图片 |
零件编号 |
制造商 |
描述 |
封装 |
库存 |
数量 |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC SGL CHIP ADSL-CPE LBGA-256
|
封装: 256-LBGA |
库存6,176 |
|
- | - | - | - | - | - | Surface Mount | 256-LBGA | PG-LBGA-256 |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144-CSBGA
|
封装: 144-BGA, CSPBGA |
库存5,520 |
|
LIU | 3 | 3.135 V ~ 3.465 V | 225mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
IXYS Integrated Circuits Division |
IC MOD DAA FULL-WAVE DETECT PCB
|
封装: 18-DIP Module (0.850", 21.59mm), 11 Leads |
库存5,472 |
|
- | 1 | 5V | 8mA | - | 0°C ~ 70°C | Through Hole | 18-DIP Module (0.850", 21.59mm), 11 Leads | 18-DIP |
||
Maxim Integrated |
IC TXRX T1/E1 QD 3.3V IND 256BGA
|
封装: 256-BGA |
库存4,864 |
|
E1 | 4 | 3.3V | - | - | - | Surface Mount | 256-BGA | 256-BGA (27x27) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1/J1 OCTAL 256BGA
|
封装: 256-BGA |
库存4,800 |
|
E1, J1, T1 | 8 | 1.8V, 3.3V | - | 2.57W | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (17x17) |
||
Microsemi Corporation |
IC ECHO CANCELLER AEC 48TQFP
|
封装: 48-TQFP |
库存4,608 |
|
- | 1 | 2.7 V ~ 3.6 V | 20mA | - | -40°C ~ 85°C | Surface Mount | 48-TQFP | 48-TQFP |
||
Silicon Labs |
IC PROSLIC FXS ISI DTMF 48QFN
|
封装: - |
库存4,320 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DUAL -110V 50QFN
|
封装: - |
库存6,800 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
IXYS Integrated Circuits Division |
IC SHDSL/ISDN DC TERM 16MLP
|
封装: 16-VDFN Exposed Pad |
库存7,824 |
|
ISDN, SHDSL | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
Microsemi Corporation |
IC VOICEPORT 2CH SLIC 150V 24QFN
|
封装: 24-QFN |
库存29,280 |
|
PCM | 2 | - | - | - | - | Surface Mount | 24-QFN | 24-QFN (6x6) |
||
Microsemi Corporation |
IC RECEIVER DTMF 18DIP
|
封装: 18-DIP (0.300", 7.62mm) |
库存193,200 |
|
- | 1 | 2.7 V ~ 3.6 V | 2mA | - | -40°C ~ 85°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
Exar Corporation |
IC BITS CLOCK EXTRACTOR 28TSSOP
|
封装: 28-TSSOP (0.173", 4.40mm Width) |
库存6,000 |
|
E1, T1 | 1 | 3.14 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
Microsemi Corporation |
IC CNIC1.1 CLIP CID TYPE1 16SOIC
|
封装: 16-SOIC (0.295", 7.50mm Width) |
库存69,840 |
|
3-Wire | 1 | 2.7 V ~ 5.5 V | 1.9mA | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Broadcom Limited |
SWITCH FABRIC
|
封装: - |
库存3,728 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
STACKABLE MANAGED SWITCH 24 PORT
|
封装: - |
库存3,136 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
封装: - |
库存6,672 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DAA CHIPSET 1CHAN 10MSOP
|
封装: - |
库存5,616 |
|
- | 1 | - | - | - | - | Surface Mount | - | 10-MSOP |
||
Microchip Technology |
IC ECHO CANCELLER AEC 36SSOP
|
封装: 36-BSOP (0.295", 7.50mm Width) |
库存4,960 |
|
Serial | 1 | 2.7V ~ 3.6V | 20mA | - | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-SSOP |
||
Microchip Technology |
IC CNIC CIDCW CWD CID 20SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存5,616 |
|
3-Wire | 1 | 2.7V ~ 5.5V | 4.3mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC LINE CARD LCAS 1CH 20SOIC
|
封装: 20-SOIC (0.295", 7.50mm Width) |
库存4,128 |
|
- | 1 | 4.5V ~ 5.5V | - | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
TEMAP 168, LF BUMP
|
封装: - |
库存4,688 |
|
- | - | - | - | - | - | - | - | - |
||
Intel |
FRAMER E1/T1 5V 28-PIN PLCC
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
10GBE DUAL SFI - XAUI PHY
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
DS3253 TRIPLE DS3/E3/STS-1 LIU
|
封装: - |
Request a Quote |
|
DS3, E3, STS-1 | 3 | 3.135V ~ 3.465V | 280mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA, CSPBGA | 144-TECSBGA (13x13) |
||
MaxLinear, Inc. |
IC
|
封装: - |
Request a Quote |
|
- | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-VQFN (7x7) |
||
Harris Corporation |
EIA/ITU PABX SLIC
|
封装: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 550 mW | 0°C ~ 75°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Cirrus Logic Inc. |
DUAL T1/E1 LINE INTERFACE
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
onsemi |
TELECOM CIRCUIT, 1-FUNC, PDSO14
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Infineon Technologies |
MUSLIC MULTICHANNEL SUBSCRIBER L
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
24GE + 4X10GE SWITCH
|
封装: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |