页 19 - 嵌入式 - 微控制器，微处理器，FPGA 模块 | 集成电路（IC）

零件编号	制造商	描述	封装	库存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-KD47-ZM-B	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存5,568	-	-	-	-	-	-	-	-
DLP-2232H-SF	DLP Design Inc.	MOD USB-MCU/FPGA W/FT2232H Module/Board Type: MCU/FPGA, USB Core Core Processor: SmartFusion, A2F200M3F Co-Processor: FT2232H Speed: 100MHz Flash Size: 256KB RAM Size: 64KB (Internal), 4MB (External) Connector Type: USB - B, Pin Header Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,584	SmartFusion, A2F200M3F	FT2232H	100MHz	256KB	64KB (Internal), 4MB (External)	USB - B, Pin Header	3" x 1.2" (76.2mm x 30.5mm)	0°C ~ 70°C
20-101-1087	Digi International	BOARD PROTO RCM3365 RS232 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存3,600	-	-	-	-	-	-	-	-
101-1067	Digi International	MODULE RABBITCORE RCM3305 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 8MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存5,904	Rabbit 3000	-	44.2MHz	512KB (Internal), 8MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
CENGLH7A404-11-504HCR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存5,696	ARM922T, LH7A404	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
FS-3004	Digi International	MODULE 64MB SDRAM 64MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	库存4,960	-	-	-	-	-	-	-	-
MOD5272-100	NetBurner Inc.	PROCESSOR MODULE FLASH Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5272 Co-Processor: - Speed: 62MHz Flash Size: 2MB RAM Size: 8.004MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	封装: -	库存4,944	ColdFire 5272	-	62MHz	2MB	8.004MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	0°C ~ 70°C
CC-9M-NA26-Z1-B	Digi International	MOD 9M 32MB SDRAM 64MB FLSH 25PK Module/Board Type: MPU Core Core Processor: ARM920T, SC2443 Co-Processor: - Speed: 533MHz Flash Size: 64MB RAM Size: 32KB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.36" x 1.73" (60mm x 44mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存6,656	ARM920T, SC2443	-	533MHz	64MB	32KB	Board-to-Board (BTB) Socket - 240	2.36" x 1.73" (60mm x 44mm)	-40°C ~ 85°C
CC-MX-LD79-ZK	Digi International	MODULE I.MX53 800MHZ 512MB FLASH Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, i.MX53 Co-Processor: - Speed: 800MHz Flash Size: 512MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 360 Size / Dimension: 3.23" x 1.97" (82mm x 50mm Operating Temperature: -20°C ~ 85°C	封装: -	库存7,776	ARM? Cortex?-A8, i.MX53	-	800MHz	512MB	1GB	Board-to-Board (BTB) Socket - 360	3.23" x 1.97" (82mm x 50mm	-20°C ~ 85°C
CC-9P-V513-LX	Digi International	MODULE 9P 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 8MB RAM Size: 16MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存5,616	ARM926EJ-S, NS9215	-	150MHz	8MB	16MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
DC-ME-Y402-LX	Digi International	ME 9210 8MB RAM 4MB FLASH LINUX Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	封装: -	库存7,728	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
DC-ME4-01T-C-10	Digi International	ME 8MB SDRAM 4MB FLASH 10 PAK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存7,552	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
SOMOMAPL138-10-1602QHIR	Logic	SYSTEM ON MODULE LV OMAPL138 Module/Board Type: MPU, DSP Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C6748 Speed: 375MHz Flash Size: 8MB RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 300 Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存8,976	ARM926EJ-S, OMAP-L138	TMS320C6748	375MHz	8MB	128MB	Board-to-Board (BTB) Socket - 300	1.18" x 1.57" (30mm x 40mm)	-40°C ~ 85°C
20-101-1067	Digi International	MODULE RABBITCORE RCM3305 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 8MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封装: -	库存6,368	Rabbit 3000	-	44.2MHz	512KB (Internal), 8MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
TE0820-03-04CG-1ED	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 85°C	封装: -	库存5,632	Zynq UltraScale+ XCZU4CG-1SFVC784E	-	-	128MB	2GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 85°C
TE0600-03-52I11-M	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Core Processor: Spartan-6 LX-45 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Spartan-6 LX-45	-	125MHz	16MB	256MB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
AM0010-02-3BI21MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ ZU3EG-1I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Zynq™ UltraScale+™ ZU3EG-1I	-	-	128MB	4GB	Board-to-Board (BTB) Socket	2.205" L x 1.575" W (56.00mm x 40.00mm)	-40°C ~ 85°C
TE0820-05-4DE21MA	Trenz Electronic GmbH	MOD MPSOC ZU4EV-1E 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0820-04-40121MA	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	-	-	-	-	-	-	-	-
TE0710-03-42C21-A	Trenz Electronic GmbH	IC MOD ARTIX-7 A35T 100MHZ 512MB Module/Board Type: FPGA Core Processor: Artix™ 7 XC7A35T-2CSG324C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	Artix™ 7 XC7A35T-2CSG324C	-	-	32MB	512MB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
20-109-0198	Digi	20-109-0198 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: Header Size / Dimension: 3.860" L x 2.010" W (98.00mm x 51.00mm) Operating Temperature: -40°C ~ 70°C	封装: -	Request a Quote	Rabbit 2000	-	22.1MHz	512KB	512KB	Header	3.860" L x 2.010" W (98.00mm x 51.00mm)	-40°C ~ 70°C
DC-VA-H264-10B-60-4K-MD00C-SX660	System-On-Chip (SOC) Technologies Inc.	MOD H264 DE 60FPS 4K SX660 SODIM Module/Board Type: FPGA Core Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Co-Processor: - Speed: 1.5GHz Flash Size: 128KB RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	封装: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	1.5GHz	128KB	512MB	-	-	-
SOMIMX8MNS-10-29C0DMCR	Beacon EmbeddedWorks	IC MOD I.MX 8M NANO SOLO 1GB Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex™-M7 Co-Processor: - Speed: 1.5GHz, 750MHz Flash Size: 8GB RAM Size: 1GB Connector Type: 3 x 100 Pins HD Connectors Size / Dimension: 1.100" L x 1.500" W (28.00mm x 38.00mm) Operating Temperature: 0°C ~ 70°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex™-M7	-	1.5GHz, 750MHz	8GB	1GB	3 x 100 Pins HD Connectors	1.100" L x 1.500" W (28.00mm x 38.00mm)	0°C ~ 70°C
TE0820-05-2AI21MA	Trenz Electronic GmbH	MOD MPSOC ZU2CG-1I 2GB DDR4 IN Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	库存36	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ATSAMA5D27-WLSOM1	Microchip Technology	SAMA5D2 WIRELESS SOM Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A5 Co-Processor: - Speed: 500MHz Flash Size: 8MB RAM Size: 256MB Connector Type: Edge Connector Size / Dimension: 1.610" L x 1.610" W (40.80mm x 40.80mm) Operating Temperature: -40°C ~ 85°C (TA)	封装: -	库存72	ARM® Cortex®-A5	-	500MHz	8MB	256MB	Edge Connector	1.610" L x 1.610" W (40.80mm x 40.80mm)	-40°C ~ 85°C (TA)
XP1001000-05R-AP	Lantronix, Inc.	XPORT 05R, BULK, ASIA PAC, ROHS Module/Board Type: Ethernet Core Core Processor: DSTni-EX Co-Processor: - Speed: 25MHz Flash Size: 512KB RAM Size: 256KB Connector Type: RJ-45 Size / Dimension: 1.330" L x 0.640" W (33.90mm x 16.25mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	DSTni-EX	-	25MHz	512KB	256KB	RJ-45	1.330" L x 0.640" W (33.90mm x 16.25mm)	-40°C ~ 85°C
TE0808-05-BBE21-AK	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Zynq UltraScale+ XCZU15EG-1FFVC900E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 160	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
ME-CA1-115-7I-D8-R6-1	Enclustra FPGA Solutions	ME-CA1-115-7I-D8-R6.1 Module/Board Type: MPU Core Core Processor: Intel Cyclone IV Co-Processor: EP4CE115F23I7N Speed: 260MHz Flash Size: 16MB RAM Size: 256MB Connector Type: 168 Pin Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封装: -	Request a Quote	Intel Cyclone IV	EP4CE115F23I7N	260MHz	16MB	256MB	168 Pin	2.200" L x 2.130" W (56.00mm x 54.00mm)	-40°C ~ 85°C
TE0813-01-4BE11-A	Trenz Electronic GmbH	MODULE MPSOC 4GB DDR4 Module/Board Type: FPGA Core Core Processor: Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E	-	-	128MB	2GB	Board-to-Board (BTB) Socket	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
ME-XU8-7EV-1E-D11E-R2-2	Enclustra FPGA Solutions	SOM ZYNQ XU8 US+ ZU7EV Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	封装: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C

CC-MX-KD47-ZM-B

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存5,568

-

DLP-2232H-SF

DLP Design Inc.

MOD USB-MCU/FPGA W/FT2232H

Module/Board Type: MCU/FPGA, USB Core
Core Processor: SmartFusion, A2F200M3F
Co-Processor: FT2232H
Speed: 100MHz
Flash Size: 256KB
RAM Size: 64KB (Internal), 4MB (External)
Connector Type: USB - B, Pin Header
Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,584

SmartFusion, A2F200M3F

FT2232H

100MHz

256KB

64KB (Internal), 4MB (External)

USB - B, Pin Header

3" x 1.2" (76.2mm x 30.5mm)

0°C ~ 70°C

20-101-1087

Digi International

BOARD PROTO RCM3365 RS232

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存3,600

-

101-1067

Digi International

MODULE RABBITCORE RCM3305

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 8MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存5,904

Rabbit 3000

-

44.2MHz

512KB (Internal), 8MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

CENGLH7A404-11-504HCR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存5,696

ARM922T, LH7A404

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

FS-3004

Digi International

MODULE 64MB SDRAM 64MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

库存4,960

-

MOD5272-100

NetBurner Inc.

PROCESSOR MODULE FLASH

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5272
Co-Processor: -
Speed: 62MHz
Flash Size: 2MB
RAM Size: 8.004MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

封装: -

库存4,944

ColdFire 5272

-

62MHz

2MB

8.004MB

RJ-45, 2x50 Header

2.6" x 2" (66.04mm x 50.8mm)

0°C ~ 70°C

CC-9M-NA26-Z1-B

Digi International

MOD 9M 32MB SDRAM 64MB FLSH 25PK

Module/Board Type: MPU Core
Core Processor: ARM920T, SC2443
Co-Processor: -
Speed: 533MHz
Flash Size: 64MB
RAM Size: 32KB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.36" x 1.73" (60mm x 44mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存6,656

ARM920T, SC2443

-

533MHz

64MB

32KB

Board-to-Board (BTB) Socket - 240

2.36" x 1.73" (60mm x 44mm)

-40°C ~ 85°C

CC-MX-LD79-ZK

Digi International

MODULE I.MX53 800MHZ 512MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, i.MX53
Co-Processor: -
Speed: 800MHz
Flash Size: 512MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 360
Size / Dimension: 3.23" x 1.97" (82mm x 50mm
Operating Temperature: -20°C ~ 85°C

封装: -

库存7,776

ARM? Cortex?-A8, i.MX53

-

800MHz

512MB

1GB

Board-to-Board (BTB) Socket - 360

3.23" x 1.97" (82mm x 50mm

-20°C ~ 85°C

CC-9P-V513-LX

Digi International

MODULE 9P 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 8MB
RAM Size: 16MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存5,616

ARM926EJ-S, NS9215

-

150MHz

8MB

16MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

DC-ME-Y402-LX

Digi International

ME 9210 8MB RAM 4MB FLASH LINUX

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

封装: -

库存7,728

ARM926EJ-S, NS9210

-

75MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

DC-ME4-01T-C-10

Digi International

ME 8MB SDRAM 4MB FLASH 10 PAK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存7,552

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

SOMOMAPL138-10-1602QHIR

Logic

SYSTEM ON MODULE LV OMAPL138

Module/Board Type: MPU, DSP Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C6748
Speed: 375MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 300
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存8,976

ARM926EJ-S, OMAP-L138

TMS320C6748

375MHz

8MB

128MB

Board-to-Board (BTB) Socket - 300

1.18" x 1.57" (30mm x 40mm)

-40°C ~ 85°C

20-101-1067

Digi International

MODULE RABBITCORE RCM3305

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 8MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封装: -

库存6,368

Rabbit 3000

-

44.2MHz

512KB (Internal), 8MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

TE0820-03-04CG-1ED

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 85°C

封装: -

库存5,632

Zynq UltraScale+ XCZU4CG-1SFVC784E

-

128MB

2GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 85°C

TE0600-03-52I11-M

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA Core
Core Processor: Spartan-6 LX-45
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Spartan-6 LX-45

-

125MHz

16MB

256MB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

AM0010-02-3BI21MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ ZU3EG-1I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.205" L x 1.575" W (56.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Zynq™ UltraScale+™ ZU3EG-1I

-

128MB

4GB

Board-to-Board (BTB) Socket

2.205" L x 1.575" W (56.00mm x 40.00mm)

-40°C ~ 85°C

TE0820-05-4DE21MA

Trenz Electronic GmbH

MOD MPSOC ZU4EV-1E 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0820-04-40121MA

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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-

TE0710-03-42C21-A

Trenz Electronic GmbH

IC MOD ARTIX-7 A35T 100MHZ 512MB

Module/Board Type: FPGA
Core Processor: Artix™ 7 XC7A35T-2CSG324C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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Artix™ 7 XC7A35T-2CSG324C

-

32MB

512MB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

20-109-0198

Digi

20-109-0198

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: Header
Size / Dimension: 3.860" L x 2.010" W (98.00mm x 51.00mm)
Operating Temperature: -40°C ~ 70°C

封装: -

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Rabbit 2000

-

22.1MHz

512KB

Header

3.860" L x 2.010" W (98.00mm x 51.00mm)

-40°C ~ 70°C

DC-VA-H264-10B-60-4K-MD00C-SX660

System-On-Chip (SOC) Technologies Inc.

MOD H264 DE 60FPS 4K SX660 SODIM

Module/Board Type: FPGA Core
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Co-Processor: -
Speed: 1.5GHz
Flash Size: 128KB
RAM Size: 512MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封装: -

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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

1.5GHz

128KB

512MB

-

SOMIMX8MNS-10-29C0DMCR

Beacon EmbeddedWorks

IC MOD I.MX 8M NANO SOLO 1GB

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex™-M7
Co-Processor: -
Speed: 1.5GHz, 750MHz
Flash Size: 8GB
RAM Size: 1GB
Connector Type: 3 x 100 Pins HD Connectors
Size / Dimension: 1.100" L x 1.500" W (28.00mm x 38.00mm)
Operating Temperature: 0°C ~ 70°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex™-M7

-

1.5GHz, 750MHz

8GB

1GB

3 x 100 Pins HD Connectors

1.100" L x 1.500" W (28.00mm x 38.00mm)

0°C ~ 70°C

TE0820-05-2AI21MA

Trenz Electronic GmbH

MOD MPSOC ZU2CG-1I 2GB DDR4 IN

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

库存36

ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ATSAMA5D27-WLSOM1

Microchip Technology

SAMA5D2 WIRELESS SOM

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A5
Co-Processor: -
Speed: 500MHz
Flash Size: 8MB
RAM Size: 256MB
Connector Type: Edge Connector
Size / Dimension: 1.610" L x 1.610" W (40.80mm x 40.80mm)
Operating Temperature: -40°C ~ 85°C (TA)

封装: -

库存72

ARM® Cortex®-A5

-

500MHz

8MB

256MB

Edge Connector

1.610" L x 1.610" W (40.80mm x 40.80mm)

-40°C ~ 85°C (TA)

XP1001000-05R-AP

Lantronix, Inc.

XPORT 05R, BULK, ASIA PAC, ROHS

Module/Board Type: Ethernet Core
Core Processor: DSTni-EX
Co-Processor: -
Speed: 25MHz
Flash Size: 512KB
RAM Size: 256KB
Connector Type: RJ-45
Size / Dimension: 1.330" L x 0.640" W (33.90mm x 16.25mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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DSTni-EX

-

25MHz

512KB

256KB

RJ-45

1.330" L x 0.640" W (33.90mm x 16.25mm)

-40°C ~ 85°C

TE0808-05-BBE21-AK

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Zynq UltraScale+ XCZU15EG-1FFVC900E

-

128MB

4GB

Board-to-Board (BTB) Socket - 160

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

ME-CA1-115-7I-D8-R6-1

Enclustra FPGA Solutions

ME-CA1-115-7I-D8-R6.1

Module/Board Type: MPU Core
Core Processor: Intel Cyclone IV
Co-Processor: EP4CE115F23I7N
Speed: 260MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: 168 Pin
Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封装: -

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Intel Cyclone IV

EP4CE115F23I7N

260MHz

16MB

256MB

168 Pin

2.200" L x 2.130" W (56.00mm x 54.00mm)

-40°C ~ 85°C

TE0813-01-4BE11-A

Trenz Electronic GmbH

MODULE MPSOC 4GB DDR4

Module/Board Type: FPGA Core
Core Processor: Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E

-

128MB

2GB

Board-to-Board (BTB) Socket

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

ME-XU8-7EV-1E-D11E-R2-2

Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU7EV

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

封装: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C