图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SOC SHDSL DUAL-CH 324-LBGA
|
封装: 324-LBGA |
库存3,360 |
|
HDLC, Parallel, Serial | 2 | 1.5V, 3.3V | - | 650mW | -40°C ~ 85°C | Surface Mount | 324-LBGA | PG-LBGA-324-2 |
||
Infineon Technologies |
IC LIU E1/T1/J1 81LBGA
|
封装: 81-LBGA |
库存6,240 |
|
E1, HDLC, J1, T1 | 1 | 1.8V, 3.3V | 80mA | 250mW | -40°C ~ 85°C | Surface Mount | 81-LBGA | P-LBGA-81 |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
封装: - |
库存5,472 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC PROSLIC FXS -110V 42QFN
|
封装: 42-WFQFN Exposed Pad |
库存16,560 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
封装: - |
库存5,840 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 6CH 217BGA
|
封装: 217-BBGA |
库存5,376 |
|
Logic | 6 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
||
IXYS Integrated Circuits Division |
IC TONE DETECTOR PREC 20-SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存5,952 |
|
- | 1 | 2.7 V ~ 5.5 V | 15mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Maxim Integrated |
IC MUX TEMPE T3/E3 IND 256-BGA
|
封装: 256-BGA |
库存3,712 |
|
Parallel/Serial | - | 3.135 V ~ 3.465 V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
||
Exar Corporation |
IC LIU SH T1/E1/J1 14CH 304TBGA
|
封装: 304-LBGA |
库存7,024 |
|
LIU | 14 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 304-LBGA | 304-TBGA (31x31) |
||
NXP |
IC C2K 900MHZ 8CH VOIP 625FCBGA
|
封装: - |
库存2,976 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC RECEIVER DTMF 18DIP
|
封装: 18-DIP (0.300", 7.62mm) |
库存2,448 |
|
- | 1 | 4.75 V ~ 5.25 V | 3mA | - | -40°C ~ 85°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
STMicroelectronics |
IC TXRX S-FSK PWR LINE 48VFQFPN
|
封装: 48-VFQFN Exposed Pad |
库存6,432 |
|
UART | 1 | 8 V ~ 18 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN Exposed Pad (7x7) |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 48QFN
|
封装: - |
库存5,184 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 100V 48TQFP
|
封装: - |
库存98,400 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 48-eTQFP |
||
IXYS Integrated Circuits Division |
IC OPT-ISOLATED MULTIFUNC 16SOIC
|
封装: 16-SOIC (0.295", 7.50mm Width) |
库存4,000 |
|
- | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microsemi Solutions Sdn Bhd. |
MULTIRATE 11.5 GBPS QUAD RETIMER
|
封装: - |
库存7,984 |
|
2-Wire | 1 | 1.2V | - | - | - | Surface Mount | - | 48-QFN (5x9) |
||
Microsemi Solutions Sdn Bhd. |
3.5GBPS QUAD REDRIVER WITH CROSS
|
封装: - |
库存9,216 |
|
- | 2 | 2.5V | - | - | -40°C ~ 110°C | Surface Mount | - | 32-QFN (5x5) |
||
Broadcom Limited |
TRAFFIC MGR PACKETPROC
|
封装: - |
库存6,160 |
|
- | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC SLIC RINGING 3.3V VOB 32-QFN
|
封装: 32-VQFN Exposed Pad |
库存5,088 |
|
- | 1 | 3.3V | - | 305mW | 0°C ~ 75°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Microsemi Corporation |
SONET/SDH INTERFACE FOR 622 & 15
|
封装: 196-BGA |
库存3,600 |
|
Serial | - | - | - | - | - | Surface Mount | 196-BGA | 196-CABGA (15x15) |
||
Microchip Technology |
IC SWITCH ETHERNET 672BGA
|
封装: - |
库存5,952 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
封装: - |
库存2,704 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
48FE+4FE+HIGIG SWITCH
|
封装: - |
库存4,848 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 64CH 324BGA
|
封装: 324-BGA |
库存7,360 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC SLIC 2CH 58 DB LG BAL 44PLCC
|
封装: - |
库存6,848 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC SGL 63DB LGBAL 32PLCC
|
封装: 32-LCC (J-Lead) |
库存3,536 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
SINGLE-CHIP SONET/SDH TRANSPORT
|
封装: - |
库存4,944 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
32 CHANNEL T1/E1 FRAMER
|
封装: - |
库存6,816 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
2CH 150V MISLIC PCM, 53QFN, T&R
|
封装: - |
库存2,512 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
1CH G.HN LINE DRIVER
|
封装: - |
库存19,536 |
|
- | - | - | - | - | - | - | - | - |