嵌入式 - 片上系统 (SoC)

10AS057N1F40I1HG

Altera

IC SOC FPGA 588 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 570K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封装: 1517-BBGA, FCBGA

5CSEBA2U23A7N

Altera

IC FPGA 188 I/O 672UBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 700MHz
• Primary Attributes: FPGA - 25K Logic Elements
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 672-FBGA
• Supplier Device Package: 672-UBGA (23x23)

封装: 672-FBGA

XCZU19EG-2FFVC1760E

Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

封装: 1760-BBGA, FCBGA

XCZU7EV-1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

封装: 900-BBGA, FCBGA

XC7Z035-2FFG676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

封装: 676-BBGA, FCBGA

XC7Z030-2SBG485E

Xilinx Inc.

IC SOC CORTEX A-9 ZYNQ7 485BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 485-FBGA (19x19)

封装: 484-FBGA

M2S050TS-VFG400

Microsemi Corporation

IC FPGA SOC 50K LUTS

• Architecture: MCU, FPGA
• Core Processor: ARM? Cortex?-M3
• Flash Size: 256KB
• RAM Size: 64KB
• Peripherals: DDR, PCIe, SERDES
• Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
• Speed: 166MHz
• Primary Attributes: FPGA - 50K Logic Modules
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-VFBGA (17x17)

封装: 400-LFBGA

10AS066K3F35I2SGES

Intel

IC SOC FPGA 396 I/O 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 660K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

10AS066N2F40E2LG

Intel

IC SOC FPGA 588 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 660K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

封装: 1517-BBGA, FCBGA

10AS032H4F34E3SG

Intel

1152-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 320K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

10AS022C3U19I2LG

Intel

484-PIN UBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 220K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

10AS022E3F29I2SG

Intel

780-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 220K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

XCVM1402-2MSIVFVC1596

AMD

IC VERSALPRIME ACAP FPGA 1596BGA

• Architecture: MPU, FPGA
• Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
• Flash Size: -
• RAM Size: -
• Peripherals: DDR, DMA, PCIe
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.4GHz
• Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1596-BFBGA
• Supplier Device Package: 1596-BGA (37.5x37.5)

封装: -

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R8A779M5JXXXBG-GH

Renesas Electronics Corporation

R-CAR M3NE-2G

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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AGFB008R24D2I3V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 764K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

封装: -

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AGIA035R39A1I2VB

Intel

IC FPGA AGILEX-I 3948FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 3.54M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 3948-BFBGA Exposed Pad
• Supplier Device Package: 3948-BGA (56x56)

封装: -

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MPFS250TLS-FCVG484I

Microchip Technology

IC SOC RISC-V 484FCBGA

• Architecture: MPU, FPGA
• Core Processor: RISC-V
• Flash Size: 128kB
• RAM Size: 2.2MB
• Peripherals: DMA, PCI, PWM
• Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
• Speed: -
• Primary Attributes: FPGA - 254K Logic Modules
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 484-BFBGA, FCBGA
• Supplier Device Package: 484-FCBGA (19x19)

封装: -

PS7111-VC-A

Cirrus Logic Inc.

MULTIFUNCTION PERIPHERAL, CMOS,

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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AMA3B1KK-KCR-TB

Ambiq Micro, Inc.

MCU 96MHZ M4F 1MB FLSH 66CSP

• Architecture: MCU
• Core Processor: ARM® Cortex®-M4F
• Flash Size: 1MB
• RAM Size: 384KB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Connectivity: I2C, SPI, UART/USART
• Speed: 96MHz
• Primary Attributes: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 66-UFBGA, CSPBGA
• Supplier Device Package: 66-CSP (3.38x3.25)

封装: -

XCZU1EG-L2SFVA625E

AMD

IC ZUP MPSOC LP A53 FPGA 625BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: -
• Speed: 533MHz, 600MHz, 1.333GHz
• Primary Attributes: -
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 625-BFBGA, FCBGA
• Supplier Device Package: 625-FCBGA (21x21)

封装: -

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XCVC1702-2HSINSVG1369

AMD

XCVC1702-2HSINSVG1369

• Architecture: MPU, FPGA
• Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DDR, DMA, PCIe
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz, 1.65GHz
• Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
• Operating Temperature: -40°C ~ 110°C (TJ)
• Package / Case: 1369-BFBGA, FCBGA
• Supplier Device Package: 1369-FCBGA (35x35)

封装: -

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AMAP31KK-KCR

Ambiq Micro, Inc.

MCU 96MHZ M4F 1MB FLSH 66CSP

• Architecture: MCU
• Core Processor: ARM® Cortex®-M4F
• Flash Size: 1MB
• RAM Size: 384KB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Connectivity: I2C, SPI, UART/USART
• Speed: 96MHz
• Primary Attributes: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 66-UFBGA, CSPBGA
• Supplier Device Package: 66-CSP (3.38x3.25)

封装: -

AGID023R18A1I1VB

Intel

IC FPGA AGILEX-I 1805BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1805-BBGA Exposed Pad
• Supplier Device Package: 1805-BGA (42.5x42.5)

封装: -

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XCZU49DR-1FFVF1760E

AMD

IC ZUP RFSOC A53 FPGA 1760BGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DDR, DMA, PCIe
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 500MHz, 1.2GHz
• Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

封装: -

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AGFA019R24C3I3E

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

封装: -

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XCZU2EG-2UBVA530E

AMD

IC ZUP MPSOC A53 FPGA 530BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 600MHz, 1.333GHz
• Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 530-WFBGA, FCBGA
• Supplier Device Package: 530-FCBGA (16x9.5)

封装: -

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8MM_SMARC_SOM_2R16E_I

Boundary Devices

SMARC SOM: I.MX8M MINI QUAD / 2

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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BCM3380ZKFSBG

Broadcom Limited

DOCSIS 3.0 VOICE GATEWAY

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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XCVC2602-2HSIVSVH1760

AMD

XCVC2602-2HSIVSVH1760

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封装: -

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AGFC023R25A2I2V

Intel

IC FPGA AGILEX-F 2581FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

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