页 36 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CENPXA270-HLR01-0708R-A	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存2,416	-	-	-	-	-	-	-	-
TE0745-01-30-1I	Trenz Electronic GmbH	SOM SOC Z7 XC7Z030-1FBG676I 1GB Module/Board Type: MCU, FPGA Core Processor: ARM? Cortex?-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,816	ARM? Cortex?-A9	Zynq-7000 (Z-7030)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	-40°C ~ 85°C
CC-MX-PE47-MQ	Digi International	MODULE CONNECTCORE I.MX280 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存3,552	-	-	-	-	-	-	-	-
TE0745-01-45-1C	Trenz Electronic GmbH	SOM SOC Z7 XC7Z045-1FBG676C 1GB Module/Board Type: MCU, FPGA Core Processor: ARM? Cortex?-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,920	ARM? Cortex?-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	0°C ~ 70°C
TE0723-02	Trenz Electronic GmbH	SOM ARDUZYNQ 7Z10 USBOTG MICROSD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: 12MHz Flash Size: 16MB RAM Size: 128MB Connector Type: Arduino Size / Dimension: - Operating Temperature: 0°C ~ 70°C	封装: -	库存4,784	ARM Cortex-A9	Zynq-7000 (Z-7010)	12MHz	16MB	128MB	Arduino	-	0°C ~ 70°C
CC-WMX-LC47-VM	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存4,848	-	-	-	-	-	-	-	-
SOMAM1808-10-1602AHCR	Logic	SYSTEM ON MODULE AM1808 Module/Board Type: MPU Core Core Processor: ARM926EJ-S, AM1808 Co-Processor: - Speed: 450MHz Flash Size: 8MB RAM Size: 128MB Connector Type: - Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存4,128	ARM926EJ-S, AM1808	-	450MHz	8MB	128MB	-	1.18" x 1.57" (30mm x 40mm)	0°C ~ 70°C
20-101-0949	Digi International	MODULE RABBITCORE RCM3360 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 16MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存2,064	Rabbit 3000	-	44.2MHz	512KB (Internal), 16MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
CENGPXA270-520-10-504HCR	Logic	CARD ENGINE 32MB FLASH 64MB RAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 520MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,984	PXA270	-	520MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGLH7A404-11-430EI	Logic	CARD ENGINE 16MB FLASH 32MB RAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存4,832	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
101-0673	Digi International	MODULE RABBITCORE RCM3610 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: IDC Header 2x20 Size / Dimension: 1.23" x 2.11" (31mm x 54mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,568	Rabbit 3000	-	22.1MHz	256KB	128KB	IDC Header 2x20	1.23" x 2.11" (31mm x 54mm)	-40°C ~ 85°C
JS1-IC	Parallax Inc.	MODULE BASIC STAMP JAVELIN Module/Board Type: MPU Core Core Processor: SX48AC Co-Processor: - Speed: - Flash Size: 32KB EEPROM RAM Size: 32KB Connector Type: 24-DIP Size / Dimension: 1.2" x 0.6" (30mm x 15mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存2,720	SX48AC	-	-	32KB EEPROM	32KB	24-DIP	1.2" x 0.6" (30mm x 15mm)	0°C ~ 70°C
TE0300-01IBM	Trenz Electronic GmbH	SOM SPARTAN-3E 1600K 666MB DDR Module/Board Type: FPGA, USB Core Core Processor: Spartan-3E Co-Processor: Cypress FX2 USB 2.0 Speed: 125MHz Flash Size: 4MB RAM Size: 64MB Connector Type: B2B Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,384	Spartan-3E	Cypress FX2 USB 2.0	125MHz	4MB	64MB	B2B	1.6" x 1.9" (40.5mm x 47.5mm)	0°C ~ 70°C
20-101-0955	Digi International	MODULE RABBITCORE RCM2260 ROHS Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x13 Size / Dimension: 1.6" x 2.3" (41mm x 58mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存3,792	Rabbit 2000	-	22.1MHz	512KB	512KB	2 IDC Headers 2x13	1.6" x 2.3" (41mm x 58mm)	-40°C ~ 70°C
6711-AB-3X3-RC	Critical Link LLC	DSP-XM SOM TMS320C6711 200MHZ Module/Board Type: DSP, FPGA Core Core Processor: TMS320C6711 Co-Processor: Spartan-3, XC3S1000 Speed: 200MHz Flash Size: 16MB RAM Size: 64KB (Internal), 32MB (External) Connector Type: SO-DIMM-144 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存6,560	TMS320C6711	Spartan-3, XC3S1000	200MHz	16MB	64KB (Internal), 32MB (External)	SO-DIMM-144	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
DC-ME-Y402-S	Digi International	MOD ME 9210 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	封装: -	库存3,728	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
SOMDM3730-20-1880AGIR	Logic	SYSTEM ON MODULE TORP Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB RAM Size: 512MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.06" (15mm x 27mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,452	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB	512MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.06" (15mm x 27mm)	-40°C ~ 85°C
DC-ME-01T-STL-1	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存3,200	-	-	-	-	-	-	-	-
XP3002000-01R	Lantronix, Inc.	XPORT AR EXTENDED TEMP -40 TO 85 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,768	-	-	-	-	-	-	-	-
TE0808-05-BBE81-AK	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0715-05-21C33-A	Trenz Electronic GmbH	SOC MODULE WITH XILINX ZYNQ Z-70 Module/Board Type: MPU Core Core Processor: Zynq™ XC7Z012S-1CLG485C Co-Processor: ARM Cortex-A9 Speed: 766MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	Zynq™ XC7Z012S-1CLG485C	ARM Cortex-A9	766MHz	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
DG8065101274708	Intel	INTEL ATOM PROCESSOR Z2560 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0808-05-6BE81-L	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0820-05-4BI21PL	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 64GB eMMC, 128MB QSPI RAM Size: 2GB Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	64GB eMMC, 128MB QSPI	2GB	-	-	-
TE0820-05-2AI81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
SOMDM3730-11-2783IFCR-A	Beacon EmbeddedWorks	SYSTEM ON MODULE LV DM3730 Module/Board Type: MPU, DSP Core Core Processor: ARM® Cortex®-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 1GHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 1.230" L x 3.010" W (31.20mm x 76.50mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM® Cortex®-A8, DM3730	TMS320C64x (DSP)	1GHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	1.230" L x 3.010" W (31.20mm x 76.50mm)	0°C ~ 70°C
TE0724-04-41I32-A	Trenz Electronic GmbH	SOC MODULE WITH XILINX ZYNQ XC7Z Module/Board Type: MPU Core Core Processor: Zynq™ XC7Z010-1CLG400I Co-Processor: ARM Cortex-A9 Speed: 667MHz Flash Size: 32MB RAM Size: 1GB Connector Type: 1 x 160 Pin Size / Dimension: 2.362" L x 1.575" W (60.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Zynq™ XC7Z010-1CLG400I	ARM Cortex-A9	667MHz	32MB	1GB	1 x 160 Pin	2.362" L x 1.575" W (60.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU9-7EG-2E-D11E-L13-R2-1	Enclustra FPGA Solutions	SOM XU9 ZYNQ 7EG REV2.1 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
2EC-VA-MPEG2-8B-30-1080-MD00C-A200T	System-On-Chip (SOC) Technologies Inc.	MOD MPEG2 ENC 30FPS 1080 SODIMM Module/Board Type: DSP, FPGA Core Core Processor: - Co-Processor: Xilinx Artix-7 XC7A200T Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: SO-DIMM Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	Xilinx Artix-7 XC7A200T	-	32MB	512MB	SO-DIMM	-	-
5749-PM-4AA-RI	Critical Link LLC	TEXAS INSTRUMENTS AM5749 SOM WIT Module/Board Type: MPU, FPGA Core Core Processor: ARM Cortex-A15 Co-Processor: Artix-7 Speed: 1.5GHz Flash Size: 32MB RAM Size: 1GB Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100 Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6	ARM Cortex-A15	Artix-7	1.5GHz	32MB	1GB	Edge Connector - 310, Board-to-Board (BTB) - 100	3.460" L x 2.730" W (87.88mm x 69.34mm)	-40°C ~ 85°C

CENPXA270-HLR01-0708R-A

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存2,416

-

TE0745-01-30-1I

Trenz Electronic GmbH

SOM SOC Z7 XC7Z030-1FBG676I 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM? Cortex?-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,816

ARM? Cortex?-A9

Zynq-7000 (Z-7030)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

-40°C ~ 85°C

CC-MX-PE47-MQ

Digi International

MODULE CONNECTCORE I.MX280

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存3,552

-

TE0745-01-45-1C

Trenz Electronic GmbH

SOM SOC Z7 XC7Z045-1FBG676C 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM? Cortex?-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,920

ARM? Cortex?-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

0°C ~ 70°C

TE0723-02

Trenz Electronic GmbH

SOM ARDUZYNQ 7Z10 USBOTG MICROSD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: 12MHz
Flash Size: 16MB
RAM Size: 128MB
Connector Type: Arduino
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

封装: -

库存4,784

ARM Cortex-A9

Zynq-7000 (Z-7010)

12MHz

16MB

128MB

Arduino

-

0°C ~ 70°C

CC-WMX-LC47-VM

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存4,848

-

SOMAM1808-10-1602AHCR

Logic

SYSTEM ON MODULE AM1808

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, AM1808
Co-Processor: -
Speed: 450MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: -
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存4,128

ARM926EJ-S, AM1808

-

450MHz

8MB

128MB

-

1.18" x 1.57" (30mm x 40mm)

0°C ~ 70°C

20-101-0949

Digi International

MODULE RABBITCORE RCM3360

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 16MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存2,064

Rabbit 3000

-

44.2MHz

512KB (Internal), 16MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

CENGPXA270-520-10-504HCR

Logic

CARD ENGINE 32MB FLASH 64MB RAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 520MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,984

PXA270

-

520MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CENGLH7A404-11-430EI

Logic

CARD ENGINE 16MB FLASH 32MB RAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存4,832

ARM922T, LH7A404

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

101-0673

Digi International

MODULE RABBITCORE RCM3610

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.23" x 2.11" (31mm x 54mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,568

Rabbit 3000

-

22.1MHz

256KB

128KB

IDC Header 2x20

1.23" x 2.11" (31mm x 54mm)

-40°C ~ 85°C

JS1-IC

Parallax Inc.

MODULE BASIC STAMP JAVELIN

Module/Board Type: MPU Core
Core Processor: SX48AC
Co-Processor: -
Speed: -
Flash Size: 32KB EEPROM
RAM Size: 32KB
Connector Type: 24-DIP
Size / Dimension: 1.2" x 0.6" (30mm x 15mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存2,720

SX48AC

-

32KB EEPROM

32KB

24-DIP

1.2" x 0.6" (30mm x 15mm)

0°C ~ 70°C

TE0300-01IBM

Trenz Electronic GmbH

SOM SPARTAN-3E 1600K 666MB DDR

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-3E
Co-Processor: Cypress FX2 USB 2.0
Speed: 125MHz
Flash Size: 4MB
RAM Size: 64MB
Connector Type: B2B
Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,384

Spartan-3E

Cypress FX2 USB 2.0

125MHz

4MB

64MB

B2B

1.6" x 1.9" (40.5mm x 47.5mm)

0°C ~ 70°C

20-101-0955

Digi International

MODULE RABBITCORE RCM2260 ROHS

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x13
Size / Dimension: 1.6" x 2.3" (41mm x 58mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存3,792

Rabbit 2000

-

22.1MHz

512KB

2 IDC Headers 2x13

1.6" x 2.3" (41mm x 58mm)

-40°C ~ 70°C

6711-AB-3X3-RC

Critical Link LLC

DSP-XM SOM TMS320C6711 200MHZ

Module/Board Type: DSP, FPGA Core
Core Processor: TMS320C6711
Co-Processor: Spartan-3, XC3S1000
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64KB (Internal), 32MB (External)
Connector Type: SO-DIMM-144
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存6,560

TMS320C6711

Spartan-3, XC3S1000

200MHz

16MB

64KB (Internal), 32MB (External)

SO-DIMM-144

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

DC-ME-Y402-S

Digi International

MOD ME 9210 8MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

封装: -

库存3,728

ARM926EJ-S, NS9210

-

75MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

SOMDM3730-20-1880AGIR

Logic

SYSTEM ON MODULE TORP

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 800MHz
Flash Size: 512MB
RAM Size: 512MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,452

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

800MHz

512MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.06" (15mm x 27mm)

-40°C ~ 85°C

DC-ME-01T-STL-1

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存3,200

-

XP3002000-01R

Lantronix, Inc.

XPORT AR EXTENDED TEMP -40 TO 85

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,768

-

TE0808-05-BBE81-AK

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

TE0715-05-21C33-A

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ Z-70

Module/Board Type: MPU Core
Core Processor: Zynq™ XC7Z012S-1CLG485C
Co-Processor: ARM Cortex-A9
Speed: 766MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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Zynq™ XC7Z012S-1CLG485C

ARM Cortex-A9

766MHz

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

DG8065101274708

Intel

INTEL ATOM PROCESSOR Z2560

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

TE0808-05-6BE81-L

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

TE0820-05-4BI21PL

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 64GB eMMC, 128MB QSPI
RAM Size: 2GB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

64GB eMMC, 128MB QSPI

2GB

-

TE0820-05-2AI81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

SOMDM3730-11-2783IFCR-A

Beacon EmbeddedWorks

SYSTEM ON MODULE LV DM3730

Module/Board Type: MPU, DSP Core
Core Processor: ARM® Cortex®-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 1GHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 1.230" L x 3.010" W (31.20mm x 76.50mm)
Operating Temperature: 0°C ~ 70°C

封装: -

Request a Quote

ARM® Cortex®-A8, DM3730

TMS320C64x (DSP)

1GHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

1.230" L x 3.010" W (31.20mm x 76.50mm)

0°C ~ 70°C

TE0724-04-41I32-A

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ XC7Z

Module/Board Type: MPU Core
Core Processor: Zynq™ XC7Z010-1CLG400I
Co-Processor: ARM Cortex-A9
Speed: 667MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: 1 x 160 Pin
Size / Dimension: 2.362" L x 1.575" W (60.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Zynq™ XC7Z010-1CLG400I

ARM Cortex-A9

667MHz

32MB

1GB

1 x 160 Pin

2.362" L x 1.575" W (60.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU9-7EG-2E-D11E-L13-R2-1

Enclustra FPGA Solutions

SOM XU9 ZYNQ 7EG REV2.1

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

2EC-VA-MPEG2-8B-30-1080-MD00C-A200T

System-On-Chip (SOC) Technologies Inc.

MOD MPEG2 ENC 30FPS 1080 SODIMM

Module/Board Type: DSP, FPGA Core
Core Processor: -
Co-Processor: Xilinx Artix-7 XC7A200T
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: SO-DIMM
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-

Xilinx Artix-7 XC7A200T

-

32MB

512MB

SO-DIMM

-

5749-PM-4AA-RI

Critical Link LLC

TEXAS INSTRUMENTS AM5749 SOM WIT

Module/Board Type: MPU, FPGA Core
Core Processor: ARM Cortex-A15
Co-Processor: Artix-7
Speed: 1.5GHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Edge Connector - 310, Board-to-Board (BTB) - 100
Size / Dimension: 3.460" L x 2.730" W (87.88mm x 69.34mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6

ARM Cortex-A15

Artix-7

1.5GHz

32MB

1GB

Edge Connector - 310, Board-to-Board (BTB) - 100

3.460" L x 2.730" W (87.88mm x 69.34mm)

-40°C ~ 85°C