IC LINE CARD LCAS 1CH 16SOIC
|
封装: 16-SOIC (0.295", 7.50mm Width) |
库存5,024 |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
|
|
|
Microchip Technology |
ARROW 2XGE PB FREE
|
封装: 896-BGA |
库存5,952 |
|
GMII, SerDes | 2 | 1.8V | - | - | -40°C ~ 85°C | Surface Mount | 896-BGA | 896-FCBGA |
|
|
|
Microchip Technology |
8 CHANNEL FAST ETHERNET OVER SON
|
封装: - |
库存3,104 |
|
- | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC SUBSCRIBER NETWRK DSIC 28PLCC
|
封装: - |
库存3,536 |
|
- | 1 | 4.75V ~ 5.25V | 10mA | - | -40°C ~ 85°C | Surface Mount | - | 28-PLCC |
