页 24 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-WMX-LB69-EYK	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存2,864	-	-	-	-	-	-	-	-
CC-MX-KD47-ZM	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存4,256	-	-	-	-	-	-	-	-
CC-9C-V237-Z6	Digi International	MODULE 9C 64MB SDRAM 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 128MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存3,280	ARM926EJ-S, NS9360	-	155MHz	128MB	64MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
CC-9C-V226-Z6	Digi International	MODULE 9C 32MB SDRAM 64MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 64MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,688	ARM926EJ-S, NS9360	-	155MHz	64MB	32MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
20-101-0078	Digi International	CORE MODULE CM7130 Module/Board Type: MPU Core Core Processor: Z180 Co-Processor: - Speed: 9.216MHz Flash Size: - RAM Size: 32KB Connector Type: 40 Pin Header Size / Dimension: 1.8" x 2.05" (46mm x 52mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存5,152	Z180	-	9.216MHz	-	32KB	40 Pin Header	1.8" x 2.05" (46mm x 52mm)	-40°C ~ 70°C
SOMXC6748-10-1602AHCR	Logic	SYSTEM ON MODULE LV TMS320C6748 Module/Board Type: DSP Core Core Processor: TMS320C6748 Co-Processor: - Speed: 375MHz Flash Size: 8MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 300 Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,712	TMS320C6748	-	375MHz	8MB	128MB	Board-to-Board (BTB) Socket - 300	1.18" x 1.57" (30mm x 40mm)	0°C ~ 70°C
CENGPXA270-312-10-440EC	Logic	CARD ENGINE 32MB FLASH 32MB RAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 312MHz Flash Size: 64MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存2,304	PXA270	-	312MHz	64MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGLH75401-11-101HC	Logic	CARD ENGINE 2MB SRAM Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存7,472	-	-	-	-	-	-	-	-
CC-9U-T724-Z1-B	Digi International	MODULE 9U 32MB SDRAM 16MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存6,704	-	-	-	-	-	-	-	-
TE0320-00-EV02B	Trenz Electronic GmbH	SOM SPARTAN-3A 3400K 1333MB DDR Module/Board Type: FPGA, USB Core Core Processor: Spartan-3A DSP Co-Processor: Cypress EZ-USB FX2LP Speed: 100MHz Flash Size: 4MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 2.7" x 1.9" (68mm x 48mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存7,472	Spartan-3A DSP	Cypress EZ-USB FX2LP	100MHz	4MB	128MB	B2B	2.7" x 1.9" (68mm x 48mm)	0°C ~ 70°C
20-101-0672	Digi International	MODULE RABBITCORE RCM3600 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: IDC Header 2x20 Size / Dimension: 1.23" x 2.11" (31mm x 54mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,104	Rabbit 3000	-	22.1MHz	512KB	512KB	IDC Header 2x20	1.23" x 2.11" (31mm x 54mm)	-40°C ~ 85°C
100-1218-1	Bluetechnix GmbH	MODULE ECM-BF609-C-I-Q25S256F8 Module/Board Type: MPU Core Core Processor: ADSP-BF609 (Dual Core) Co-Processor: - Speed: 500MHz x 2 Flash Size: 8MB RAM Size: 256KB Connector Type: Expansion 2 x 100 Size / Dimension: 1.73" x 1.3" (44mm x 33mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,872	ADSP-BF609 (Dual Core)	-	500MHz x 2	8MB	256KB	Expansion 2 x 100	1.73" x 1.3" (44mm x 33mm)	-40°C ~ 85°C
SOMC6748-10-1602AHCR	Logic	SYSTEM ON MODULE TMS320C6748 Module/Board Type: DSP Core Core Processor: TMS320C6748 Co-Processor: - Speed: 300MHz Flash Size: 8MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,472	TMS320C6748	-	300MHz	8MB	128MB	Board-to-Board (BTB) Socket - 200	1.18" x 1.57" (30mm x 40mm)	0°C ~ 70°C
20-101-0434	Digi International	MODULE RABBITCORE RCM2100 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 2" x 3.5" (51mm x 89mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存6,900	Rabbit 2000	-	22.1MHz	512KB	512KB	2 IDC Headers 2x20	2" x 3.5" (51mm x 89mm)	-40°C ~ 70°C
TE0803-02-03CG-1EA	Trenz Electronic GmbH	MODULE SOM TE0803-02 Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: -	封装: -	库存5,744	-	-	-	-	-	B2B	2.05" x 2.99" (52mm x 76mm)	-
TE0803-02-03EG-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封装: -	库存2,768	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0808-04-06EG-1EE	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 4GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封装: -	库存6,480	Zynq UltraScale+ XCZU6EG-1FFVC900E	-	-	128MB	4GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0813-01-4DE11-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU4EV-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
EC-VA-H264-10B-60-1080-OPVXC-0000	System-On-Chip (SOC) Technologies Inc.	ENCODER H264 HD VID/AUD 10BIT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0782-02-82I33MA	Trenz Electronic GmbH	IC MODULE CORTEX Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Board-to-Board (BTB) Socket	3.350" L x 3.350" W (85.00mm x 85.00mm)	-40°C ~ 85°C
TE0818-01-BBE21-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU15EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
ME-XU7-6EG-1I-D11E-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU7 US+ ZU6EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I Speed: - Flash Size: 16GB RAM Size: 2GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I	-	16GB	2GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
CC-MX-ZC6D-Z1	Digi	CC 93 SOM SINGLE-CORE ETHERNET Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Co-Processor: - Speed: 250MHz, 1.7GHz Flash Size: 8GB RAM Size: 512MB Connector Type: - Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A55, ARM® Cortex®-M33	-	250MHz, 1.7GHz	8GB	512MB	-	1.770" L x 1.570" W (45.00mm x 40.00mm)	-40°C ~ 85°C
FORLINX-FETA40I-C-121GSE8GEA12	Forlinx Embedded	Allwinner A40iSOM,1GB DDR3,8GB e Module/Board Type: MPU Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 1.2GHz Flash Size: 8GB eMMC RAM Size: 1GB Connector Type: Board-to-Board (BTB) 4 x 80 Pin Size / Dimension: 2.700" L x 1.772" W (68.00mm x 45.00mm) Operating Temperature: -25°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A7	-	1.2GHz	8GB eMMC	1GB	Board-to-Board (BTB) 4 x 80 Pin	2.700" L x 1.772" W (68.00mm x 45.00mm)	-25°C ~ 85°C
TE0820-05-2BE21ML	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
FORLINX-FETMX8MPQ-C-164GOE16-16G-IA10	Forlinx Embedded	NXP i.MX8M PlusSOM,4G LPDDR4, 16 Module/Board Type: MPU Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Co-Processor: - Speed: 1.6GHz Flash Size: 16GB eMMC, 16MB (NOR) RAM Size: 4GB Connector Type: Board-to-Board (BTB) 4 x 80 Pin Size / Dimension: 2.441" L x 0.118" W (62.00mm x 32.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-M7	-	1.6GHz	16GB eMMC, 16MB (NOR)	4GB	Board-to-Board (BTB) 4 x 80 Pin	2.441" L x 0.118" W (62.00mm x 32.00mm)	-40°C ~ 85°C
TE0720-04-62I33MA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: Ethernet Core Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A9	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU8-5EV-1I-D12E-R2-1	Enclustra FPGA Solutions	SOM ZYNQ XU8 US+ ZU5EV Module/Board Type: FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0808-04-9GI21-AS	Trenz Electronic GmbH	STARTER KIT ZYNQ USCALE+ ZU9 FPG Module/Board Type: FPGA Core Core Processor: Zynq UltraScale+ ZU9 Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ ZU9	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0723-03-11C64-A	Trenz Electronic GmbH	IC MOD CORTEX-A9 766MHZ 512MB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-

CC-WMX-LB69-EYK

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存2,864

-

CC-MX-KD47-ZM

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存4,256

-

CC-9C-V237-Z6

Digi International

MODULE 9C 64MB SDRAM 128MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 128MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存3,280

ARM926EJ-S, NS9360

-

155MHz

128MB

64MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

CC-9C-V226-Z6

Digi International

MODULE 9C 32MB SDRAM 64MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 64MB
RAM Size: 32MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,688

ARM926EJ-S, NS9360

-

155MHz

64MB

32MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

20-101-0078

Digi International

CORE MODULE CM7130

Module/Board Type: MPU Core
Core Processor: Z180
Co-Processor: -
Speed: 9.216MHz
Flash Size: -
RAM Size: 32KB
Connector Type: 40 Pin Header
Size / Dimension: 1.8" x 2.05" (46mm x 52mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存5,152

Z180

-

9.216MHz

-

32KB

40 Pin Header

1.8" x 2.05" (46mm x 52mm)

-40°C ~ 70°C

SOMXC6748-10-1602AHCR

Logic

SYSTEM ON MODULE LV TMS320C6748

Module/Board Type: DSP Core
Core Processor: TMS320C6748
Co-Processor: -
Speed: 375MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 300
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,712

TMS320C6748

-

375MHz

8MB

128MB

Board-to-Board (BTB) Socket - 300

1.18" x 1.57" (30mm x 40mm)

0°C ~ 70°C

CENGPXA270-312-10-440EC

Logic

CARD ENGINE 32MB FLASH 32MB RAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 312MHz
Flash Size: 64MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存2,304

PXA270

-

312MHz

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CENGLH75401-11-101HC

Logic

CARD ENGINE 2MB SRAM

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存7,472

-

CC-9U-T724-Z1-B

Digi International

MODULE 9U 32MB SDRAM 16MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存6,704

-

TE0320-00-EV02B

Trenz Electronic GmbH

SOM SPARTAN-3A 3400K 1333MB DDR

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-3A DSP
Co-Processor: Cypress EZ-USB FX2LP
Speed: 100MHz
Flash Size: 4MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 2.7" x 1.9" (68mm x 48mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存7,472

Spartan-3A DSP

Cypress EZ-USB FX2LP

100MHz

4MB

128MB

B2B

2.7" x 1.9" (68mm x 48mm)

0°C ~ 70°C

20-101-0672

Digi International

MODULE RABBITCORE RCM3600

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.23" x 2.11" (31mm x 54mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,104

Rabbit 3000

-

22.1MHz

512KB

IDC Header 2x20

1.23" x 2.11" (31mm x 54mm)

-40°C ~ 85°C

100-1218-1

Bluetechnix GmbH

MODULE ECM-BF609-C-I-Q25S256F8

Module/Board Type: MPU Core
Core Processor: ADSP-BF609 (Dual Core)
Co-Processor: -
Speed: 500MHz x 2
Flash Size: 8MB
RAM Size: 256KB
Connector Type: Expansion 2 x 100
Size / Dimension: 1.73" x 1.3" (44mm x 33mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,872

ADSP-BF609 (Dual Core)

-

500MHz x 2

8MB

256KB

Expansion 2 x 100

1.73" x 1.3" (44mm x 33mm)

-40°C ~ 85°C

SOMC6748-10-1602AHCR

Logic

SYSTEM ON MODULE TMS320C6748

Module/Board Type: DSP Core
Core Processor: TMS320C6748
Co-Processor: -
Speed: 300MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,472

TMS320C6748

-

300MHz

8MB

128MB

Board-to-Board (BTB) Socket - 200

1.18" x 1.57" (30mm x 40mm)

0°C ~ 70°C

20-101-0434

Digi International

MODULE RABBITCORE RCM2100

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 2" x 3.5" (51mm x 89mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存6,900

Rabbit 2000

-

22.1MHz

512KB

2 IDC Headers 2x20

2" x 3.5" (51mm x 89mm)

-40°C ~ 70°C

TE0803-02-03CG-1EA

Trenz Electronic GmbH

MODULE SOM TE0803-02

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: -

封装: -

库存5,744

-

B2B

2.05" x 2.99" (52mm x 76mm)

-

TE0803-02-03EG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封装: -

库存2,768

Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0808-04-06EG-1EE

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封装: -

库存6,480

Zynq UltraScale+ XCZU6EG-1FFVC900E

-

128MB

4GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0813-01-4DE11-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

2GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

EC-VA-H264-10B-60-1080-OPVXC-0000

System-On-Chip (SOC) Technologies Inc.

ENCODER H264 HD VID/AUD 10BIT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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-

TE0782-02-82I33MA

Trenz Electronic GmbH

IC MODULE CORTEX

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM Cortex-A9

Zynq-7000 (Z-7035)

-

32MB

1GB

Board-to-Board (BTB) Socket

3.350" L x 3.350" W (85.00mm x 85.00mm)

-40°C ~ 85°C

TE0818-01-BBE21-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU15EG-1FFVC900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

ME-XU7-6EG-1I-D11E-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU7 US+ ZU6EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I
Speed: -
Flash Size: 16GB
RAM Size: 2GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900I

-

16GB

2GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

CC-MX-ZC6D-Z1

Digi

CC 93 SOM SINGLE-CORE ETHERNET

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Co-Processor: -
Speed: 250MHz, 1.7GHz
Flash Size: 8GB
RAM Size: 512MB
Connector Type: -
Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A55, ARM® Cortex®-M33

-

250MHz, 1.7GHz

8GB

512MB

-

1.770" L x 1.570" W (45.00mm x 40.00mm)

-40°C ~ 85°C

FORLINX-FETA40I-C-121GSE8GEA12

Forlinx Embedded

Allwinner A40iSOM,1GB DDR3,8GB e

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 1.2GHz
Flash Size: 8GB eMMC
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) 4 x 80 Pin
Size / Dimension: 2.700" L x 1.772" W (68.00mm x 45.00mm)
Operating Temperature: -25°C ~ 85°C

封装: -

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ARM® Cortex®-A7

-

1.2GHz

8GB eMMC

1GB

Board-to-Board (BTB) 4 x 80 Pin

2.700" L x 1.772" W (68.00mm x 45.00mm)

-25°C ~ 85°C

TE0820-05-2BE21ML

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

FORLINX-FETMX8MPQ-C-164GOE16-16G-IA10

Forlinx Embedded

NXP i.MX8M PlusSOM,4G LPDDR4, 16

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Co-Processor: -
Speed: 1.6GHz
Flash Size: 16GB eMMC, 16MB (NOR)
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) 4 x 80 Pin
Size / Dimension: 2.441" L x 0.118" W (62.00mm x 32.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-M7

-

1.6GHz

16GB eMMC, 16MB (NOR)

4GB

Board-to-Board (BTB) 4 x 80 Pin

2.441" L x 0.118" W (62.00mm x 32.00mm)

-40°C ~ 85°C

TE0720-04-62I33MA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: Ethernet Core
Core Processor: ARM® Cortex®-A9
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A9

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU8-5EV-1I-D12E-R2-1

Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU5EV

Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0808-04-9GI21-AS

Trenz Electronic GmbH

STARTER KIT ZYNQ USCALE+ ZU9 FPG

Module/Board Type: FPGA Core
Core Processor: Zynq UltraScale+ ZU9
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Zynq UltraScale+ ZU9

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0723-03-11C64-A

Trenz Electronic GmbH

IC MOD CORTEX-A9 766MHZ 512MB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

Request a Quote

-