图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CODEC VOIP 144-LBGA
|
封装: 144-LBGA |
库存5,232 |
|
Parallel, PCM, Serial | 2 | - | - | - | - | Surface Mount | 144-LBGA | PG-LBGA-144 |
||
Infineon Technologies |
IC CHIPSET VDSL-L 4BAND 8-PDSO
|
封装: 8-SOIC (0.154", 3.90mm Width) |
库存4,480 |
|
EEPROM, MII, PCM, Serial UART | 1 | - | - | 1.5W | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | P-PDSO-8 |
||
Microchip Technology |
IC RING GENERATOR 48LQFP
|
封装: 48-LQFP |
库存10,032 |
|
- | 1 | 3 V ~ 3.6 V | 7mA | - | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Silicon Labs |
IC SLIC PROG 1-CH 38QFN
|
封装: 38-VFQFN Exposed Pad |
库存659,964 |
|
SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | - | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Maxim Integrated |
IC TXRX QUAD T1E1J1 256CSBGA
|
封装: 256-LBGA, CSBGA |
库存8,604 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 260mA | - | 0°C ~ 70°C | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) |
||
Maxim Integrated |
IC LIU E1/T1/J1 3.3V 144-ELQFP
|
封装: 144-LQFP Exposed Pad |
库存4,400 |
|
LIU | 8 | 3.135 V ~ 3.465 V | 250mA | - | 0°C ~ 70°C | Surface Mount | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) |
||
Maxim Integrated |
IC QUAD DS3/E3 TXRX 400BGA
|
封装: 400-BBGA |
库存3,024 |
|
DS3, E3 | 4 | 3.135 V ~ 3.465 V | 725mA | - | 0°C ~ 70°C | Surface Mount | 400-BBGA | 400-PBGA (27x27) |
||
Maxim Integrated |
IC TESTER BIT ERROR RATE 32-TQFP
|
封装: 32-TQFP |
库存35,844 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 10mA | - | 0°C ~ 70°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microsemi Corporation |
IC TXRX SGL T1/E1 100MQFP
|
封装: 100-BQFP |
库存5,904 |
|
- | 1 | 4.75 V ~ 5.25 V | 200mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 256X256 44PLCC
|
封装: 44-LCC (J-Lead) |
库存10,140 |
|
- | 1 | 3 V ~ 3.6 V | 4mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Silicon Labs |
IC ENH GLOBAL LINE-SIDE 16SOIC
|
封装: - |
库存5,536 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC TXRX DTMF 20DIP
|
封装: 24-DIP (0.600", 15.24mm) |
库存4,896 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |
||
Silicon Labs |
IC PROSLIC/CODEC DTMF 38VQFN
|
封装: 38-VFQFN Exposed Pad |
库存3,024 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
STMicroelectronics |
IC TXRX S-FSK PWR LINE 48VFQFPN
|
封装: 48-VFQFN Exposed Pad |
库存24,006 |
|
UART | 1 | 8 V ~ 18 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN Exposed Pad (7x7) |
||
Maxim Integrated |
IC LIU QUAD T1/E1/J1 256-BGA
|
封装: 256-BGA |
库存4,352 |
|
LIU | 4 | 3.135 V ~ 3.465 V | - | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
Broadcom Limited |
SWITCH FABRIC
|
封装: - |
库存7,344 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
16 BIT SFI4.1 10G SERDES 12X12MM
|
封装: 195-BGA, FCBGA |
库存6,192 |
|
I²C, SPI | 1 | 1.8V | - | - | -5°C ~ 90°C | Surface Mount | 195-BGA, FCBGA | 195-FCBGA (12x12) |
||
Microchip Technology |
SINGLE-CHIP SONET/SDH TRANSPORT
|
封装: - |
库存4,720 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH UNIV 145V 28QFN
|
封装: - |
库存7,568 |
|
Parallel | 1 | 3.3V | 40mA | - | - | - | - | - |
||
Microchip Technology |
IC VOICEPORT 2CH SLAC ZSI 48QFN
|
封装: - |
库存5,360 |
|
4-Wire Serial | 2 | 3.3V ~ 35V | - | - | - | Surface Mount | - | 48-QFN |
||
Microchip Technology |
IC LINE CARD LCAS 1CH 16SOIC
|
封装: 16-SOIC (0.295", 7.50mm Width) |
库存6,272 |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
TSE-120
|
封装: - |
库存2,720 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 552BGA
|
封装: 552-BGA |
库存5,296 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Intersil |
ITU CO/LOOP CARRIER SLIC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
FABRIC DEVICE 48 X 11.5GBPS
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
MUSLIC MULTICHANNEL SLIC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
LSSGR/TR57 CO/LOOP CARRIER SLIC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
S-GOLD GSM/E-GPRS BASEBAND IC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
ADSL ANALOG FRONT END CHIP
|
封装: - |
Request a Quote |
|
ADSL | 1 | ±4.75V ~ 5.25V | 66mA | 725 mW | -40°C ~ 85°C | Surface Mount | 44-QFP | 44-MQFP (10x10) |
||
Broadcom Limited |
48GE + 4X 10GE + STACK
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |