页 9 - 嵌入式 - 片上系统 (SoC) | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
10AS057K2F40I1SG	Altera	IC SOC FPGA 696 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封装: 1517-BBGA, FCBGA	库存5,680	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 570K Logic Elements	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
10AS066K2F35I2SGES	Altera	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存2,832	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	-40°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
M2S150TS-1FCG1152M	Microsemi Corporation	IC FPGA SOC 150K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封装: 1152-BBGA, FCBGA	库存3,168	ARM? Cortex?-M3	512KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 150K Logic Modules	-55°C ~ 125°C (TJ)	1152-BBGA, FCBGA	1152-FCBGA (35x35)
M2S010S-1VF400I	Microsemi Corporation	IC FPGA SOC 10K LUTS 400VFBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	封装: 400-LFBGA	库存6,224	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 10K Logic Modules	-40°C ~ 100°C (TJ)	400-LFBGA	400-VFBGA (17x17)
A2F500M3G-FGG256I	Microsemi Corporation	IC FPGA 500K GATES 512KB 256-BGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17x17)	封装: 256-LBGA	库存3,936	ARM? Cortex?-M3	512KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops	-40°C ~ 100°C (TJ)	256-LBGA	256-FBGA (17x17)
A2F060M3E-1TQ144	Microsemi Corporation	IC FPGA 60K GATES 128KB 144-TQFP Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I2C, SPI, UART/USART Speed: 100MHz Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封装: 144-LQFP	库存6,336	ARM? Cortex?-M3	128KB	16KB	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	100MHz	ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops	0°C ~ 85°C (TJ)	144-LQFP	144-TQFP (20x20)
A2F060M3E-TQ144	Microsemi Corporation	IC FPGA 60K GATES 128KB 144-TQFP Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 128KB RAM Size: 16KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, I2C, SPI, UART/USART Speed: 80MHz Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封装: 144-LQFP	库存2,224	ARM? Cortex?-M3	128KB	16KB	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	80MHz	ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops	0°C ~ 85°C (TJ)	144-LQFP	144-TQFP (20x20)
5ASXBB5D4F40C4N	Altera	IC FPGA 528 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 462K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA Supplier Device Package: 1517-FBGA (40x40)	封装: 1517-BBGA	库存4,128	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	925MHz	FPGA - 462K Logic Elements	0°C ~ 85°C (TJ)	1517-BBGA	1517-FBGA (40x40)
10AS032E2F27I1HG	Altera	IC SOC FPGA 240 I/O 672FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA, FCBGA	库存6,624	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 320K Logic Elements	-40°C ~ 100°C (TJ)	672-BBGA, FCBGA	672-FBGA (27x27)
5ASXBB3D6F31C6N	Altera	IC FPGA 170 I/O 896FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FBGA (31x31)	封装: 896-BBGA, FCBGA	库存2,960	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	700MHz	FPGA - 350K Logic Elements	0°C ~ 85°C (TJ)	896-BBGA, FCBGA	896-FBGA (31x31)
10AS016E3F29E2SG	Altera	IC SOC FPGA 288 I/O 780FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 160K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封装: 780-BBGA, FCBGA	库存7,952	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 160K Logic Elements	0°C ~ 100°C (TJ)	780-BBGA, FCBGA	780-FBGA (29x29)
XCZU7EV-1FBVB900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封装: 900-BBGA, FCBGA	库存4,336	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq?UltraScale+? FPGA, 504K+ Logic Cells	0°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
XCZU4EG-2FBVB900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封装: 900-BBGA, FCBGA	库存6,720	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq?UltraScale+? FPGA, 192K+ Logic Cells	0°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
M2S050TS-1FGG484	Microsemi Corporation	IC FPGA SOC 50K LUTS 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	封装: 484-BGA	库存4,080	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	0°C ~ 85°C (TJ)	484-BGA	484-FPBGA (23x23)
M2S060-FGG676	Microsemi Corporation	IC FPGA SOC 60K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封装: 676-BGA	库存2,640	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	0°C ~ 85°C (TJ)	676-BGA	676-FBGA (27x27)
M2S060TS-FCS325	Microsemi Corporation	IC FPGA SOC 60K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11)	封装: 325-TFBGA	库存5,904	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	0°C ~ 85°C (TJ)	325-TFBGA	325-BGA (11x11)
XC7Z010-L1CLG225I	Xilinx Inc.	IC SOC CORTEX-A9 ARTIX7 225BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix?-7 FPGA, 28K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13)	封装: 225-LFBGA, CSPBGA	库存3,376	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	667MHz	Artix?-7 FPGA, 28K Logic Cells	-40°C ~ 100°C (TJ)	225-LFBGA, CSPBGA	225-CSPBGA (13x13)
M2S025-VF400	Microsemi Corporation	IC FPGA SOC 25K LUTS 400VFBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	封装: 400-LFBGA	库存2,912	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	400-LFBGA	400-VFBGA (17x17)
M2S010-1FG484I	Microsemi Corporation	IC FPGA SOC 10K LUTS 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	封装: 484-BGA	库存4,272	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 10K Logic Modules	-40°C ~ 100°C (TJ)	484-BGA	484-FPBGA (23x23)
M2S005-1VF400	Microsemi Corporation	IC FPGA SOC 5K LUTS 400VFBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	封装: 400-LFBGA	库存2,592	ARM? Cortex?-M3	128KB	64KB	DDR	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 5K Logic Modules	0°C ~ 85°C (TJ)	400-LFBGA	400-VFBGA (17x17)
XCZU9CG-1FFVC900E	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封装: 900-BBGA, FCBGA	库存3,856	Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 1.3GHz	Zynq?UltraScale+? FPGA, 599K+ Logic Cells	0°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
10AS066K2F35E2LG	Intel	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封装: 1152-BBGA, FCBGA	库存3,072	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	0°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
10AS032H2F34E2SG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存3,328	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 320K Logic Elements	0°C ~ 100°C (TJ)	-	-
10AS027H4F34E3LG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存7,616	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 270K Logic Elements	0°C ~ 100°C (TJ)	-	-
10AS032E4F29E3LG	Intel	780-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封装: -	库存3,104	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 320K Logic Elements	0°C ~ 100°C (TJ)	-	-
10AS022E3F27I1HG	Intel	IC SOC FPGA 240 I/O 672FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 220K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封装: 672-BBGA, FCBGA	库存7,456	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 220K Logic Elements	-40°C ~ 100°C (TJ)	672-BBGA, FCBGA	672-FBGA (27x27)
5CSXFC5C6U23C8N	Intel	IC FPGA 145 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	封装: 672-FBGA	库存3,712	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz	FPGA - 85K Logic Elements	0°C ~ 85°C (TJ)	672-FBGA	672-UBGA (23x23)
XAZU3EG-1SFVA625Q	Xilinx Inc.	XAZU3EG-1SFVA625Q Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封装: -	库存5,424	-	-	-	-	-	-	-	-	-	-
5CSXFC6D6F31C8N	Intel	IC FPGA 288 I/O 896FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz Primary Attributes: FPGA - 110K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	封装: 896-BGA	库存5,920	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz	FPGA - 110K Logic Elements	0°C ~ 85°C (TJ)	896-BGA	896-FBGA (31x31)
XAZU2EG-1SFVC784I	Xilinx Inc.	XAZU2EG-1SFVC784I Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封装: 784-BFBGA, FCBGA	库存7,488	-	-	-	-	-	-	-	-	784-BFBGA, FCBGA	784-FCBGA (23x23)

10AS057K2F40I1SG

Altera

IC SOC FPGA 696 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 570K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封装: 1517-BBGA, FCBGA

库存5,680

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 570K Logic Elements

-40°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FCBGA (40x40)

10AS066K2F35I2SGES

Altera

IC SOC FPGA 396 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存2,832

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 660K Logic Elements

-40°C ~ 100°C (TJ)

1152-BBGA, FCBGA

1152-FBGA (35x35)

M2S150TS-1FCG1152M

Microsemi Corporation

IC FPGA SOC 150K LUTS

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封装: 1152-BBGA, FCBGA

库存3,168

ARM? Cortex?-M3

512KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 150K Logic Modules

-55°C ~ 125°C (TJ)

1152-BBGA, FCBGA

1152-FCBGA (35x35)

M2S010S-1VF400I

Microsemi Corporation

IC FPGA SOC 10K LUTS 400VFBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)

封装: 400-LFBGA

库存6,224

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 10K Logic Modules

-40°C ~ 100°C (TJ)

400-LFBGA

400-VFBGA (17x17)

A2F500M3G-FGG256I

Microsemi Corporation

IC FPGA 500K GATES 512KB 256-BGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)

封装: 256-LBGA

库存3,936

ARM? Cortex?-M3

512KB

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops

-40°C ~ 100°C (TJ)

256-LBGA

256-FBGA (17x17)

A2F060M3E-1TQ144

Microsemi Corporation

IC FPGA 60K GATES 128KB 144-TQFP

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Speed: 100MHz
Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封装: 144-LQFP

库存6,336

ARM? Cortex?-M3

128KB

16KB

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

100MHz

ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops

0°C ~ 85°C (TJ)

144-LQFP

144-TQFP (20x20)

A2F060M3E-TQ144

Microsemi Corporation

IC FPGA 60K GATES 128KB 144-TQFP

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 128KB
RAM Size: 16KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Speed: 80MHz
Primary Attributes: ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封装: 144-LQFP

库存2,224

ARM? Cortex?-M3

128KB

16KB

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

80MHz

ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops

0°C ~ 85°C (TJ)

144-LQFP

144-TQFP (20x20)

5ASXBB5D4F40C4N

Altera

IC FPGA 528 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 925MHz
Primary Attributes: FPGA - 462K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA
Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA

库存4,128

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

925MHz

FPGA - 462K Logic Elements

0°C ~ 85°C (TJ)

1517-BBGA

1517-FBGA (40x40)

10AS032E2F27I1HG

Altera

IC SOC FPGA 240 I/O 672FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA, FCBGA

库存6,624

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 320K Logic Elements

-40°C ~ 100°C (TJ)

672-BBGA, FCBGA

672-FBGA (27x27)

5ASXBB3D6F31C6N

Altera

IC FPGA 170 I/O 896FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FBGA (31x31)

封装: 896-BBGA, FCBGA

库存2,960

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

700MHz

FPGA - 350K Logic Elements

0°C ~ 85°C (TJ)

896-BBGA, FCBGA

896-FBGA (31x31)

10AS016E3F29E2SG

Altera

IC SOC FPGA 288 I/O 780FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 160K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

库存7,952

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 160K Logic Elements

0°C ~ 100°C (TJ)

780-BBGA, FCBGA

780-FBGA (29x29)

XCZU7EV-1FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封装: 900-BBGA, FCBGA

库存4,336

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?

-

256KB

DMA, WDT

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz, 1.5GHz

Zynq?UltraScale+? FPGA, 504K+ Logic Cells

0°C ~ 100°C (TJ)

900-BBGA, FCBGA

900-FCBGA (31x31)

XCZU4EG-2FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封装: 900-BBGA, FCBGA

库存6,720

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?

-

256KB

DMA, WDT

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz, 1.5GHz

Zynq?UltraScale+? FPGA, 192K+ Logic Cells

0°C ~ 100°C (TJ)

900-BBGA, FCBGA

900-FCBGA (31x31)

M2S050TS-1FGG484

Microsemi Corporation

IC FPGA SOC 50K LUTS 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

封装: 484-BGA

库存4,080

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 50K Logic Modules

0°C ~ 85°C (TJ)

484-BGA

484-FPBGA (23x23)

M2S060-FGG676

Microsemi Corporation

IC FPGA SOC 60K LUTS

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封装: 676-BGA

库存2,640

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 60K Logic Modules

0°C ~ 85°C (TJ)

676-BGA

676-FBGA (27x27)

M2S060TS-FCS325

Microsemi Corporation

IC FPGA SOC 60K LUTS

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 325-TFBGA
Supplier Device Package: 325-BGA (11x11)

封装: 325-TFBGA

库存5,904

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 60K Logic Modules

0°C ~ 85°C (TJ)

325-TFBGA

325-BGA (11x11)

XC7Z010-L1CLG225I

Xilinx Inc.

IC SOC CORTEX-A9 ARTIX7 225BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix?-7 FPGA, 28K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)

封装: 225-LFBGA, CSPBGA

库存3,376

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

667MHz

Artix?-7 FPGA, 28K Logic Cells

-40°C ~ 100°C (TJ)

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

M2S025-VF400

Microsemi Corporation

IC FPGA SOC 25K LUTS 400VFBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 25K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)

封装: 400-LFBGA

库存2,912

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 25K Logic Modules

0°C ~ 85°C (TJ)

400-LFBGA

400-VFBGA (17x17)

M2S010-1FG484I

Microsemi Corporation

IC FPGA SOC 10K LUTS 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

封装: 484-BGA

库存4,272

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 10K Logic Modules

-40°C ~ 100°C (TJ)

484-BGA

484-FPBGA (23x23)

M2S005-1VF400

Microsemi Corporation

IC FPGA SOC 5K LUTS 400VFBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 128KB
RAM Size: 64KB
Peripherals: DDR
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 5K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)

封装: 400-LFBGA

库存2,592

ARM? Cortex?-M3

128KB

64KB

DDR

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 5K Logic Modules

0°C ~ 85°C (TJ)

400-LFBGA

400-VFBGA (17x17)

XCZU9CG-1FFVC900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封装: 900-BBGA, FCBGA

库存3,856

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?

-

256KB

DMA, WDT

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

533MHz, 1.3GHz

Zynq?UltraScale+? FPGA, 599K+ Logic Cells

0°C ~ 100°C (TJ)

900-BBGA, FCBGA

900-FCBGA (31x31)

10AS066K2F35E2LG

Intel

IC SOC FPGA 396 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

库存3,072

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 660K Logic Elements

0°C ~ 100°C (TJ)

1152-BBGA, FCBGA

1152-FBGA (35x35)

10AS032H2F34E2SG

Intel

1152-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存3,328

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 320K Logic Elements

0°C ~ 100°C (TJ)

-

10AS027H4F34E3LG

Intel

1152-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 270K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存7,616

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 270K Logic Elements

0°C ~ 100°C (TJ)

-

10AS032E4F29E3LG

Intel

780-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封装: -

库存3,104

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 320K Logic Elements

0°C ~ 100°C (TJ)

-

10AS022E3F27I1HG

Intel

IC SOC FPGA 240 I/O 672FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 220K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封装: 672-BBGA, FCBGA

库存7,456

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 220K Logic Elements

-40°C ~ 100°C (TJ)

672-BBGA, FCBGA

672-FBGA (27x27)

5CSXFC5C6U23C8N

Intel

IC FPGA 145 I/O 672UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz
Primary Attributes: FPGA - 85K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

封装: 672-FBGA

库存3,712

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz

FPGA - 85K Logic Elements

0°C ~ 85°C (TJ)

672-FBGA

672-UBGA (23x23)

XAZU3EG-1SFVA625Q

Xilinx Inc.

XAZU3EG-1SFVA625Q

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封装: -

库存5,424

-

5CSXFC6D6F31C8N

Intel

IC FPGA 288 I/O 896FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz
Primary Attributes: FPGA - 110K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)

封装: 896-BGA

库存5,920

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz

FPGA - 110K Logic Elements

0°C ~ 85°C (TJ)

896-BGA

896-FBGA (31x31)

XAZU2EG-1SFVC784I

Xilinx Inc.

XAZU2EG-1SFVC784I

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: 784-BFBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封装: 784-BFBGA, FCBGA

库存7,488

-

784-BFBGA, FCBGA

784-FCBGA (23x23)